A method for treating a substrate is provided. The method includes supplying a first treating liquid to a treating target surface of the substrate while the substrate is rotating, and subsequently, supplying a second treating liquid having a surface tension lower than a surface tension of the first treating liquid to the substrate while an evaporation inhibiting agent in a vapor state is present around the first treating liquid supplied to the substrate, such that the first treating liquid on the substrate is substituted with the second treating liquid. Thus, a vapor atmosphere may be formed around a cleaning liquid applied to the substrate. Thus, a liquid-film destroying phenomenon may be prevented in a procedure in which the cleaning liquid is replaced with an organic solvent.
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1. An apparatus for treating a substrate, the apparatus comprising: a housing having a treating space defined in the housing; a support unit for supporting the substrate in the treating space; a first treating liquid supply unit for supplying a first treating liquid to a treating target surface of the substrate supported on the support unit; a second treating liquid supply unit for supplying a second treating liquid having a surface tension lower than a surface tension of the first treating liquid to the treating target surface of the substrate supported on the support unit; a vapor generation adjustment unit for spraying an evaporation inhibiting agent in a vapor state into the treating space; and a controller connected to the first treating liquid supply unit, the second treating liquid supply unit, and the vapor generation adjustment unit, the controller configured to: control the first treating liquid supply unit to supply the first treating liquid to the treating target surface for a first time duration, while supplying the first treating liquid, control the vapor generation adjustment unit to supply the evaporation inhibiting agent in the vapor state to the treating space for a second time duration that overlaps with the first time duration, and while supplying the evaporation inhibiting agent, control the second treating liquid supply unit to supply the second treating liquid, for a third time duration that overlaps with the second time duration, to the treating target surface on which the first treating liquid has been present such that the first treating liquid on the treating target surface is replaced with the second treating liquid.
This invention relates to a substrate treatment apparatus designed to improve liquid replacement efficiency during substrate processing, particularly in semiconductor or display manufacturing. The apparatus addresses the challenge of effectively replacing a first treating liquid with a second treating liquid on a substrate surface, where the second liquid has lower surface tension than the first. Traditional methods often suffer from incomplete replacement or evaporation issues, leading to processing defects. The apparatus includes a housing with a treating space, a support unit for holding the substrate, and two liquid supply units. The first unit supplies a first treating liquid to the substrate surface, while the second unit supplies a second treating liquid with lower surface tension. A vapor generation adjustment unit sprays an evaporation-inhibiting agent in vapor form into the treating space to prevent premature evaporation. A controller coordinates the operations: it activates the first liquid supply for a first duration, simultaneously spraying the evaporation-inhibiting agent for a second overlapping duration. During this, the second liquid supply unit introduces the second treating liquid for a third overlapping duration, ensuring the first liquid is fully replaced by the second liquid on the substrate surface. This sequential yet overlapping process enhances replacement efficiency while minimizing evaporation-related defects. The system is particularly useful in wet processing steps like cleaning, etching, or coating, where precise liquid replacement is critical.
2. The apparatus of claim 1 , wherein the first treating liquid is distilled water (DIW), the second treating liquid is an organic solvent, and the evaporation inhibiting agent is water.
This invention relates to an apparatus for treating a substrate using multiple liquids, addressing challenges in substrate processing where evaporation of volatile liquids can lead to contamination or uneven treatment. The apparatus includes a first treating liquid, a second treating liquid, and an evaporation inhibiting agent to prevent unwanted evaporation during processing. The first treating liquid is distilled water (DIW), which is used for cleaning or rinsing the substrate. The second treating liquid is an organic solvent, which may be used for dissolving or removing organic contaminants. The evaporation inhibiting agent is water, which is introduced to suppress the evaporation of the organic solvent, ensuring consistent processing conditions. The apparatus may also include a substrate holder, a liquid supply system, and a control system to manage the flow and interaction of these liquids. The invention aims to improve substrate treatment efficiency and quality by maintaining stable liquid conditions, particularly in semiconductor or display manufacturing where precise cleaning and solvent-based processes are critical. The use of water as an evaporation inhibitor is particularly advantageous for organic solvents, as it forms a barrier layer that reduces vaporization without introducing additional contaminants. This approach enhances process control and reduces waste, making it suitable for high-precision applications.
3. The apparatus of claim 1 , wherein a surface tension of the evaporation inhibiting agent is greater than a surface tension of the second treating liquid.
