Substrate support, substrate processing apparatus, substrate processing system, and method of detecting erosion of adhesive in substrate support

1. A substrate support comprising: a base; an electrostatic chuck provided on the base; and an adhesive provided between an upper surface of the base and a lower surface of the electrostatic chuck, wherein the base, the adhesive, and the electrostatic chuck provide a supply path for supplying a heat transfer gas between the electrostatic chuck and a substrate placed on the electrostatic chuck, wherein the upper surface of the base defines one or more grooves, wherein the one or more grooves are further away from a center of the upper surface than the supply path within the upper surface of the base, wherein the adhesive is provided to cover an upper end opening of each of the one or more grooves, wherein the heat transfer gas or another gas is capable of being supplied to the one or more grooves via the supply path or a flow path different from the supply path, and wherein the substrate support further comprises a pressure sensor to measure a pressure in the one or more grooves.

2. The substrate support according to claim 1 , wherein a protective tape is provided between each of the one or more grooves and the adhesive to cover the upper end opening of each of the one or more grooves, and wherein the adhesive covers the protective tape.

3. The substrate support according to claim 1 , wherein the one or more grooves are a plurality of grooves, and extend in a radial direction with respect to the center of the upper surface of the base.

4. The substrate support according to claim 1 , wherein the one or more grooves have a ring shape, and extend in a circumferential direction around the center of the upper surface of the base.

5. The substrate support according to claim 1 , wherein the upper surface of the base defines a first groove that is a portion of the supply path and one or more second grooves that are the one or more grooves.

6. The substrate support according to claim 5 , wherein the one or more second grooves communicates with the first groove.

7. The substrate support according to claim 1 , wherein the one or more grooves are separated from the supply path.

8. A substrate processing apparatus comprising: a chamber; and the substrate support according to claim 1 configured to support a substrate in the chamber.

9. The substrate processing apparatus according to claim 8 that is a plasma processing apparatus.

10. The substrate processing apparatus according to claim 8 , further comprising: a gas source; a valve connected between the one or more grooves and the gas source; and a controller configured to control the valve, wherein the controller is configured to control the valve to close the valve in a state where the one or more grooves are filled with the gas from the gas source, and acquire a measured value of a pressure in the one or more grooves from the pressure sensor in a state where the valve is closed.

11. The substrate processing apparatus according to claim 10 , wherein the controller is configured to acquire a first measured value of the pressure in the one or more grooves in the state where the one or more grooves are filled with the gas from the gas source, and compare a second measured value, which is the measured value acquired from the pressure sensor in the state where the valve is closed, with the first measured value.

12. A substrate processing system comprising: the substrate processing apparatus according to claim 11 ; an orienter configured to acquire a position of a substrate therein; and a transfer device configured to transfer a substrate between the chamber and the orienter, wherein the upper surface of the base defines a first groove that is a portion of the supply path, and one or more second grooves that are the one or more grooves, and the one or more second grooves communicate with the first groove, and wherein the controller is configured to control the transfer device to transfer a substrate placed on the electrostatic chuck to the orienter in a case where it is determined that a gas leaks from the first groove or the one or more second grooves as a result of comparison between the first measured value and the second measured value, and determine whether or not an error in a position of the substrate disposed on the electrostatic chuck has occurred, based on the position of the substrate within the orienter acquired by the orienter.

13. A method of detecting erosion of an adhesive in the substrate support according to claim 1 , comprising: closing a valve in a state where one or more grooves of the substrate support are filled with a gas from a gas source, the valve being connected between the one or more grooves and the gas source, and acquiring a measured value of a pressure in the one or more grooves from the pressure sensor in a state where the valve is closed.

14. The method according to claim 13 , further comprising: acquiring a first measured value of the pressure in the one or more grooves in the state where the one or more grooves are filled with the gas from the gas source, and comparing a second measured value, which is the measured value acquired from the pressure sensor in the state where the valve is closed, with the first measured value.

15. The method according to claim 14 , wherein the upper surface of the base defines a first groove that is a portion of the supply path, and one or more second grooves that are the one or more grooves, and the one or more second grooves communicate with the first groove, the method further comprising: transferring the substrate placed on the electrostatic chuck to an orienter in a case where it is determined that the gas leaks from the first groove or the one or more second grooves as a result of comparison between the first measured value and the second measured value, and determining whether or not an error in a position of the substrate disposed on the electrostatic chuck has occurred, based on the position of the substrate within the orienter acquired by the orienter.