A self-emissive element includes a light-emitting diode (LED) and an auxiliary structure. The LED includes a first type semiconductor, a second type semiconductor, a first pad, and a second pad. The second type semiconductor is overlapped with the first type semiconductor in a vertical direction perpendicular. The auxiliary structure includes a cover portion, a protection portion and a first anchor portion. The cover portion is overlapped with the LED in the vertical direction. The protection portion is not overlapped with the LED in the vertical direction. An orthographic projection area of the protection portion in the vertical direction is greater than or equal to an orthographic projection area of the LED in the vertical direction. The first anchor portion and the protection portion are respectively located at different sides of the LED.
Legal claims defining the scope of protection, as filed with the USPTO.
1. A self-emissive element comprising: a light-emitting diode comprising: a first type semiconductor; a second type semiconductor overlapped with the first type semiconductor in a vertical direction perpendicular to a bottom surface of the first type semiconductor; an active layer disposed between the first type semiconductor and the second type semiconductor; a first pad connecting with the first type semiconductor; and a second pad connecting with the second type semiconductor; and an auxiliary structure, including: a cover portion overlapped with the light-emitting diodes in the vertical direction; a protection portion not overlapped with the light-emitting diode in the vertical direction, wherein an orthographic projection area of the protection portion in the vertical direction is greater than or equal to an orthographic projection area of the light emitting diode in the vertical direction; and a first anchor portion, wherein the first anchor portion and the protection portion are respectively located at different sides of the light-emitting diode, wherein the protection portion and the first anchor portion are not overlapped with the first pad and the second pad in the vertical direction.
2. The self-emissive element as claimed in claim 1 , wherein a material of the auxiliary structure comprises a dielectric material, a semiconductor material, a conductor material or a stack of any two of above.
3. The self-emissive element as claimed in claim 1 , wherein the first pad and the second pad are respectively located on different sides of the light-emitting diode.
4. The self-emissive element as claimed in claim 1 , wherein the first pad and the second pad are located on a same side of the light-emitting diode.
5. The self-emissive element as claimed in claim 1 , wherein the auxiliary structure further includes a second anchor portion, wherein the first anchor portion and the second anchor portion are respectively located at different sides of the light-emitting diode, and the second anchor portion and the protection portion are respectively located at different sides of the light-emitting diode.
6. A manufacturing method of a light-emitting device, comprising: providing a pixel circuit substrate, wherein the pixel circuit substrate comprises a plurality of driving structures, each of the driving structures including a first electrode and a second electrode; performing a first transposition process to provide a first light-emitting element on one of the driving structures, wherein the first light-emitting element is the self-emissive element as described in claim 1 ; electrically connecting a first pad of the first light-emitting element to the first electrode of the one of the driving structures; electrically connecting a second pad of the first light-emitting element to the second electrode of the one of the driving structures; and performing a second transposition process to provide a second light-emitting element on another of the driving structures, wherein the second light-emitting element is the self-emissive element as described in claim 1 .
7. The manufacturing method as claimed in claim 6 , wherein each of the driving structures further includes a first auxiliary electrode and a second auxiliary electrode, wherein the first auxiliary electrode is structurally connected with the first electrode and has a same electric potential with the first electrode, and the second auxiliary electrode is structurally connected with the second electrode and has a same electric potential with the second electrode.
8. The manufacturing method as claimed in claim 6 , wherein each of the driving structures further includes a first auxiliary electrode and a second auxiliary electrode, wherein the first auxiliary electrode is structurally separated from the first electrode and has a same electric potential with the first electrode, and the second auxiliary electrode is structurally separated from the second electrode and has a same electric potential with the second electrode.
9. The manufacturing method as claimed in claim 6 , further comprises: forming a first conductive layer on the first light-emitting element to electrically connect the second pad of the first light-emitting element and the second electrode of the one of the driving structures.
10. The manufacturing method as claimed in claim 9 , wherein each of the driving structures further comprises a first auxiliary electrode, and the first auxiliary electrode of the one of the driving structures has a same electric potential with the first electrode of the one of the driving structures.
11. The manufacturing method as claimed in claim 10 , wherein a protection portion of the first light-emitting element overlaps the first auxiliary electrode in the vertical direction.
12. The manufacturing method as claimed in claim 10 , further comprises: electrically connecting a first pad of the second light-emitting element to the first auxiliary electrode of the another of the driving structures; and forming a second conductive layer on the second light-emitting element to electrically connect a second pad of the second light-emitting element to the second electrode of the another of the driving structures.
13. The manufacturing method as claimed in claim 6 , further comprises forming an adhesive layer on the pixel circuit substrate; forming a first conductive layer on the first light-emitting element to electrically connect the first pad of the first light-emitting element to the first electrode of the one of the driving structures; and forming a second conductive layer on the first light-emitting element to electrically connect the second pad of the first light-emitting element and the second electrode of the one of the driving structures.