This invention relates to an apparatus for treating a substrate, particularly in processes where evaporation of a treating liquid must be controlled. The apparatus includes a first treating liquid applicator to apply a first treating liquid to the substrate, a second treating liquid applicator to apply a second treating liquid to the substrate, and an evaporation inhibiting agent applicator to apply an evaporation inhibiting agent to the substrate. The evaporation inhibiting agent has a surface tension greater than that of the second treating liquid, ensuring it effectively covers and prevents evaporation of the second treating liquid. The apparatus may also include a drying mechanism to remove excess treating liquids or solvents from the substrate after application. The evaporation inhibiting agent is applied in a manner that allows it to form a stable layer over the second treating liquid, maintaining its effectiveness throughout the treatment process. This invention is particularly useful in semiconductor manufacturing, where precise control of liquid evaporation is critical to maintaining process consistency and yield. The apparatus ensures that the second treating liquid remains in place long enough to achieve the desired treatment effect without premature evaporation, improving overall process reliability.
4. The apparatus of claim 1 , wherein a surface tension of the evaporation inhibiting agent is equal to or greater than a surface tension of the first treating liquid.
This invention relates to an apparatus for treating a substrate, particularly in processes where evaporation of a treating liquid must be controlled. The problem addressed is the unintended evaporation of volatile treating liquids during substrate processing, which can lead to inconsistencies in treatment quality, waste of materials, and environmental concerns. The apparatus includes a treating liquid applicator that dispenses a first treating liquid onto a substrate. To prevent evaporation, an evaporation inhibiting agent is applied to the substrate before, during, or after the application of the first treating liquid. The evaporation inhibiting agent has a surface tension equal to or greater than that of the first treating liquid, ensuring it effectively covers and seals the treating liquid, reducing evaporation. The apparatus may also include a second treating liquid applicator to apply a second treating liquid, which may have a different composition or function from the first treating liquid. The evaporation inhibiting agent can be applied in a controlled manner, such as via a spray, coating, or immersion system, to ensure uniform coverage. The substrate may be a semiconductor wafer, display panel, or other precision-manufactured component where evaporation control is critical. The invention improves process efficiency, reduces material waste, and enhances treatment uniformity by minimizing evaporation losses.
5. The apparatus of claim 1 , wherein the evaporation inhibiting agent is the same type as the first treating liquid.
This invention relates to an apparatus for treating a substrate, particularly for applying a first treating liquid to the substrate while minimizing evaporation. The apparatus includes a first treating liquid supply unit that dispenses the first treating liquid onto the substrate. To prevent excessive evaporation of the first treating liquid, the apparatus incorporates an evaporation inhibiting agent. The evaporation inhibiting agent is of the same type as the first treating liquid, meaning it has similar chemical properties or composition, ensuring compatibility and effective evaporation suppression. The apparatus may also include a second treating liquid supply unit that dispenses a second treating liquid onto the substrate, where the second treating liquid differs from the first treating liquid. The evaporation inhibiting agent may be applied before, during, or after the application of the first treating liquid to form a protective layer that reduces evaporation. The apparatus may further include a control unit that regulates the supply of the treating liquids and the evaporation inhibiting agent to optimize the treatment process. The invention is particularly useful in industrial or laboratory settings where precise application of liquids is required, and evaporation control is critical for maintaining consistency and efficiency.
6. The apparatus of claim 1 , wherein during the overlap of the second time duration and the third time duration, the controller is further configured to: control the vapor generation adjustment unit to maintain a relative humidity of the evaporation inhibiting agent in the treating space at 100% by supplying the evaporation inhibiting agent in the vapor state to the treating space, and control the second treating liquid supply unit to supply the second treating liquid while the relative humidity is maintained at 100%.
This invention relates to an apparatus for treating an object, such as laundry, in a controlled environment. The apparatus addresses the problem of evaporation of a treating liquid during a treatment process, which can reduce the effectiveness of the treatment. The apparatus includes a treating chamber, a vapor generation adjustment unit, and a controller. The vapor generation adjustment unit is configured to supply an evaporation inhibiting agent in vapor form to the treating chamber. The controller regulates the supply of the vapor to maintain a relative humidity of the evaporation inhibiting agent at 100% within the treating chamber. Additionally, the apparatus includes a second treating liquid supply unit that dispenses a second treating liquid into the treating chamber while the relative humidity is maintained at 100%. This ensures that the second treating liquid does not evaporate prematurely, enhancing the treatment efficiency. The controller coordinates the timing of the vapor supply and the liquid supply to overlap, ensuring optimal conditions for the treatment process. The invention is particularly useful in laundry treatment systems where maintaining precise humidity levels is critical for effective cleaning or conditioning.
7. The apparatus of claim 1 , further comprising a relative humidity measurement device for measuring a relative humidity of the treating space in the housing.
