According to one embodiment, the electrode pads are provided at a surface of the substrate. The metal pad is provided at the surface of the substrate. The electronic component is mounted to the surface of the substrate. The electronic component includes a plurality of opposing electrodes. The opposing electrodes oppose the electrode pads in a direction toward the surface direction and are electrically connected to the electrode pads. The positioning component is fixed to the metal pad. A gap between the positioning component and the electronic component in an in-plane direction of the surface of the substrate is shorter than a minimum distance of the electrode pads.
Legal claims defining the scope of protection. Each claim is shown in both the original legal language and a plain English translation.
1. An electronic component module, comprising: a substrate; a plurality of electrode pads provided at a surface of the substrate; at least one metal pad provided at the surface of the substrate; an electronic component mounted to the surface of the substrate, the electronic component including a plurality of opposing electrodes, the plurality of opposing electrodes opposing the plurality of electrode pads in a direction toward the surface direction and being electrically connected to the plurality of electrode pads; and at least one positioning component fixed to the metal pad with a bonding material different from a material of the positioning component, a gap between the positioning component and the electronic component in an in-plane direction of the surface of the substrate being shorter than a minimum distance of the plurality of electrode pads.
This invention relates to an electronic component module designed to improve alignment and assembly precision in electronic packaging. The module addresses challenges in accurately positioning electronic components relative to substrate electrode pads, which is critical for reliable electrical connections in high-density electronic devices. The module includes a substrate with multiple electrode pads and at least one metal pad on its surface. An electronic component is mounted on the substrate, featuring opposing electrodes that align with and electrically connect to the substrate's electrode pads. To enhance positional accuracy, a positioning component is fixed to the metal pad using a bonding material distinct from the positioning component's material. This positioning component is placed such that the gap between it and the electronic component in the substrate's plane is shorter than the minimum distance between adjacent electrode pads. This ensures precise alignment of the electronic component's electrodes with the substrate's electrode pads, reducing misalignment risks during assembly. The use of a separate bonding material for the positioning component allows for optimized mechanical and thermal properties, further improving reliability. This design is particularly useful in applications requiring high-precision component placement, such as advanced semiconductor packaging and microelectronic systems.
2. The module according to claim 1 , wherein the bonding material includes a solder, a metal film is provided at a surface of the positioning component facing the metal pad, and the positioning component is fixed to the metal pad by the solder.
This invention relates to a module with an improved bonding structure for attaching a positioning component to a metal pad. The problem addressed is ensuring reliable mechanical and electrical connections between components in electronic or optoelectronic modules, particularly where precise alignment and robust bonding are critical. The module includes a positioning component that is fixed to a metal pad using a solder bonding material. A metal film is provided on the surface of the positioning component that faces the metal pad, enhancing adhesion and electrical conductivity. The solder material bonds the metal film to the metal pad, creating a strong and stable connection. This design ensures proper alignment of the positioning component while maintaining electrical continuity and mechanical stability under operational conditions. The use of solder and a metal film improves bonding strength and reliability compared to traditional adhesive or mechanical fastening methods. This solution is particularly useful in applications requiring precise component positioning, such as in optical modules, semiconductor packaging, or high-precision electronic assemblies. The invention focuses on optimizing the bonding interface to prevent detachment or misalignment due to thermal cycling, vibration, or other environmental factors.
3. The module according to claim 1 , wherein the electrode pad and the metal pad are of the same material and have the same thickness.
This invention relates to a module with an electrode pad and a metal pad, addressing issues of material compatibility and structural uniformity in electronic or semiconductor devices. The module includes a substrate with an electrode pad and a metal pad, where both pads are made of the same material and have identical thickness. This design ensures consistent electrical and mechanical properties, reducing stress, improving reliability, and simplifying manufacturing processes. The electrode pad is electrically connected to a semiconductor device, while the metal pad is bonded to a circuit board or another component. By using the same material and thickness for both pads, the module avoids mismatches that could lead to thermal expansion differences, delamination, or electrical performance degradation. The uniform structure also enhances heat dissipation and signal integrity. This approach is particularly useful in high-performance applications where precision and durability are critical, such as in integrated circuits, power electronics, or sensor systems. The invention focuses on optimizing the interface between semiconductor devices and external circuits by eliminating material and thickness disparities, thereby improving overall device performance and longevity.
4. The module according to claim 3 , wherein the metal pad has an isolated pattern provided at the surface of the substrate, or the metal pad is limited to an opening in a solder resist.
This invention relates to a module with an improved metal pad structure for electrical connections, addressing issues such as signal integrity, reliability, and manufacturing precision in electronic packaging. The module includes a substrate with a metal pad designed to enhance connectivity between components. The metal pad features an isolated pattern on the substrate surface or is confined within an opening in a solder resist layer. The isolated pattern ensures controlled electrical contact, reducing unintended signal interference or short circuits. The solder resist opening restricts the metal pad area, improving solder joint accuracy and preventing solder bridging. This design is particularly useful in high-density interconnect applications where precise electrical connections are critical. The module may also include additional features such as conductive vias or insulating layers to further optimize performance. The invention aims to improve manufacturing yield and long-term reliability by minimizing defects in soldering processes and ensuring consistent electrical performance.
