FPC integrated capacitance switch and method of manufacturing the same

1. An FPC integrated capacitance switch, comprising: a transparent flexible substrate made of a resin film and including a sensor unit and a tail portion that extends from an edge of the sensor unit; a plurality of electrodes formed on a first main surface of the transparent flexible substrate and in the sensor unit; a plurality of first electrode wiring lines electrically connected to the plurality of electrodes and collectively formed to extend to the edge located adjacent to the tail portion; a plurality of second electrode wiring lines electrically connected to the plurality of first electrode wiring lines and formed in the tail portion to be arranged in parallel, the second electrode wiring lines being made of a photoresist including conductive particles; an electromagnetic shield formed, on a second main surface that is an opposite surface opposite to the first main surface of the transparent flexible substrate, overlapping in plan view a region including the plurality of electrodes; a pair of first electromagnetic shield wiring lines electrically connected to the electromagnetic shield and formed to extend to the edge located adjacent to the tail portion; a pair of second electromagnetic shield wiring lines electrically connected to the pair of first electromagnetic shield wiring lines and formed in the tail portion to be arranged in plan view outward of a region including the plurality of second electrode wiring lines, the second electromagnetic shield wiring lines being made of a photoresist including conductive particles; and an electromagnetic shield mask formed on the second main surface of the transparent flexible substrate and in the tail portion overlapping in plan view the region including the plurality of second electrode wiring lines, the electromagnetic shield mask including a light-shielding metal film.

2. The FPC integrated capacitance switch according to claim 1 , wherein the electromagnetic shield mask is divided into portions, and the pair of second electromagnetic shield wiring lines is separated and overlapping a surface of the divided portions of the electromagnetic shield mask, the surface is opposite to the transparent flexible substrate.

3. The FPC integrated capacitance switch according to claim 2 , wherein the electromagnetic shield mask is electrically connected to the pair of first electromagnetic shield wiring lines.

4. The FPC integrated capacitance switch according to claim 2 , wherein the electromagnetic shield mask is independent from the pair of first electromagnetic shield wiring lines.

5. The FPC integrated capacitance switch according to claim 1 , wherein the pair of second electromagnetic shield wiring lines is not overlapped with the electromagnetic shield mask, and a pair of electrode masks including a light-shielding metal film is further provided, the electrode masks being formed on the first main surface of the transparent flexible substrate and in the tail portion overlapping the pair of second electromagnetic shield wiring lines in plan view.

6. The FPC integrated capacitance switch according to claim 1 , wherein the sensor unit includes a view area and a frame area surrounding the view area, and the electrodes, the first electrode wiring lines, and the electromagnetic shield are transparent on the view area.

7. The FPC integrated capacitance switch according to claim 1 , wherein the conductive particles included in the second electrode wiring lines and the second electromagnetic shield wiring lines are any one of metallic powder, a particle formed by coating a surface of a core element with a conductive layer, carbon, and graphite.

8. The FPC integrated capacitance switch according to claim 1 , wherein the light-shielding metal film of the electromagnetic shield mask is made any one of copper, silver, tin, aluminum, and nickel.

9. A method of manufacturing the FPC integrated capacitance switch according to claim 1 , comprising: [1] a process of using a transparent flexible substrate raw material, made of resin film, includes, in a plane, a sensor unit and a tail portion extending from an edge of the sensor unit, and stacking a transparent conductive film, a light-shielding metal film, and a first photoresist in layers in the mentioned order on each of a first main surface of the transparent flexible substrate raw material and a second main surface which is an opposite surface of the first main surface; [2] a process of partially exposing, developing the first photoresist on the first main surface and patterning the first photoresist into the shape coinciding with the plurality of electrodes and the plurality of first electrode wiring lines, and partially exposing, developing the first photoresist on the second main surface and patterning the first photoresist into the shape coinciding with the electromagnetic shield, the pair of first electromagnetic shield wiring lines, and the electromagnetic shield mask; [3] a process of etching the transparent conductive film that is uncovered and the light-shielding metal film; [4] a process of stripping the first photoresist after etching; [5] a process of forming a second photoresist on each of the first main surface from which the first photoresist is stripped and the second main surface from which the first photoresist is stripped; [6] a process of partially exposing, developing the second photoresist on the first main surface and uncovering the light-shielding metal film in a view area, and partially exposing, developing the second photoresist on the second main surface and uncovering the electromagnetic shield; [7] a process of etching only the light-shielding metal film that is uncovered; [8] a process of stripping the second photoresist after etching; [9] a process of forming, on each of the first main surface from which the second photoresist is stripped and the second main surface from which the second photoresist is stripped, a third photoresist including conductive particles; [10] a process of partially exposing, developing the third photoresist on the first main surface and patterning the third photoresist into the shape of the plurality of second electrode wiring lines, and partially exposing, developing the third photoresist on the second main surface and patterning the third photoresist into the shape of the pair of second electromagnetic shield wiring lines; and [11] a process of finally punching the transparent flexible substrate raw material into the shape of a transparent flexible substrate including the sensor unit and the tail portion.

10. A method of manufacturing the FPC integrated capacitance switch according to claim 5 , comprising: [1] a process of using a transparent flexible substrate raw material, made of resin film, includes, in a plane, a sensor unit and a tail portion extending from an edge of the sensor unit, and stacking a transparent conductive film, a light-shielding metal film, and a first photoresist in layers in the mentioned order on each of a first main surface of the transparent flexible substrate raw material and a second main surface which is an opposite surface of the first main surface; [2] a process of partially exposing, developing the first photoresist on the first main surface and patterning the first photoresist into the shape coinciding with the plurality of electrodes, the plurality of first electrode wiring lines, and the pair of electrode masks, and partially exposing, developing the first photoresist on the second main surface and patterning the first photoresist into the shape coinciding with the electromagnetic shield, the pair of first electromagnetic shield wiring lines, and the electromagnetic shield mask; [3] a process of etching the transparent conductive film that is uncovered and the light-shielding metal film; [4] a process of stripping the first photoresist after etching; [5] a process of forming a second photoresist on each of the first main surface from which the first photoresist is stripped and the second main surface from which the first photoresist is stripped; [6] a process of partially exposing, developing the second photoresist on the first main surface and uncovering the light-shielding metal film in a view area, and partially exposing, developing the second photoresist on the second main surface and uncovering the electromagnetic shield; [7] a process of etching only the light-shielding metal film that is uncovered; [8] a process of stripping the second photoresist after etching; [9] a process of forming, on each of the first main surface from which the second photoresist is stripped and the second main surface from which the second photoresist is stripped, a third photoresist including conductive particles; [10] a process of partially exposing, developing the third photoresist on the first main surface patterning the third photoresist into the shape of the plurality of second electrode wiring lines, and partially exposing, developing the third photoresist on the second main surface and patterning the third photoresist into the shape of the pair of second electromagnetic shield wiring lines; and [11] a process of finally punching the transparent flexible substrate raw material into the shape of a transparent flexible substrate including the sensor unit and the tail portion.