A process system includes a substrate, first wafers, second wafers, and a roller. The first wafers are arranged at predetermined intervals along a first column which is parallel to an edge of the substrate, wherein each of the first wafers includes first chips. The second wafers are arranged at the predetermined intervals and at an offset from the first wafers, along a second column which is parallel to the first column, wherein each of the second wafers includes second chips. The roller is configured to roll in a first direction to pick up the plurality of first chips, roll in a second direction opposite to the first direction while suspended from the first wafers, pick up the second chips included in the wafers by rolling in the first direction, and transport the first chips and the second chips to the substrate.
Legal claims defining the scope of protection, as filed with the USPTO.
1. A process system comprising: a surface on which a plurality of first chips are disposed; a roller configured to roll in a first rotational direction to pick up the plurality of first chips on the surface, a target substrate arranged on the surface; and a plurality of first substrates and a plurality of second substrates, wherein when the roller picks up the plurality of first chips on the surface, a height of the roller from the surface is changed by moving the roller upwards or downwards based on whether at least one chip of the plurality of first chips is disposed under the roller, wherein the height of the roller from the surface is greater when the at least one chip of the plurality of first chips is disposed under the roller than when the roller is in contact with the surface, wherein the plurality of first substrates are arranged at predetermined intervals along a first column which is parallel to an edge of the target substrate, each of the plurality of first substrates including the plurality of first chips, wherein the plurality of second substrates are arranged at the predetermined intervals and at an offset from the plurality of first substrates, along a second column which is parallel to the first column, each of the plurality of second substrates including a plurality of second chips, and wherein the roller is further configured to: roll in the first rotational direction to pick up the plurality of first chips included in the plurality of first substrates, pick up the plurality of second chips included in the plurality of second substrates by rolling in the first rotational direction such that a group of the plurality of second chips picked up from a second substrate, from among the plurality of second substrates, is positioned on the roller between two groups of the plurality of first chips picked up from the plurality of first substrates, and transport the plurality of first chips and the plurality of second chips to the target substrate.
2. The process system as claimed in claim 1 , wherein the height of the roller decreases based on the at least one chip of the plurality of first chips is under the roller, and the height of the roller increases based on the at least one chip of the plurality of first chips is not under the roller.
3. The process system as claimed in claim 1 , wherein the roller has a cylinder shape and a predetermined length along a pivot direction that is perpendicular to the first rotational direction, and wherein the roller is further configured to, while rolling in the first rotational direction, simultaneously pick up a first group of chips that are arranged in the pivot direction, the first group of chips being arranged in the pivot direction and selected from one of the plurality of first chips included in the plurality of first substrates and the plurality of second chips included in the plurality of second substrates.
4. The process system as claimed in claim 1 , wherein the plurality of first chips and the plurality of second chips are arranged in an m×n matrix, wherein the roller is further configured to, while rolling in the first rotational direction and moving in a first lateral direction towards the target substrate, simultaneously pick up a first group of chips, among the plurality of first chips and the plurality of second chips, and simultaneously pick up a second group of chips, among the plurality of first chips and the plurality of second chips, wherein the first group of chips are arranged along a pivot direction of the roller, the pivot direction being perpendicular to the first rotational direction, wherein the second group of chips are arranged along the pivot direction of the roller, and wherein the first group of chips are spaced apart from the second group of chips by a first interval in the first lateral direction.
5. The process system as claimed in claim 4 , wherein the first group of chips are spaced apart from each other at second intervals along the pivot direction of the roller, and the second group of chips are spaced apart from each other at the second intervals along the pivot direction of the roller.
6. The process system as claimed in claim 5 , further comprising: a plurality of third substrates arranged at the predetermined intervals along a third column which is parallel to the first column, the plurality of third substrates including a plurality of third chips; and a plurality of fourth substrates arranged at the predetermined intervals and at an offset from the plurality of third substrates, along a fourth column which is parallel to the first column, the plurality of fourth substrates including a plurality of fourth chips, wherein the roller is further configured to pick up at least some chips from the plurality of third substrates and the plurality of fourth substrates in between some of the plurality of first chips and the plurality of second chips that are picked up from the plurality of first substrates and the plurality of second substrates.
7. The process system as claimed in claim 6 , wherein the plurality of first chips included in the plurality of first substrates and the plurality of second chips included in the plurality of second substrates are one of a red (R) type, a green (G) type, and a blue (B) type, and the plurality of third chips included in the plurality of third substrates and the plurality of fourth chips included in the plurality of fourth substrates are another one of the R type, the G type, and the B type.
8. The process system as claimed in claim 5 , wherein the plurality of first chips included in the plurality of first substrates and the plurality of second chips included in the plurality of second substrates include first chips of a first type and second chips of a second type, and the roller is further configured to pick up the first chips of the first type, move a predetermined distance in a second lateral direction opposite of the first lateral direction, and pick up the second chips of the second type.
9. The process system as claimed in claim 1 , wherein the roller is further configured to, in order for the plurality of second chips included in the plurality of second substrates to be picked up at spaces between the plurality of first chips picked up from the plurality of first substrates, roll in a second rotational direction while the roller is suspended from the plurality of first substrates.
10. The process system as claimed in claim 1 , wherein the roller moves towards the target substrate while rolling in the first rotational direction, and wherein the plurality of first substrates and the plurality of second substrates are consecutively located between an initial position of the roller and the target substrate.
11. The process system as claimed in claim 1 , wherein the predetermined intervals are determined based on a size of an area occupied by a number of chips included in a single substrate of at least one of the plurality of first substrates and the plurality of second substrates.
Cooperative Patent Classification codes for this invention. Click any code to explore related patents in that topic.
May 2, 2019
September 14, 2021
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