A semiconductor device includes an error check and scrub (ECS) command generation circuit and an ECS control circuit. The ECS command generation circuit generates an ECS command based on a refresh command. During an ECS operation, the ECS control circuit generates an ECS mode signal that is activated based on the ECS command and generates an ECS active command, an ECS read command, and an ECS write command to continue the ECS operation.
Legal claims defining the scope of protection, as filed with the USPTO.
1. A semiconductor device comprising: an error check and scrub (ECS) command generation circuit configured to generate an ECS command based on a refresh command; and an ECS control circuit, during an ECS operation, configured to generate an ECS mode signal that is activated based on the ECS command and configured to generate an ECS active command, an ECS read command, and an ECS write command to perform the ECS operation, wherein the ECS active command is generated to perform an ECS active operation to load a codeword, stored in at least one memory cell, connected to a row path that is selected by a row address, on at least one bit line to sense and amplify the codeword.
2. The semiconductor device of claim 1 , wherein the ECS command generation circuit generates the ECS command whenever the refresh command is generated a predetermined number of times.
3. The semiconductor device of claim 2 , wherein the ECS command generation circuit includes: a comparison circuit configured to compare a refresh count signal, generated by counting the predetermined number of refresh commands that are generated with a set signal to generate a comparison signal; and a selection output circuit configured to output the refresh command as an internal refresh command to perform the ECS operation or a refresh operation based on the comparison signal.
4. The semiconductor device of claim 1 , wherein the ECS control circuit includes: an ECS mode signal generation circuit configured to generate the ECS mode signal that is activated based on the ECS command; and an ECS decoder configured to decode a count signal, generated by counting an internal clock signal, to generate the ECS active command, the ECS read command, and the ECS write command while the ECS mode signal is activated.
5. The semiconductor device of claim 1 , wherein the ECS read command is generated to perform an ECS read operation to transmit a codeword of a column path, selected by a column address, to an error correction circuit.
6. The semiconductor device of claim 1 , further comprising an error correction circuit configured to: receive a codeword, including data and parity, which is outputted from memory cells based on an ECS active operation and an ECS read operation, performed based on the ECS active command and the ECS read command, detect an error of the codeword to generate an error flag, and correct the error of the codeword to generate a corrected codeword.
7. The semiconductor device of claim 6 , wherein the ECS write command is generated to perform an ECS write operation to transmit the corrected codeword to a column path that is selected by a column address.
8. The semiconductor device of claim 1 , wherein the ECS write command is not generated when no error is detected from a codeword outputted by an ECS read operation that is performed by the ECS read command.
9. The semiconductor device of claim 1 , further comprising an error log storage circuit configured to store information as an error log signal and an error log address based on an error flag, the information including: a number of errors detected by the ECS operation, a maximum number of errors of a row path, and the row path with the maximum number of errors.
10. The semiconductor device of claim 9 , wherein the error log storage circuit outputs the error log signal and the error log address through at least one semiconductor pin.
11. The semiconductor device of claim 9 , wherein the error log storage circuit includes: an error log control circuit configured to generate a latched error code, including information regarding the number of errors that are detected based on the error flag when ECS operations are sequentially performed for all of memory cells; a row error log control circuit configured to compare the numbers of errors of the row paths with each other to generate a row latch error code, including information regarding the maximum number of errors of one of the row paths, and configured to generate a latched bank address and a latched row address, including information regarding the row path with the maximum number of errors; and an error log output circuit configured to output the latched error code or the row latch error code as the error log signal based on an error log command and configured to output the latched bank address and the latched row address as an error log bank address and an error log row address based on the error log command.
12. The semiconductor device of claim 9 , further comprising a repair control circuit configured to generate a repair control signal to replace memory cells that are connected to a row path that corresponds to the error log address with redundant memory cells.
13. The semiconductor device of claim 1 , further comprising a command/address receiving circuit configured to buffer a command/address signal to generate an internal command/address signal, wherein the command/address receiving circuit is deactivated when the ECS operation is performed.
14. A semiconductor device comprising: a command/address receiving circuit configured to buffer a command/address signal to generate an internal command/address signal; a command decoder configured to decode the internal command/address signal to generate a refresh command; an error check and scrub (ECS) command generation circuit configured to generate an ECS command based on the refresh command; and an ECS control circuit configured to generate an ECS mode signal that is activated based on the ECS command during an ECS operation, wherein the command/address receiving circuit is deactivated when the ECS operation is performed.
15. The semiconductor device of claim 14 , wherein the ECS command generation circuit generates the ECS command whenever the refresh command is generated a predetermined number of times.
16. The semiconductor device of claim 14 , wherein the ECS control circuit includes: an ECS mode signal generation circuit configured to generate the ECS mode signal that is activated based on the ECS command; and an ECS decoder configured to decode a count signal generated by counting an internal clock signal to generate an ECS active command, an ECS read command, and an ECS write command while the ECS mode signal is activated.
17. The semiconductor device of claim 16 , further comprising an error correction circuit configured to receive a codeword, including data and parity, which is outputted from memory cells based on an ECS active operation and an ECS read operation, performed based on the ECS active command and the ECS read command, detect an error of the codeword to generate an error flag, and correct the error of the codeword to generate a corrected codeword.
18. The semiconductor device of claim 16 , wherein the ECS write command is not generated when no error is detected from a codeword outputted by an ECS read operation that is performed by the ECS read command.
19. The semiconductor device of claim 14 , further comprising an error log storage circuit configured to, during the ECS operation, store information as an error log signal and an error log address based on an error flag, the information including: a number of memory cells storing an erroneous codeword, a maximum number of memory cells storing the erroneous codeword in a row path, and the row path with the maximum number of memory cells storing the erroneous codeword.
20. A semiconductor system comprising: a controller configured to output a command and an address and configured to receive an error log signal and an error log address; and a semiconductor device configured to: generate an error check and scrub (ECS) command based on a refresh command that is generated by decoding the command, detect an error of a codeword, including data and parity, stored in memory cells, to generate an error flag based on the ECS command during an ECS operation, store information regarding a maximum number of errors of a row path as the error log signal based on the error flag, store information regarding the row path with the maximum number of errors as the error log address, and output the error log signal and the error log address.
21. The semiconductor system of claim 20 , wherein the controller receives the error log signal and the error log address to control the semiconductor device such that an internal operation of memory cells, connected to the row path with the maximum number of errors, is not performed.
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April 10, 2020
November 2, 2021
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