A photo detector includes a superlattice with an undoped first semiconductor layer including undoped intrinsic semiconductor material, a doped second semiconductor layer having a first conductivity type on the first semiconductor layer, an undoped third semiconductor layer including undoped intrinsic semiconductor material on the second semiconductor layer, and a fourth semiconductor layer having a second opposite conductivity type on the third semiconductor layer, along with a first contact having the first conductivity type in the first, second, third, and fourth semiconductor layers, and a second contact having the second conductivity type and spaced apart from the first contact in the first, second, third, and fourth semiconductor layers. An optical shield on a second shielded portion of a top surface of the fourth semiconductor layer establishes electron and hole lakes. A packaging structure includes an opening that allows light to enter an exposed first portion of the top surface of the fourth semiconductor layer.
Legal claims defining the scope of protection, as filed with the USPTO.
1. A photo detector, comprising: a superlattice, including: a first semiconductor layer, the first semiconductor layer including undoped intrinsic semiconductor material, a second semiconductor layer on the first semiconductor layer, the second semiconductor layer having a first conductivity type, a third semiconductor layer on the second semiconductor layer, the third semiconductor layer including undoped intrinsic semiconductor material, and a fourth semiconductor layer on the third semiconductor layer, the fourth semiconductor layer having a second opposite conductivity type; a first contact extending through the first, second, third, and fourth semiconductor layers, the first contact having the first conductivity type; a second contact extending through the first, second, third, and fourth semiconductor layers, the second contact spaced apart from the first contact, and having the second conductivity type; and a transition layer between the superlattice and a substrate, wherein the transition layer has a different chemical composition than the substrate and the first and second contacts land on the transition layer.
2. The photo detector of claim 1 , wherein the first contact includes a first implanted region in the first, second, third, and fourth semiconductor layers, the first implanted region including majority carrier dopants of the first conductivity type; and wherein the second contact includes a second implanted region in the first, second, third, and fourth semiconductor layers, the second implanted region including majority carrier dopants of the second conductivity type, the second implanted region being spaced apart from the first implanted region.
3. The photo detector of claim 2 , wherein the first implanted region has a higher carrier concentration than the second and fourth semiconductor layers; and wherein the second implanted region has a higher carrier concentration than the second and fourth semiconductor layers.
4. The photo detector of claim 1 , further comprising an isolation structure surrounding a portion of the superlattice.
5. The photo detector of claim 1 , wherein a first portion of a top surface of the superlattice is configured to receive incoming light; and wherein the photo detector further comprises an optical shield configured to inhibit light from entering a second portion of the top surface of the superlattice.
6. The photo detector of claim 5 , wherein the optical shield includes a stack on the second portion of the top surface of the superlattice, the stack including: a dielectric layer; and a metal layer on the dielectric layer.
7. The photo detector of claim 6 , wherein the dielectric layer extends on the second portion of the top surface of the superlattice.
8. The photo detector of claim 5 , wherein the first semiconductor layer is located between a substrate and the second semiconductor layer; and wherein the fourth semiconductor layer includes the top surface of the superlattice.
9. The photo detector of claim 8 , wherein the first conductivity type is p-type, and wherein the second conductivity type is n-type.
10. The photo detector of claim 1 , further comprising a second superlattice, the second superlattice, including: a fifth semiconductor layer on the fourth semiconductor layer, the fifth semiconductor layer including undoped intrinsic semiconductor material; a sixth semiconductor layer on the fifth semiconductor layer, the sixth semiconductor layer having the first conductivity type; a seventh semiconductor layer on the sixth semiconductor layer, the seventh semiconductor layer including undoped intrinsic semiconductor material; and an eighth semiconductor layer on the seventh semiconductor layer, the eighth semiconductor layer having the second conductivity type.
11. The photo detector of claim 10 , wherein the second superlattice has a different energy bandgap than the superlattice.
