Embodiments of a semiconductor device and methods of forming thereof are provided herein. In some embodiments, a power semiconductor device may include a first layer having a first conductivity type; a second layer disposed atop the first layer, the second layer having the first conductivity type; a termination region formed in the second layer, the termination region having a second conductivity type opposite the first type; and an active region at least partially formed in the second layer, wherein the active region is disposed adjacent to the termination region proximate a first side of the termination region and wherein the second layer is at least partially disposed adjacent to the termination region proximate a second side of the termination region opposite the first side.
Legal claims defining the scope of protection, as filed with the USPTO.
1. A method for forming a semiconductor device, comprising: forming a first layer having a first conductivity type atop a substrate; forming a second layer having the first conductivity type atop the first layer via a blanket fabrication process, wherein an average dopant concentration of the second layer is greater than an average dopant concentration of the first layer; forming a termination area in the second layer, the termination area having a second conductivity type opposite the first conductivity type; forming an active area having the second conductivity type in the second layer after forming the termination area; and doping the active area such that the active area comprises a dopant concentration that increases by at least five (5) times from a surface of the active area to a depth at which a peak concentration is disposed.
2. The method of claim 1 , wherein forming the first layer comprises forming a silicon carbide (SiC) epitaxial layer atop a SiC substrate.
3. The method of claim 1 , wherein a dopant concentration profile of the average dopant concentration within the second layer as measured from a surface of the second layer to a given depth of the second layer comprises a retrograde profile.
4. The method of claim 3 , wherein a peak concentration of the termination area is greater than a peak concentration of the second layer.
5. The method of claim 1 , wherein a dopant concentration within the termination area as measured from a top surface of the termination area to a given depth of the termination area comprises a box-like profile.
6. The method of claim 5 , wherein a peak concentration of the termination area is greater than a peak concentration of the second layer.
7. The method of claim 1 , wherein the active area comprises a well region that is contiguous with a first lateral side of the termination area, and wherein the second layer is contiguous with a second lateral side of the termination area opposite the first lateral side.
8. The method of claim 7 , wherein, after forming the well region, a dopant concentration of the second layer is less than about 20% of a dopant concentration of the well region at substantially similar depths into the second layer and the well region until a depth of about 0.15 micrometers (μm) to 0.3 μm from a surface of the second layer.
9. The method of claim 1 , wherein the average dopant concentration of the second layer is between about two (2) times to about fifteen (15) times greater than that of the first layer.
10. The method of claim 1 , wherein the average dopant concentration at a depth of at least 0.2 μm from a surface of the second layer is at least four (4) times greater than that of the average dopant concentration at the surface of the second layer.
11. The method of claim 1 , wherein the average dopant concentration at a surface of the second layer is up to about 1×10 16 per cubic centimeter (cm −3 ).
12. The method of claim 1 , wherein a sheet doping concentration of dopants within an area defined as between a surface of the second layer to a depth of about 1.5 μm is between about 2×10 12 per square centimeter (cm −2 ) to about 5×10 12 cm −2 .
13. The method of claim 1 , wherein forming the termination area comprises forming a laterally graded and segmented termination in the termination area.
14. The method of claim 1 , wherein the blanket fabrication process comprises a growth process, a deposition process, an implantation process, or a diffusion doping process, or a combination thereof.
Cooperative Patent Classification codes for this invention. Click any code to explore related patents in that topic.
December 9, 2019
July 13, 2021
Browse 5M+ US patents with plain-English claim translations and AI-generated analysis.