In this method for manufacturing a semiconductor element, a modified layer produced by subjecting a substrate (70) to mechanical polishing is removed by heating the substrate (70) under Si vapor pressure. An epitaxial layer formation step, an ion implantation step, an ion activation step, and a second removal step are then performed. In the second removal step, macro-step bunching and insufficient ion-implanted portions of the surface of the substrate (70) performed the ion activation step are removed by heating the substrate (70) under Si vapor pressure. After that, an electrode formation step in which electrodes are formed on the substrate (70) is performed.
Legal claims defining the scope of protection, as filed with the USPTO.
1. A method for treating a surface of a substrate having an off angle, the surface of the substrate being SiC, the method comprising: forming a modified layer within the substrate by applying pressure to the substrate; a first removal step of removing the modified layer by heating the substrate under Si vapor pressure and performing isotropic etching based upon etching rate to reciprocal of heating temperature; and wherein the surface of the substrate is single crystal SiC.
2. The method for treating the surface of the substrate according to claim 1 , wherein the first removal step is performed at the etching rate of 35 nm/min or more.
3. The method for treating the surface of the substrate according to claim 1 , wherein the first removal step is performed at the etching rate of about 100 nm/min or more.
4. The method for treating the surface of the substrate according to claim 1 , wherein in the first removal step, heating is performed in a temperature range of 1800° C. or more and 2300° C. or less and under Si vapor pressure of 10 −2 Pa or more.
5. The method for treating the surface of the substrate according to claim 1 , wherein the surface of the substrate has an off angle of 4 degrees or less in the direction of <11-20>or <1-100>.
6. The method for treating the surface of the substrate according to claim 1 , wherein the surface of the substrate terminates at a step having a full-unit height that corresponds to one periodic of SiC molecules in a stack direction or a half-unit height that corresponds to one-half periodic thereof.
7. The method for treating the surface of the substrate according to claim 1 , wherein macro-step bunching does not occur when the isotropic etching is performed.
8. A method for manufacturing the substrate from which the modified layer has been removed, the method comprising the method for treating the surface of the substrate according to claim 1 .
9. The method for manufacturing the substrate from which the modified layer has been removed according to claim 8 , the method comprising: performing an epitaxial layer formation step to form an epitaxial layer on the surface of the substrate from which the modified layer has been removed.
10. The method for manufacturing the substrate from which the modified layer has been removed according to claim 9 , the method comprising: in the epitaxial layer formation step, the epitaxial layer is formed using a chemical vapor deposition method or a liquid-phase epitaxial method.
11. The method for manufacturing the substrate from which the modified layer has been removed according to claim 9 , the method comprising: an ion implantation step of implanting ions on the epitaxial layer; an ion activation step of activating ions by heating the substrate.
12. The method for manufacturing the substrate from which the modified layer has been removed according to claim 11 , the method comprising: in the ion activation step, heating is performed in a temperature range of 1800° C. or more and 2300° C. or less and under Si vapor pressure of 10 31 3 Pa or less.
13. The method for manufacturing the substrate from which the modified layer has been removed according to claim 11 , the method comprising: forming an at least one insufficient ion-implanted portion of the surface of the substrate and a macro-step bunching on the surface of the substrate as a result of the ion activation step; a second removal step of removing the at least one insufficient ion-implanted portion of the surface of the substrate and the macro-step bunching by heating the substrate under Si vapor pressure.
14. The method for manufacturing the substrate from which the modified layer has been removed according to claim 13 , wherein in the second removal step, an etching rate is lower than that of the first removal step.
15. The method for manufacturing the substrate from which the modified layer has been removed according to claim 13 , wherein the first removal step and the second removal step are continuously performed using a common heating apparatus.
16. The method for manufacturing the substrate from which the modified layer has been removed according to claim 13 , wherein in the second removal step, heating is performed in a temperature range of 1600° C. or more and 2000° C. or less and under Si vapor pressure of 10 −3 Pa or less.
17. A method for manufacturing a semiconductor element, the method comprising: the method for manufacturing the substrate from which the modified layer has been removed according to claim 13 ; an electrode formation step of forming at least one electrode on the substrate from which the at least one insufficient ion-implanted portion and macro-step bunching have been removed by the second removal step.
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February 27, 2018
August 3, 2021
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