A transfer chamber configured to be used during semiconductor device manufacturing is described. Transfer chamber includes at least one first side of a first width configured to couple to one or more substrate transfer units (e.g., one or more load locks or one or more pass-through units), and at least a second set of sides of a second width that is different than the first width, the second set of sides configured to couple to one or more processing chambers. A total number of sides of the transfer chamber is at least seven. Transfers within the transfer chamber are serviceable by a single robot. Process tools and methods for processing substrates are described, as are numerous other aspects.
Legal claims defining the scope of protection, as filed with the USPTO.
1. A processing tool, comprising: an interface unit coupled to an interface side, the interface unit comprising one or more load locks and at least one processing chamber; a pass-through unit comprising an integral body having three pass-through locations located within the integral body; a first transfer chamber coupled between the interface side and the pass-through unit, the first transfer chamber comprising: at least four first sides to receive processing chambers; and a first elongated side, which is elongated compared to the at least four first sides, coupled to the interface side of the interface unit; and a second transfer chamber coupled to the pass-through unit and comprising: at least six second sides to receive processing chambers; and a second elongated side, which is elongated compared to the at least six second sides, coupled to the pass-through unit.
2. The processing tool of claim 1 , wherein at least one pass-through location of the three pass-through locations is adapted to perform substrate processing.
3. The processing tool of claim 1 , wherein the first transfer chamber comprises a third elongated side configured to couple to the pass-through unit and which is elongated compared to the at least four first sides.
4. The processing tool of claim 1 , wherein the one or more load locks comprise one or more batch load locks.
5. The processing tool of claim 1 , wherein the interface unit comprises rear interface openings that are configured to allow transfer of substrates between a factory interface and the interface unit.
6. The processing tool of claim 1 , wherein the interface unit comprises a front region configured to couple with the elongated side of the first transfer chamber.
7. The processing tool of claim 1 , further comprising: a first single robot to service transfers within the first transfer chamber; and a second single robot to service transfers within the second transfer chamber.
Cooperative Patent Classification codes for this invention. Click any code to explore related patents in that topic.
March 20, 2019
August 10, 2021
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