Sensor wiring substrate, sensor package, and sensor device

1. A sensor wiring substrate comprising: a plate-like substrate comprising a plurality of dielectric layers that are laminated, and a first accommodation recessed portion for accommodating an acoustic element and a second accommodation recessed portion for accommodating an infrared light emitting element that are disposed on a first surface; and connection wiring comprising a first connection terminal disposed in the first accommodation recessed portion for electrically connecting to the acoustic element, a second connection terminal disposed in the second accommodation recessed portion for electrically connecting to the infrared light emitting element, external connection terminals for electrically connecting to an external circuit, and internal wiring electrically connecting the first connection terminal and the second connection terminal to the external connection terminals, respectively, and wherein a depth of the first accommodation recessed portion is different from a depth of the second accommodation recessed portion.

2. The sensor wiring substrate according to claim 1 , wherein the depth of the second accommodation recessed portion is deeper than the depth of the first accommodation recessed portion.

3. The sensor wiring substrate according to claim 1 , further comprising a first heat transfer member: which has thermal conductivity higher than that of each of the plurality of dielectric layers; which is embedded between the first accommodation recessed portion and the second accommodation recessed portion of the substrate; and a portion of which is exposed to at least one of a second surface of the substrate opposite to the first surface and a side surface of the substrate.

4. The sensor wiring substrate according to claim 1 , further comprising a second heat transfer member: which has thermal conductivity higher than that of each of the plurality of dielectric layers; which is embedded at least one of between the second accommodation recessed portion and a second surface of the substrate opposite to the first surface, and between the second accommodation recessed portion and a side surface of the substrate; and a portion of which is exposed to at least one of the side surface of the substrate and the second surface of the substrate.

5. The sensor wiring substrate according to claim 1 , further comprising a low heat conduction portion having thermal conductivity lower than that of each of the plurality of dielectric layers, and disposed between the first accommodation recessed portion and the second accommodation recessed portion of the substrate.

6. The sensor wiring substrate according to claim 5 , wherein in a cross-sectional view, the low heat conduction portion comprises: one end portion located between the first surface of the substrate and the bottom surface of the second accommodation recessed portion, and an other end portion extending to a second surface opposite to the first surface of the substrate.

7. The sensor wiring substrate according to claim 5 , wherein the low heat conduction portion is disposed from the first surface to a second surface opposite to the first surface.

8. The sensor wiring substrate according to claim 5 , wherein the low heat conduction portion is further disposed between the second accommodation recessed portion and a side surface of the substrate.

9. The sensor wiring substrate according to claim 5 , wherein the low heat conduction portion comprises a void portion.

10. A sensor package comprising: the sensor wiring substrate according to claim 1 ; and a cover body covering the first surface of the substrate with a space between the cover body and the first surface, wherein a gaseous substance for detection is to be introduced into the space.

11. The sensor package according to claim 10 , further comprising: a first lid that closes an opening of the first accommodation recessed portion and is transparent to infrared light; and a detection gas that is sealed in the first accommodation recessed portion, and absorbs the infrared light and generates a sound wave.

12. The sensor package according to claim 10 , further comprising a second lid that closes an opening of the second accommodation recessed portion and is transparent to the infrared light.

13. The sensor package according to claim 12 , further comprising a band pass filter disposed on the second lid and being transparent only to infrared light having a wavelength range absorbed by the gaseous substance to be detected, and by the detection gas.

14. The sensor package according to claim 12 , further comprising an aperture member which is disposed on the second lid and comprises an aperture smaller than the opening of the second accommodation recessed portion.

15. The sensor package according to claim 10 , further comprising a reflection member which is disposed on an inner surface of the cover body and reflects infrared light emitted from the infrared light emitting element.

16. A sensor device comprising: the sensor package according to claim 10 ; the acoustic element in the first accommodation recessed portion; and the infrared light emitting element in the second accommodation recessed portion.

17. A sensor wiring substrate comprising: a plate-like substrate comprising a plurality of dielectric layers that are laminated, and a first accommodation recessed portion for accommodating an acoustic element and a second accommodation recessed portion for accommodating an infrared light emitting element that are disposed on a first surface; connection wiring comprising a first connection terminal disposed in the first accommodation recessed portion for electrically connecting to the acoustic element, a second connection terminal disposed in the second accommodation recessed portion for electrically connecting to the infrared light emitting element, external connection terminals for electrically connecting to an external circuit, and internal wiring electrically connecting the first connection terminal and the second connection terminal to the external connection terminals, respectively; and a low heat conduction portion having thermal conductivity lower than that of each of the plurality of dielectric layers, and disposed between the first accommodation recessed portion and the second accommodation recessed portion of the substrate, wherein the low heat conduction portion is further disposed between the second accommodation recessed portion and a side surface of the substrate.

18. The sensor wiring substrate according to claim 17 , wherein in a cross-sectional view, the low heat conduction portion comprises: one end portion located between the first surface of the substrate and the bottom surface of the second accommodation recessed portion, and an other end portion extending to a second surface opposite to the first surface of the substrate.

19. The sensor wiring substrate according to claim 17 , wherein the low heat conduction portion is disposed from the first surface to a second surface opposite to the first surface.