Backlight module and method of manufacturing same

A backlight module and a method of manufacturing same are provided. The backlight module includes a flexible circuit substrate. The flexible circuit substrate includes a flexible substrate, a first pad, a second pad, a mineral oil layer, and a light emitting diode (LED) chip. The first pad and the second pad are disposed on the flexible substrate. The mineral oil layer is disposed on the flexible substrate and is patterned to form a window opening region. Two ends of the LED chip are electrically connected to a positive electrode of the first pad and a negative electrode of the second pad respectively through the window opening region. The window opening region exposes at least the positive electrode and the negative electrode.