Display apparatus and method of manufacturing the same

1. A display apparatus comprising: an element substrate including a display portion formed by arraying a plurality of organic light emitting elements on a base and a connecting portion provided on the base so as to be separated from the display portion; a driving substrate connected to the connecting portion so as to be configured to drive the display portion; and a heat-insulating portion provided between the display portion and the connecting portion in planar view in the base and configured to have lower heat conductivity than the base.

2. The apparatus according to claim 1 , wherein the driving substrate is connected to the connecting portion via an anisotropic conductive film.

3. The apparatus according to claim 1 , wherein the driving substrate is connected to the connecting portion via an electrical connection bump.

4. The apparatus according to claim 1 , wherein the element substrate includes a through electrode provided as the connecting portion so as to penetrate the base.

5. The apparatus according to claim 1 , wherein the heat-insulating portion is provided so as to penetrate the base.

6. The apparatus according to claim 1 , wherein the element substrate further comprises a wiring layer that connects the base to the display portion, and the connecting portion includes an electrode pad flush with the wiring layer.

7. The apparatus according to claim 1 , wherein the connecting portion includes a plurality of electrode pads arrayed along an edge portion of the base, and the heat-insulating portion extends between the plurality of organic light emitting elements and the plurality of electrode pads along the edge portion so as not to overlap any of the plurality of organic light emitting elements and the plurality of electrode pads in planar view.

8. The apparatus according to claim 1 , wherein the base is formed from a semiconductor material.

9. The apparatus according to claim 1 , wherein the heat-insulating portion is formed from one of an organic material and an inorganic material.

10. The apparatus according to claim 1 , wherein the heat-insulating portion includes at least a cavity.

11. The apparatus according to claim 1 , wherein the element substrate further includes a reinforcing material provided so as to overlap the heat-insulating portion in planar view.

12. The apparatus according to claim 1 , further comprising a moisture-proof protective film provided at a boundary portion between the heat-insulating portion and the base.

13. The apparatus according to claim 1 , wherein the element substrate further comprises a moisture-proof protective film that covers the display portion.

14. The apparatus according to claim 1 , wherein the display portion and the connecting portion are arranged side by side in a first direction in planar view, and the heat-insulating portion is provided so as to overlap all of the plurality of organic light emitting elements in the first direction.

15. The apparatus according to claim 14 , wherein the heat-insulating portion is provided so as to overlap the entire driving substrate in the first direction.

16. A method of manufacturing a display apparatus including an element substrate including a display portion formed by arraying a plurality of organic light emitting elements and a connecting portion provided so as to be separated from the display portion and a driving substrate connected to the connecting portion so as to be configured to drive the display portion, the method comprising: forming the display portion and the connecting portion on a base; forming a heat-insulating portion for cutting off heat conduction between the display portion and the connecting portion by removing part of the base located between the display portion and the connecting portion in planar view; and connecting the driving substrate to the connecting portion.

17. The method according to claim 16 , wherein the forming the connecting portion includes forming an opening so as to penetrate the base and forming a through electrode as the connecting portion by filling the opening with a metal material, and the forming the opening and the removing the part of the base are performed by a common etching process.