Patentable/Patents/US-11118057
US-11118057

Attenuation material composition, attenuation material and preparation method and use thereof

PublishedSeptember 14, 2021
Assigneenot available in USPTO data we have
Inventorsnot available in USPTO data we have
Technical Abstract

The attenuation material composition disclosed in the present disclosure comprises a room temperature vulcanized silicone rubber, an epoxy resin, a first curing agent and a second curing agent, wherein the first curing agent comprises ethyl orthosilicate and dibutyltin oxide; and the weight ratio of the room temperature vulcanized silicone rubber to the epoxy resin is (0.1-1):1.

Patent Claims
19 claims

Legal claims defining the scope of protection, as filed with the USPTO.

1

1. An attenuation material composition comprising a room temperature vulcanized silicone rubber, an epoxy resin, a first curing agent and a second curing agent, wherein the first curing agent comprises ethyl orthosilicate and dibutyltin oxide; the weight ratio of the room temperature vulcanized silicone rubber to the epoxy resin is (0.1-1):1; and the weight ratio of the ethyl orthosilicate to the dibutyltin oxide is 100:(2-4).

2

2. The composition of claim 1 , wherein the weight ratio of the ethyl orthosilicate to the dibutyltin oxide is 100:(2.5-3.5).

3

3. The composition of claim 1 , wherein the weight ratio of the room temperature vulcanized silicone rubber to the first curing agent is 100:(2-4).

4

4. The composition of claim 3 , wherein the weight ratio of the room temperature vulcanized silicone rubber to the first curing agent is 100:(2.5-3.5).

5

5. The composition of claim 1 , wherein the room temperature vulcanized silicone rubber is 10-100 parts by weight, the first curing agent is 0.3-3 parts by weight, and the second curing agent is 10-30 parts by weight, based on 100 parts by weight of the epoxy resin.

6

6. The composition of claim 5 , wherein the room temperature vulcanized silicone rubber is 45-55 parts by weight, the first curing agent is 1-2 parts by weight, and the second curing agent is 15-25 parts by weight, based on 100 parts by weight of the epoxy resin.

7

7. The composition of claim 1 , wherein the second curing agent is an aliphatic amine curing agent.

8

8. The composition of claim 7 , wherein the aliphatic amine curing agent has a viscosity within a range of 50-120 mPa·s at a temperature of 25° C. and an amine value within a range of 600-700 mgKOH/g.

9

9. The composition of claim 1 , wherein the room temperature vulcanized silicone rubber has a viscosity within a range of 2,000-12,000 mPa·s at a temperature of 25° C.

10

10. The composition of claim 1 , wherein the epoxy resin has a viscosity within a range of 9,000-14,000 mPa·s at a temperature of 25° C. and an epoxy value within a range of 0.5-0.54 mol/100 g.

11

11. A method for preparing an attenuation material with the attenuation material composition of claim 1 , including: (1) subjecting the room temperature vulcanized silicone rubber to a first heat treatment and then subjecting to a first mixing with the first curing agent to obtain a modified silicone rubber; (2) subjecting the epoxy resin to a second heat treatment and then subjecting to a second mixing with the second curing agent and the modified silicone rubber; (3) injecting the mixture obtained in step (2) into a mould and performing a curing process.

12

12. The method of claim 11 , wherein the first heat treatment in step (1) is performed by means of constant temperature heating, and the heating is kept at a temperature of 20-50° C. for 1-48 hours.

13

13. The method of claim 11 , wherein the conditions of the first mixing in step (1) comprise: the stirring velocity is within a range of 70-95 rpm, and the stirring time is within a range of 6-12 min.

14

14. The method of claim 13 , wherein the stirring velocity is within a range of 80-90 rpm, and the stirring time is within a range of 8-10 min.

15

15. The method of claim 11 , wherein the second heat treatment in step (2) is performed by means of constant temperature heating, and the heating is kept at a temperature of 20-50° C. for 1-48 hours.

16

16. The method of claim 11 , wherein the conditions of the second mixing in step (2) comprise: the stirring velocity is within a range of 70-95 rpm, and the stirring time is within a range of 6-12 min.

17

17. The method of claim 11 , wherein the conditions of the curing treatment in step (3) comprise: the temperature is within a range of 18-32° C., and the time is within a range of 24-96 hours.

18

18. An attenuation material prepared with the method of the claim 11 .

19

19. A seismic physical model comprised of the attenuation material of claim 18 .

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Patent Metadata

Filing Date

March 30, 2021

Publication Date

September 14, 2021

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