12. The photo detector of claim 10 , wherein a first portion of a top surface of the second superlattice is configured to receive incoming light; and wherein the photo detector further comprises an optical shield configured to inhibit light from entering a second portion of the top surface of the second superlattice to facilitate formation of a two-dimensional electron lake in at least one of the superlattice and the second superlattice under the optical shield and a two-dimensional hole lake spaced apart from the two-dimensional electron lake in the at least one of the superlattice and the second superlattice under the optical shield.
13. The photo detector of claim 12 , further comprising a voltage source configured to apply a bias voltage signal to the superlattice and to the second superlattice to control a size of the two-dimensional electron lake, and a size of the two-dimensional hole lake.
14. The photo detector of claim 12 , further comprising a memory interface circuit configured to read the photo detector.
15. The photo detector of claim 1 , further comprising: a second superlattice, the second superlattice, including: a fifth semiconductor layer, the fifth semiconductor layer including undoped intrinsic semiconductor material, a sixth semiconductor layer on the fifth semiconductor layer, the sixth semiconductor layer having the first conductivity type, a seventh semiconductor layer on the sixth semiconductor layer, the seventh semiconductor layer including undoped intrinsic semiconductor material, and an eighth semiconductor layer on the seventh semiconductor layer, the eighth semiconductor layer having the second conductivity type; a third contact in the fifth, sixth, seventh, and eighth semiconductor layers, the third contact having the first conductivity type; and a fourth contact in the fifth, sixth, seventh, and eighth semiconductor layers, the fourth contact spaced apart from the third contact, and having the second conductivity type.
16. The photo detector of claim 15 , wherein a first portion of a top surface of the second superlattice is configured to receive incoming light; and wherein the photo detector further comprises an optical shield configured to inhibit light from entering a second portion of the top surface of the second superlattice.
17. A photo detector array, comprising: a substrate, including an array of apertures; a transition layer located over the substrate and having a different chemical composition than the substrate: an array of superlattices, each superlattice including: a first semiconductor layer formed over the transition layer, the first semiconductor layer including undoped intrinsic semiconductor material, and a top surface aligned to a respective one of the apertures, the top surface including a first portion to receive light through the respective one of the apertures, and an optical shield configured to inhibit light from entering a second portion of the top surface of the first semiconductor layer, a second semiconductor layer on the first semiconductor layer, the second semiconductor layer having a first conductivity type, a third semiconductor layer on the second semiconductor layer, the third semiconductor layer including undoped intrinsic semiconductor material, and a fourth semiconductor layer on the third semiconductor layer, the fourth semiconductor layer having a second opposite conductivity type, a first contact in the first, second, third, and fourth semiconductor layers, the first contact having the first conductivity type, and a second contact in the first, second, third, and fourth semiconductor layers, the second contact spaced apart from the first contact, and having the second conductivity type.
18. The photo detector array of claim 17 , wherein the array of superlattices are in a single chip soldered to the substrate.
19. The photo detector array of claim 17 , wherein the superlattices are in respective chips soldered to the substrate.
20. The photo detector array of claim 17 , further comprising a pair of contacts corresponding to each of the superlattices, each contact of the pair of contacts touching the first, second, third and fourth semiconductor layers and the transition layer.
21. A photo detector, comprising: a semiconductor superlattice over a substrate, the superlattice comprising: first and second intrinsic layers of GaAlN; and a first doped GaAlN layer having a first conductivity type and a second doped GaAlN layer having a second opposite conductivity type, the first doped GaAlN layer located between the first and second intrinsic GaAlN layers and the second intrinsic layer located between the first doped GaAlN layer and the second doped GaAlN layer; a dielectric layer over the superlattice; a metallization layer over the dielectric layer, the metallization layer including an opening that exposes a top surface of the superlattice; a P-type first contact and an N-type second contact, each of the first and second contacts extending from the dielectric layer toward the substrate and being laterally surrounded by each of the first and second intrinsic GaAlN layers and the first and second doped GaAlN layers.
22. The photo detector of claim 21 , further comprising a transition layer between the superlattice and the substrate, the transition layer having a different chemical composition than the substrate, and the first and second contacts touching the transition layer.
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July 3, 2019
October 26, 2021
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