An integrated circuit device may include a programmable fabric die having programmable logic fabric and configuration memory that may configure the programmable logic fabric. The integrated circuit device may also include a base die that may provide fabric support circuitry, including memory and/or communication interfaces as well as compute elements that may also be application-specific. The memory in the base die may be directly accessed by the programmable fabric die using a low-latency, high capacity, and high bandwidth interface.
Legal claims defining the scope of protection, as filed with the USPTO.
1. A programmable fabric device, comprising: a fabric die having a programmable fabric comprising: a plurality of partial reconfiguration regions each corresponding to a design for the programmable fabric, wherein the partial reconfiguration regions of the plurality of partial reconfiguration regions are aligned to sectors of the programmable fabric; a plurality of external sectors outside of the plurality of partial reconfiguration regions; and fabric resources that couple the external sectors to adjacent sectors of the plurality of the partial reconfiguration regions; and a base die coupled to the external sectors and that provides interconnection between the external sectors.
2. The programmable fabric device of claim 1 , wherein the external sectors enable communications between regions using external paths outside of the plurality of partial reconfiguration regions.
3. The programmable fabric device of claim 2 , wherein communications between partial reconfiguration regions of the plurality of partial reconfiguration regions uses at least one of the plurality of external sectors.
4. The programmable fabric device of claim 1 , wherein communications between partial reconfiguration regions of the plurality of partial reconfiguration regions uses a network on chip of the base die.
5. The programmable fabric device of claim 1 , wherein background partial reconfiguration is for the plurality of partial reconfiguration region are stored in the base die.
6. The programmable fabric device of claim 1 , wherein the plurality of partial reconfiguration regions are reconfigured using a configuration write.
7. The programmable fabric device of claim 1 , wherein the programmable fabric comprises static routes within a partial reconfiguration region of the plurality of partial reconfiguration regions.
8. The programmable fabric device of claim 1 , wherein communications between the plurality of partial reconfiguration regions uses a soft logic network on chip in the fabric die or a hardened network-on-chip in the fabric die.
9. The programmable fabric device of claim 8 , wherein the soft logic network on chip is tolerant of disappearing sections during a partial reconfiguration of the programmable fabric.
10. The programmable fabric of claim 1 , wherein communications between the plurality of partial reconfiguration regions utilizes connections between a fabric microbump interface of the fabric die and a base microbump interface of the base die.
11. A method, comprising: loading a plurality of partial reconfiguration personas into a programmable fabric of a fabric die of programmable logic device, wherein the plurality of partial reconfiguration personas are aligned to sectors of the programmable fabric; loading a background partial reconfiguration persona into a base die of the programmable logic device while performing operations using the plurality of partial reconfiguration personas; and loading the background partial reconfiguration persona into the programmable fabric from the base die.
12. The method of claim 11 , wherein loading the background partial reconfiguration persona comprises loading the background partial reconfiguration persona into the programmable fabric using a base microbump interface of the base die.
13. The method of claim 12 , wherein loading the background partial reconfiguration persona comprises loading the background from base microbump interface of the base die via a fabric microbump interface of the fabric die.
14. The method of claim 11 , wherein communications between a plurality of partial reconfiguration regions loaded with the plurality of partial reconfiguration personas comprises pathways around the loaded plurality of partial reconfiguration regions.
15. The method of claim 14 , wherein the pathways comprise connections through the base die.
16. The method of claim 15 , wherein the connections through the base die comprise a network on chip of the base die.
17. A programmable fabric device, comprising: a programmable fabric die having a programmable fabric of programmable elements that is sequentially configured using a sequence of partial reconfiguration personas that control how the programmable elements are programmed for one or more portions of the programmable fabric, wherein the fabric die comprises: a plurality of partial reconfiguration regions each corresponding one or more partial reconfiguration personas; a plurality of external sectors outside of the plurality of partial reconfiguration regions; and fabric resources that couple the plurality external sectors to the plurality of partial reconfiguration regions; and a base die having one or more memory blocks that store a first subset of the partial reconfiguration personas for loading into the fabric die at a future time while a second subset of the partial reconfiguration personas are used to perform an operation in the programmable fabric, wherein the base die is coupled to and provides interconnection to the plurality of external sectors.
18. The programmable fabric device of claim 17 , wherein the sequence comprises a static sequence of the partial reconfiguration personas.
19. The programmable fabric device of claim 17 , wherein the partial reconfiguration personas are aligned to sectors of the programmable fabric.
20. The programmable fabric device of claim 17 , wherein the sequence of the partial reconfiguration personas comprises at least one of the partial reconfiguration personas occurring more than once in the sequence.
Cooperative Patent Classification codes for this invention. Click any code to explore related patents in that topic.
December 11, 2019
August 24, 2021
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