14. The manufacturing method as claimed in claim 13 , wherein a cover portion of an auxiliary structure of the first light-emitting element and a protection portion overlap the adhesive layer in the vertical direction.
15. The manufacturing method as claimed in claim 6 , wherein the first pad of the first light-emitting element and the second pad of the first light-emitting element face the pixel circuit substrate.
16. The manufacturing method as claimed in claim 15 , wherein each of the driving structures further includes a first auxiliary electrode and a second auxiliary electrode, wherein the first auxiliary electrode of the one of the driving structures has a same electric potential with the first electrode of the one of the driving structures, and the second auxiliary electrode of the one of the driving structures has a same electric potential with the second electrode of the one of the driving structures.
17. The manufacturing method as claimed in claim 16 , wherein a protection portion of the first light-emitting element is overlapped with the first auxiliary electrode of the one of the driving structures and the second auxiliary electrode of the one of the driving structures.
18. The self-emissive element as claimed in claim 1 , wherein an orthographic projection area of the first anchor portion in the vertical direction is smaller than the orthographic projection area of the protection portion in the vertical direction.
19. A light-emitting device, comprising: a pixel circuit substrate, comprising: a substrate; and at least two of driving structures, located on the substrate, wherein each of the at least two of driving structures comprises: a first electrode; a second electrode; and a first auxiliary electrode, wherein the second electrode and the first electrode are separated from each other, and the second electrode and the first auxiliary electrode are separated from each other; and at least two of self-emissive elements comprising a first light-emitting element and a second light-emitting element, disposed on the pixel circuit substrate, wherein each of the first light-emitting element and the second light-emitting element comprises: a light-emitting diode comprising: a first type semiconductor; a second type semiconductor overlapped with the first type semiconductor in a vertical direction perpendicular to a bottom surface of the first type semiconductor; an active layer disposed between the first type semiconductor and the second type semiconductor; a first pad connecting with the first type semiconductor; and a second pad connecting with the second type semiconductor; and an auxiliary structure, including: a cover portion overlapped with the light-emitting diodes in the vertical direction; a protection portion not overlapped with the light-emitting diode in the vertical direction, wherein an orthographic projection area of the protection portion in the vertical direction is greater than or equal to an orthographic projection area of the light emitting diode in the vertical direction; and a first anchor portion, wherein the first anchor portion and the protection portion are respectively located at different sides of the light-emitting diode; wherein a first pad of the first light-emitting element electrically connects a first electrode of one of the at least two of driving structures, and a protection portion of the first light-emitting element covers a first auxiliary electrode of the one of the at least two of driving structures.
20. The light-emitting device as claimed in claim 19 , wherein a first pad the second light-emitting element electrically connects a first auxiliary electrode of another of the at least two of driving structures, wherein a protection portion of the second light-emitting element doesn't cover a first electrode of the another of the at least two of driving structures.
21. The light-emitting device as claimed in claim 20 , further comprises: a plurality of conductive layers comprising a first conductive layer and a second conductive layer, disposed on the pixel circuit substrate and the at least two of self-emissive elements, wherein the first conductive layer electrically connects a second pad of the first light-emitting element and a second electrode of the one of the at least two of driving structures, and the second conductive layer electrically connects a second pad of the second light-emitting element to a second electrode of the another of the at least two of driving structures.
22. The light-emitting device as claimed in claim 19 , wherein each of the at least two of driving structures further comprises a second auxiliary electrode is separated from the first electrode, and the second auxiliary electrode is separated from the first auxiliary electrode.
23. The light-emitting device as claimed in claim 19 , wherein a second pad of the first light-emitting element electrically connects a second electrode of one of the at least two of driving structures, and the protection portion of the first light-emitting element covers a second auxiliary electrode of the one of the at least two of driving structures.
24. The light-emitting device as claimed in claim 19 , wherein a first pad of the second light-emitting element electrically connects to a first auxiliary electrode of another of the at least two of driving structures, a second pad of the second light-emitting element electrically connects to a second auxiliary electrode of the another of the at least two of driving structures, wherein a protection portion of the second light-emitting element doesn't cover a first electrode and a second electrode of the another of the at least two of driving structures.
25. The self-emissive element as claimed in claim 1 , wherein the cover portion and the first anchor portion are formed with a same material.
26. The self-emissive element as claimed in claim 1 , wherein the auxiliary structure is a layered structure in contact with a top surface of the light-emitting diode, a first side of the light-emitting diode, and a second side of the light-emitting diode, wherein the first side of the light-emitting diode and the second side of the light-emitting diode are located at different sides of the top surface of the light-emitting diode, and wherein the protection portion is located on the first side of the light-emitting diode, and the first anchor portion is located on the second side of the light emitting diode.
Cooperative Patent Classification codes for this invention. Click any code to explore related patents in that topic.
October 23, 2019
November 30, 2021
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