A semiconductor device includes a gate electrode, a semiconductor film, and a conductive film. The semiconductor film includes an oxide semiconductor material. The semiconductor film includes a channel region, a low-resistance region, and an intermediate region. The channel region is opposed to the gate electrode. The low-resistance region has a lower electric resistance than the channel region. The intermediate region is provided between the low-resistance region and the channel region. The conductive film is provided selectively in contact with the low-resistance region of the semiconductor film.
Legal claims defining the scope of protection, as filed with the USPTO.
1. A semiconductor device comprising: a substrate; a gate electrode over the substrate; a semiconductor film including an oxide semiconductor material, the semiconductor film including a channel region opposed to the gate electrode, a low-resistance region having a lower electric resistance than the channel region, and an intermediate region between the low-resistance region and the channel region, wherein the intermediate region has a dimension of no less than 1 μm nor more than 3 μm in a channel length direction; and a conductive film provided selectively in contact with the low-resistance region of the semiconductor film, wherein the conductive film is between the substrate and the semiconductor film, and the gate electrode does not overlap the conductive film in a plan view.
2. The semiconductor device according to claim 1 , further comprising: a gate insulating film between the gate electrode and the semiconductor film, wherein the gate electrode, the gate insulating film, and the semiconductor film are provided in this order over the substrate.
3. The semiconductor device according to claim 1 , further comprising a metal oxide film that is in contact with at least the intermediate region of the semiconductor film.
4. The semiconductor device according to claim 1 , wherein the conductive film includes an oxide.
5. The semiconductor device according to claim 4 , wherein the semiconductor film includes a metal, and the conductive film includes the metal that is same as the metal included in the semiconductor film.
6. The semiconductor device according to claim 1 , further comprising: a gate insulating film between the gate electrode and the semiconductor film, wherein the semiconductor film, the gate insulating film, and the gate electrode are provided in this order over the substrate.
7. The semiconductor device according to claim 6 , wherein the gate electrode and the gate insulating film have an identical planar shape.
8. The semiconductor device according to claim 1 , further comprising: a contact electrode electrically connected to the low-resistance region, wherein the semiconductor film is between the conductive film and the contact electrode.
9. The semiconductor device according to claim 8 , wherein the contact electrode directly contacts the semiconductor film, and the conductive film directly contacts the semiconductor film.
11. The semiconductor device according to claim 10 , wherein the conductive auxiliary film includes aluminum.
12. The semiconductor device according to claim 10 , wherein the conductive auxiliary film include a hydrogen-containing film.
13. The semiconductor device according to claim 10 , wherein the carrier concentration C2 in the intermediate region of the semiconductor film is no higher than 1.4×10 20 cm −3 .
14. The semiconductor device according to claim 10 , further comprising: a gate insulating film between the gate electrode and the semiconductor film, wherein the semiconductor film, the gate insulating film, and the gate electrode are provided in this order over the substrate.
15. The semiconductor device according to claim 10 , further comprising: a gate insulating film between the gate electrode and the semiconductor film, wherein the gate electrode, the gate insulating film, and the semiconductor film are provided in this order over the substrate.
16. The semiconductor device according to claim 10 , further comprising: a contact electrode electrically connected to the low-resistance region, wherein the contact electrode directly contacts a first side of the semiconductor film, and the conductive auxiliary film directly contacts a second side of the semiconductor film opposite to the first side.
18. The display apparatus according to claim 17 , wherein the contact electrode directly contacts the conductive auxiliary film.
19. The display apparatus according to claim 18 , wherein the conductive auxiliary film directly contacts the semiconductor film.
Cooperative Patent Classification codes for this invention. Click any code to explore related patents in that topic.
January 8, 2020
November 30, 2021
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