A source/drain region of a semiconductor device is formed using an epitaxial growth process. In an embodiment a first step comprises forming a bulk region of the source/drain region using a first precursor, a second precursor, and an etching precursor. A second step comprises cleaning the bulk region with the etchant along with introducing a shaping dopant to the bulk region in order to modify the crystalline structure of the exposed surfaces. A third step comprises forming a finishing region of the source/drain region using the first precursor, the second precursor, and the etching precursor.
Legal claims defining the scope of protection, as filed with the USPTO.
1. A semiconductor device comprising: a fin extending from a substrate; a source/drain region in the fin, the source/drain region comprising: a bulk section comprising a first semiconductor material and a first dopant, a first interface of the bulk section and the fin having a first concentration of the first dopant; a shaping section on the bulk section, the shaping section comprising the first semiconductor material and the first dopant, a second interface of the shaping section and the bulk section having a second concentration of the first dopant, the second concentration being greater than the first concentration; and a finishing section on the shaping section, the finishing section comprising the first semiconductor material and the first dopant, a third interface of the finishing section and the shaping section having a third concentration of the first dopant, the third concentration being greater than the second concentration.
2. The semiconductor device of claim 1 , wherein the source/drain region has a height to width ratio of between about 0.05 and about 10.
3. The semiconductor device of claim 1 , wherein the shaping section has a thickness of between about 1 nm and about 50 nm.
4. The semiconductor device of claim 1 , wherein the bulk section, the shaping section, and the finishing section further comprise a second dopant.
5. The semiconductor device of claim 4 , wherein the first interface is free from the second dopant, the second interface has a fourth concentration of the second dopant, and the third interface has a fifth concentration of the second dopant, the fifth concentration being greater than the fourth concentration.
6. The semiconductor device of claim 5 , wherein the second dopant is germanium.
7. The semiconductor device of claim 1 , wherein the first dopant is phosphorous.
8. A semiconductor device comprising: a fin extending from a substrate; a source/drain region in the fin, the source/drain region comprising: a bulk section comprising a first semiconductor material and a first dopant, a first interface of the bulk section and the fin having a first concentration of the first dopant; a shaping section on the bulk section, the shaping section comprising the first semiconductor material and the first dopant, a second interface of the shaping section and the bulk section having a second concentration of the first dopant, the second concentration being greater than the first concentration; and a finishing section on the shaping section, the finishing section comprising the first semiconductor material and the first dopant, a third interface of the finishing section and the shaping section having a third concentration of the first dopant, the third concentration being greater than the second concentration, wherein the source/drain region has a height to width ratio of between about 0.05 and about 10, wherein the shaping section has a thickness of between about 1 nm and about 50 nm.
9. The semiconductor device of claim 8 , wherein the bulk section, the shaping section, and the finishing section further comprise a second dopant.
10. The semiconductor device of claim 9 , wherein the first interface is free from the second dopant, the second interface has a fourth concentration of the second dopant, and the third interface has a fifth concentration of the second dopant, the fifth concentration being greater than the fourth concentration.
11. The semiconductor device of claim 10 , wherein the second dopant is germanium.
12. The semiconductor device of claim 8 , wherein the first dopant is phosphorous.
13. A semiconductor device comprising: a fin extending from a substrate; a source/drain region in the fin, the source/drain region comprising: a bulk section comprising a first semiconductor material and a first dopant, a first interface of the bulk section and the fin having a first concentration of the first dopant; a shaping section on the bulk section, the shaping section comprising the first semiconductor material and the first dopant, a second interface of the shaping section and the bulk section having a second concentration of the first dopant, the second concentration being greater than the first concentration; and a finishing section on the shaping section, the finishing section comprising the first semiconductor material and the first dopant, a third interface of the finishing section and the shaping section having a third concentration of the first dopant, the third concentration being greater than the second concentration, wherein the bulk section, the shaping section, and the finishing section further comprise a second dopant, wherein the first dopant is phosphorous, wherein the second dopant is germanium.
14. The semiconductor device of claim 13 , wherein the source/drain region has a height to width ratio of between about 0.05 and about 10.
15. The semiconductor device of claim 3 , wherein the shaping section has a thickness of between about 1 nm and about 50 nm.
16. The semiconductor device of claim 3 , wherein the first interface is free from the second dopant, the second interface has a fourth concentration of the second dopant, and the third interface has a fifth concentration of the second dopant, the fifth concentration being greater than the fourth concentration.
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September 13, 2019
July 20, 2021
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