A power-electronic metal-ceramic module (10) comprising a metal-ceramic substrate (12) made of a ceramic carrier (14) having a metal top and bottom ply (16, 18), which is joined on or in the metal top ply (16) and/or the metal bottom ply (18) with a metal layer (16, 18, 22, 23) forming a frame (24) for accommodating at least one electronic component (30) and at least one electronic component (30) accommodated in the frame (24).
Legal claims defining the scope of protection, as filed with the USPTO.
1. Method for producing a circuit board module with integrated power-electronic metal-ceramic module, comprising the following steps to form a first layer sequence: providing a circuit board base frame made of metal-laminated circuit board carrier material, the circuit board base frame including a first recess for accommodating a power-electronic metal-ceramic module; inserting the power-electronic metal-ceramic module into the first recess in the circuit board base frame, the power-electronic metal-ceramic module comprising a ceramic carrier having a metal top ply and a metal bottom ply and a frame including a second recess accommodating an electronic component, wherein the frame is formed in the metal top ply or the metal bottom ply, or wherein the frame is formed in a metal layer applied to the metal top ply or the metal bottom ply, respectively; applying insulation plies and at least one metal foil to form a top metal outer ply; compressing the first layer sequence in such a way that a liquefaction of the insulation plies occurs and liquid resin fills up gaps between the first recess and the power-electronic metal-ceramic module and gaps between the electronic component and the frame of the metal-ceramic module and subsequently curing the insulation plies; and producing through contacts and connecting the electronic component with the top metal outer ply.
2. Method according to claim 1 , and further comprising selecting a thickness of the metal layer forming the frame to substantially correspond to a thickness of the electronic component or selecting a depth of the frame to substantially correspond to a thickness of the electronic component.
3. Method according to claim 1 , wherein the power-electronic metal-ceramic module is made by the following steps to form a second layer sequence: providing the ceramic substrate having the metal top ply and the metal bottom ply; forming the frame to accommodate the electronic component; placing the electronic component in such a way that the electronic component is positioned in the frame, joining the second layer sequence.
4. Method according to claim 1 , and further comprising selecting a thickness of the circuit board base frame to substantially correspond to a thickness of the metal-ceramic substrate.
5. Method according to claim 1 , and further comprising selecting a thickness of a first insulation ply so that the thickness of the circuit board base frame is substantially equalized with a total height of the metal-ceramic module.
6. Method according to claim 1 , and further comprising selecting a thickness of the circuit board base frame to substantially correspond to a thickness of the metal-ceramic module.
7. Circuit board module, comprising: a circuit board base frame made of metal-laminated circuit board carrier material, the circuit board base frame including a first recess; a power-electronic metal-ceramic module disposed in the first recess; the power-electronic metal-ceramic module comprising a ceramic carrier having a metal top ply and a metal bottom ply, and a frame including a second recess accommodating an electronic component, wherein the frame is formed in the metal top ply or the metal bottom ply, or wherein the frame is formed in a metal layer applied to the metal top ply or the metal bottom ply, respectively; insulation layers to embed the power-electronic metal-ceramic module in the first recess of the circuit board base frame; a top metal outer ply; and through contacts to connect the electronic component with top metal outer ply.
8. Circuit board module according to claim 7 , wherein a thickness of the metal layer forming the frame substantially corresponds to a thickness of the electronic component or wherein a depth of the frame substantially corresponds to a thickness of the electronic component.
9. Circuit board module according to claim 7 , wherein a thickness of the circuit board base frame substantially corresponds to a thickness of the metal-ceramic substrate, or wherein a thickness of the circuit board base frame substantially corresponds to a thickness of the metal-ceramic module.
Cooperative Patent Classification codes for this invention. Click any code to explore related patents in that topic.
May 17, 2019
March 30, 2021
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