5. The module according to claim 1 , wherein the positioning component has a side surface, an upper surface, and an oblique surface, the side surface facing the electronic component, the oblique surface being provided between the side surface and the upper surface, and being oblique to the side surface and the upper surface.
This invention relates to a positioning module for electronic components, addressing the challenge of precisely aligning and securing components during assembly. The module includes a positioning component designed to interface with an electronic component, ensuring accurate placement and stability. The positioning component features a side surface that directly faces the electronic component, an upper surface, and an oblique surface positioned between the side and upper surfaces. The oblique surface is angled relative to both the side and upper surfaces, creating a tapered or inclined interface. This design facilitates smooth insertion of the electronic component while preventing lateral movement, enhancing alignment accuracy and mechanical stability. The oblique surface may also aid in guiding the component into position during assembly, reducing misalignment risks. The module may further include additional structural elements, such as mounting features or alignment guides, to integrate with surrounding components or substrates. The overall structure ensures reliable positioning, minimizing assembly errors and improving manufacturing efficiency in electronic device production.
6. The module according to claim 1 , wherein a side surface of the positioning component faces the electronic component at three or more portions.
This invention relates to a module for positioning an electronic component, addressing the challenge of ensuring precise and stable alignment between the component and its mounting structure. The module includes a positioning component designed to interface with the electronic component, where the side surface of this component faces the electronic component at three or more distinct portions. This multi-point contact enhances stability and reduces misalignment, particularly in applications where vibration or thermal expansion could otherwise compromise positioning accuracy. The positioning component may be integrated into a housing or frame that supports the electronic component, ensuring consistent mechanical and electrical connections. The multi-point contact design minimizes stress concentrations and improves heat dissipation, which is critical for high-performance electronic systems. The invention is particularly useful in compact or high-precision applications, such as microelectronics, sensors, or communication devices, where component alignment directly impacts performance and reliability. The positioning component may be adjustable or fixed, depending on the application requirements, and can be fabricated from materials optimized for thermal and mechanical stability. This design ensures long-term durability and operational consistency in demanding environments.
7. The module according to claim 1 , further comprising an anisotropic conductive member electrically connecting the plurality of opposing electrodes of the electronic component and the plurality of electrode pads, and being provided between the plurality of opposing electrodes and the plurality of electrode pads.
This invention relates to electronic modules with improved electrical connections between components and substrates. The problem addressed is ensuring reliable electrical conductivity while maintaining precise alignment and mechanical stability in compact electronic assemblies. The module includes an electronic component with a plurality of opposing electrodes and a substrate with a plurality of electrode pads. An anisotropic conductive member is positioned between the electrodes and pads, providing electrical connectivity only in the vertical direction while preventing lateral conduction. This ensures proper signal transmission without short circuits between adjacent connections. The conductive member may consist of conductive particles embedded in an insulating matrix, aligning under pressure to form conductive pathways. The module may also include a support structure to align and secure the electronic component relative to the substrate, ensuring consistent contact pressure. The support structure can be a frame or housing that positions the component and substrate in fixed relation, facilitating assembly and maintaining connection integrity during operation. The anisotropic conductive member is designed to accommodate variations in electrode and pad alignment while maintaining reliable electrical contact. This technology is particularly useful in high-density electronic packaging where precise, stable connections are required, such as in semiconductor devices, sensors, or microelectronic assemblies. The anisotropic conductive member enables efficient manufacturing while reducing the risk of electrical faults.
8. The module according to claim 1 , further comprising a pressing member pressing the electronic component toward the surface of the substrate.
This invention relates to a module for mounting an electronic component on a substrate, addressing the challenge of ensuring stable and reliable electrical connections between the component and the substrate. The module includes a substrate with a surface, an electronic component positioned on the substrate, and a pressing member that applies force to the electronic component, pressing it toward the substrate surface. This pressing action enhances contact between the component and the substrate, improving electrical conductivity and mechanical stability. The pressing member may be a spring-loaded mechanism, a clamp, or another force-applying structure designed to maintain consistent pressure. The module may also include alignment features to ensure precise positioning of the electronic component relative to the substrate. The pressing member can be adjustable to accommodate different component sizes or substrate configurations. This design is particularly useful in applications where vibration, thermal expansion, or mechanical stress could otherwise disrupt the connection between the electronic component and the substrate. The invention ensures long-term reliability by minimizing contact resistance and preventing detachment or misalignment of the component.
9. An electronic component module, comprising: a substrate; a plurality of electrode pads provided at a surface of the substrate; at least three metal pads provided at the surface of the substrate, an arrangement relationship of the at least three metal pads at the surface of the substrate causing lines connecting the at least three metal pads to each other to include a triangle; an electronic component mounted to the surface of the substrate, the electronic component including a plurality of opposing electrodes, the plurality of opposing electrodes opposing the plurality of electrode pads in a direction toward the surface direction and being electrically connected to the plurality of electrode pads; and at least three positioning components fixed to the metal pads with a bonding material different from a material of the positioning component, a gap between the positioning component and the electronic component in an in-plane direction of the surface of the substrate being shorter than a minimum distance of the plurality of electrode pads.
