A multi-fin FINFET device may include a substrate and a plurality of semiconductor fins extending upwardly from the substrate and being spaced apart along the substrate. Each semiconductor fin may have opposing first and second ends and a medial portion therebetween, and outermost fins of the plurality of semiconductor fins may comprise an epitaxial growth barrier on outside surfaces thereof. The FINFET may further include at least one gate overlying the medial portions of the semiconductor fins, a plurality of raised epitaxial semiconductor source regions between the semiconductor fins adjacent the first ends thereof, and a plurality of raised epitaxial semiconductor drain regions between the semiconductor fins adjacent the second ends thereof.
Legal claims defining the scope of protection, as filed with the USPTO.
1. A device, comprising: a substrate; a plurality of fins over the substrate, the plurality of fins including a first fin and a second fin, the first fin including a first sidewall surface and a second sidewall surface opposite to the first sidewall surface, the second fin including a third sidewall surface and a fourth sidewall surface opposite to the third sidewall surface, the second sidewall surface of the first fin facing the third sidewall surface of the second fin; a gate over the plurality of fins; a plurality of epitaxial source and drain structures positioned between the plurality of fins, ones of the plurality of epitaxy source and drain structures contacting the third sidewall surface and the second sidewall surface; and an epitaxial growth barrier layer over the first sidewall surface of the first fin and on an upper portion only of the second sidewall of the first fin.
2. The device of claim 1 , wherein the epitaxial growth barrier layer covers a portion of the second sidewall surface of the first fin that is distal from the substrate.
3. The device of claim 1 , wherein the first fin includes a first surface that meets with both the first sidewall surface and the second sidewall surface and is spaced apart from a surface of the substrate, and the epitaxial growth barrier layer is on the first surface.
4. The device of claim 1 , wherein the plurality of epitaxy source and drain structures each includes a convex cross-section shape.
5. The device of claim 1 , wherein the second fin includes a first end surface and a second end surface, and comprising a first contact structure surrounding the first end surface, a portion of the third sidewall surface, and a portion of the fourth sidewall surface.
6. The device of claim 1 , comprising a gate contact on a surface of the substrate and contacting a first end of the gate.
7. The device of claim 1 , wherein the epitaxial growth barrier layer is a compound including one or more of a semiconductor material of the first fin, carbon and fluorine.
8. The device of claim 1 , wherein the plurality of fins each includes a first dimension in a first direction transverse a surface of the substrate, and the plurality of epitaxial source and drain structures each includes a second dimension in the first direction, the second dimension being smaller than the first dimension.
9. The device of claim 1 , wherein the gate contacts at least a portion of each of the first sidewall surface, the second sidewall surface, the third sidewall surface and the fourth sidewall surface.
10. A method, comprising: forming a plurality of fins over a substrate, the plurality of fins including a first fin and a second fin, the first fin including a first sidewall surface and a second sidewall surface opposite to the first sidewall surface, the second fin including a third sidewall surface and a fourth sidewall surface opposite to the third sidewall surface, the second sidewall surface of the first fin facing the third sidewall surface of the second fin; forming a gate over the plurality of fins; forming an epitaxial growth barrier layer on the first sidewall surface of the first fin and on an upper portion only of the second sidewall of the first fin; and forming a plurality of epitaxial source and drain structures positioned between the plurality of fins, ones of the plurality of epitaxy source and drain structures contacting the third sidewall surface and the second sidewall surface.
11. The method of claim 10 , wherein the forming the epitaxial growth barrier layer includes forming the epitaxial growth barrier layer on a portion of the second sidewall surface of the first fin that is distal from the substrate.
12. The method of claim 10 , wherein the forming the epitaxial growth barrier layer includes forming the epitaxial growth barrier layer on a first surface of the first fin that meets with both the first sidewall surface and the second sidewall surface, the first surface being spaced apart from a surface of the substrate.
13. The method of claim 10 , wherein the forming the epitaxial growth barrier layer includes performing an ion implementation on the first surface of the first fin.
14. The method of claim 13 , wherein the ion implementation is performed at an angle offset from normal to a surface of the substrate.
15. A method, comprising: forming a first plurality of fins extending from a surface of a substrate, the first plurality of fins including a first fin and a second fin, the first fin including a first sidewall surface and a second sidewall surface opposite to the first sidewall surface, the second fin including a third sidewall surface and a fourth sidewall surface opposite to the third sidewall surface, the second sidewall surface of the first fin facing the third sidewall surface of the second fin; forming a first gate structure on the first plurality of fins; forming an epitaxial growth barrier layer on the first sidewall surface of the first fin and on an upper portion only of the second sidewall of the first fin; forming a first plurality of epitaxial source and drain structures positioned between the first plurality of fins, ones of the first plurality of epitaxy source and drain structures contacting the third sidewall surface and the second sidewall; and forming a first contact extending over first ends of the first plurality of fins.
16. The method of claim 15 , comprising forming a second contact extending over second ends of the first plurality of fins.
17. The method of claim 16 , comprising forming a first gate contact on the surface of the substrate, the first gate contact being adjacent to the first contact and the second contact and contacting a first end of the first gate structure.
18. The method of claim 17 , comprising: forming a second plurality of fins extending from the surface of the substrate and being adjacent to the first plurality of fins; and forming a second gate structure on the second plurality of fins, the second gate structure having a first end that is adjacent to a second end of the first gate structure.
19. The method of claim 18 , comprising forming a second gate contact on the surface of the substrate, the second gate contact contacting a second end of the second gate structure.
20. The method of claim 18 , comprising: forming a second source region between ones of the second plurality of fins on a first side of the second gate structure; forming a second drain region between ones of the second plurality of fins on a second side of the second gate structure; forming a third contact extending over first ends of the second plurality of fins, the third contact being adjacent to the first contact; and forming a fourth contact extending over second ends of the second plurality of fins, the fourth contact being adjacent to the second contact.
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January 23, 2020
July 20, 2021
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