This invention relates to an apparatus for treating a space, such as a chamber or housing, with controlled environmental conditions. The apparatus includes a housing defining a treating space, a treatment system for modifying conditions within the treating space, and a relative humidity measurement device. The relative humidity measurement device is configured to measure the relative humidity of the treating space inside the housing. The treatment system may include components for adjusting temperature, humidity, or other environmental parameters to maintain desired conditions within the treating space. The relative humidity measurement device provides real-time data to monitor and regulate humidity levels, ensuring optimal treatment conditions. This apparatus is useful in applications requiring precise environmental control, such as medical storage, laboratory testing, or industrial processes where humidity must be carefully managed. The inclusion of the relative humidity measurement device enhances the accuracy and reliability of the treatment system by enabling continuous feedback and adjustments.
8. The apparatus of claim 1 , wherein the second time duration is longer than the third time duration and the second time duration includes all of the third time duration.
This invention relates to an apparatus for managing time-based operations, particularly in systems where precise timing control is critical. The apparatus addresses the challenge of coordinating multiple time intervals to ensure proper sequencing and synchronization of events. The core functionality involves defining and managing distinct time durations to regulate the timing of operations within a system. The apparatus includes a timing control module that defines a first time duration, a second time duration, and a third time duration. The second time duration is longer than the third time duration and fully encompasses the third time duration, meaning the third time duration is entirely contained within the second time duration. This hierarchical relationship ensures that operations triggered by the third time duration occur within the constraints of the second time duration, preventing conflicts or overlaps. The timing control module also includes a synchronization mechanism to align the start and end points of these time durations with external or internal system events. This ensures that the timing operations are synchronized with other system processes, maintaining consistency and reliability. The apparatus may further include a monitoring module to track the progression of these time durations and adjust timing parameters dynamically based on system conditions or user inputs. The invention is particularly useful in applications requiring precise timing control, such as industrial automation, communication systems, or real-time data processing, where overlapping or misaligned time intervals could lead to system errors or inefficiencies. By enforcing a structured hierarchy of time durations, the apparatus ensures that operations are executed in the correct sequ
9. The apparatus of claim 1 , wherein the controller is configured to: before starting supplying the first treating liquid, start the control of the vapor generation adjustment unit to supply the evaporation inhibiting agent in the vapor state to the treating space.
This invention relates to an apparatus for treating a substrate, such as a semiconductor wafer, using a treating liquid and vapor. The problem addressed is controlling the environment within the treating space to prevent unwanted evaporation of the treating liquid during processing, which can lead to inconsistencies in treatment. The apparatus includes a treating space where the substrate is exposed to a first treating liquid and a vapor. A vapor generation adjustment unit is provided to supply an evaporation inhibiting agent in vapor form to the treating space. A controller regulates the vapor generation adjustment unit to ensure precise control over the vapor supply. Before the first treating liquid is introduced, the controller activates the vapor generation adjustment unit to supply the evaporation inhibiting agent in vapor form to the treating space. This pre-treatment step helps stabilize the environment, preventing premature evaporation of the treating liquid when it is later introduced. The evaporation inhibiting agent in vapor form creates a controlled atmosphere that minimizes unwanted evaporation, ensuring uniform treatment of the substrate. The controller's pre-treatment adjustment ensures optimal conditions are established before the treating liquid is applied, improving process consistency and yield. This method is particularly useful in semiconductor manufacturing, where precise control of liquid and vapor interactions is critical.
10. The apparatus of claim 1 , further comprising a chemical supply unit for supplying a chemical to the treating target surface of the substrate, wherein the controller is further configured to: control the chemical supply unit to supply the chemical to the treating target surface for a fourth time duration, and while supplying the chemical to the treating target surface, start the control the vapor generation adjustment unit to supply the evaporation inhibiting agent in the vapor state to the treating space, wherein the second time duration overlaps with the fourth time duration and the second time duration comprises all of the first time duration and all of the third time duration.
This invention relates to an apparatus for treating a substrate surface, particularly in processes where precise control of chemical application and vapor conditions is critical, such as semiconductor manufacturing or surface coating. The apparatus addresses the challenge of maintaining consistent treatment conditions by dynamically adjusting vapor generation and chemical supply to prevent unwanted evaporation or contamination. The apparatus includes a vapor generation adjustment unit that supplies an evaporation inhibiting agent in vapor form to a treating space containing the substrate. The controller regulates this unit to supply the agent for a first time duration, ensuring stable vapor conditions. Additionally, a chemical supply unit delivers a chemical to the substrate's treating target surface for a second time duration, which overlaps with the first duration. The controller ensures the second duration encompasses both the first duration and a third duration, during which the vapor generation adjustment unit operates to maintain the agent's presence. The invention further specifies that while the chemical is being applied, the vapor generation adjustment unit is activated to supply the evaporation inhibiting agent, ensuring the chemical remains effective without premature evaporation. This coordinated control prevents inconsistencies in treatment quality, improving process reliability. The apparatus is particularly useful in applications requiring precise chemical deposition or surface modification under controlled vapor environments.
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May 14, 2020
January 25, 2022
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