Patentable/Patents/US-11009763
US-11009763

Method and apparatus for mitigating adverse effects of bonding wire of external optical modulators

PublishedMay 18, 2021
Assigneenot available in USPTO data we have
Inventorsnot available in USPTO data we have
Technical Abstract

An optical transceiver including a submount, a Mach-Zehnder Modulator (MZM), bonding wires, and a low pass filter type matching network is provided. The MZM includes an input port and an output port and disposed on the submount. The bonding wires are coupled to the submount and the MZM. The low pass filter type matching network is coupled to the bonding wires and is configured to absorb inductance of the bonding wires at a high frequency.

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Patent Metadata

Filing Date

August 28, 2019

Publication Date

May 18, 2021

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