This invention relates to an electronic component module designed to improve alignment and stability of electronic components during assembly. The module addresses challenges in precisely positioning components on substrates, particularly for high-density or high-precision applications where misalignment can lead to electrical failures or performance degradation. The module includes a substrate with multiple electrode pads on its surface, which are used to electrically connect to an electronic component mounted on the substrate. The component has opposing electrodes that align with and connect to these electrode pads. To ensure accurate positioning, the module incorporates at least three metal pads arranged in a triangular formation on the substrate. These metal pads are bonded to positioning components using a bonding material that differs from the material of the positioning components themselves. The positioning components are placed such that the gap between them and the electronic component in the plane of the substrate is smaller than the minimum distance between the electrode pads. This triangular arrangement and precise spacing help maintain the component's alignment during assembly and operation, reducing the risk of misalignment-induced defects. The bonding material ensures secure attachment while allowing for thermal expansion and mechanical stress accommodation. This design is particularly useful in applications requiring high reliability, such as in advanced semiconductor packaging or high-frequency electronic devices.
10. The module according to claim 9 , wherein a side surface of the positioning component faces the electronic component at three or more portions.
This invention relates to a positioning module for electronic components, addressing the challenge of precise alignment and secure retention of electronic components during assembly or testing. The module includes a positioning component designed to interface with an electronic component, ensuring accurate placement and stability. The positioning component has a side surface that directly faces the electronic component at three or more distinct portions, enhancing contact and reducing movement. This multi-point contact improves alignment accuracy and minimizes positional deviations, which is critical for high-precision applications such as semiconductor testing or automated assembly. The module may also incorporate a base structure that supports the positioning component, allowing for adjustable positioning or integration with other mechanical systems. The design ensures that the electronic component remains securely held while allowing access for electrical connections or testing probes. The multi-point contact feature distinguishes this module from traditional single-point or two-point positioning systems, offering superior stability and repeatability in electronic component handling.
11. The module according to claim 9 , further comprising an anisotropic conductive member electrically connecting the plurality of opposing electrodes of the electronic component and the plurality of electrode pads, and being provided between the plurality of opposing electrodes and the plurality of electrode pads.
This invention relates to electronic modules with improved electrical connections between components and substrates. The problem addressed is ensuring reliable electrical conductivity while maintaining precise alignment and mechanical stability in compact electronic assemblies. The module includes an electronic component with a plurality of opposing electrodes and a substrate with a plurality of electrode pads. An anisotropic conductive member is positioned between the electrodes and pads to establish electrical connections. The anisotropic conductive member conducts electricity only in specific directions, preventing short circuits between adjacent connections. This design allows for high-density interconnections in a compact form factor while maintaining signal integrity. The electronic component is mounted on the substrate, with the opposing electrodes facing the electrode pads. The anisotropic conductive member ensures that each electrode is electrically connected to its corresponding pad without cross-talk or misalignment. The module may also include a sealing member to protect the connections from environmental factors. This configuration is particularly useful in applications requiring high reliability and miniaturization, such as in consumer electronics, automotive systems, and medical devices. The invention improves upon prior art by providing a more robust and scalable solution for high-density interconnects.
12. The module according to claim 9 , further comprising a pressing member pressing the electronic component toward the surface of the substrate.
Semiconductor manufacturing. This describes a module for handling electronic components during manufacturing, specifically addressing the need for secure and reliable contact with a substrate. The module includes a pressing member. This pressing member is configured to apply force to an electronic component. The purpose of this applied force is to press the electronic component against the surface of a substrate. This ensures firm and consistent contact between the electronic component and the substrate during manufacturing processes.
13. The module according to claim 1 , wherein the bonding material includes a silver paste, a metal film is provided at a surface of the positioning component facing the metal pad, and the positioning component is fixed to the metal pad by the silver paste.
This invention relates to a module for electronic devices, particularly focusing on the bonding and positioning of components. The problem addressed is the reliable and precise attachment of a positioning component to a metal pad, ensuring stable electrical and mechanical connections in electronic assemblies. The module includes a positioning component that is fixed to a metal pad using a bonding material. The bonding material is a silver paste, which provides both electrical conductivity and mechanical adhesion. A metal film is applied to the surface of the positioning component that faces the metal pad, enhancing the bonding strength and electrical contact between the two surfaces. The silver paste is applied between the metal film and the metal pad, creating a strong and conductive bond. This design ensures that the positioning component remains securely attached to the metal pad while maintaining optimal electrical performance. The metal film on the positioning component improves adhesion with the silver paste, reducing the risk of detachment or poor conductivity. The use of silver paste as the bonding material ensures high thermal and electrical conductivity, which is critical for applications requiring reliable power transmission or signal integrity. This configuration is particularly useful in electronic modules where precise positioning and stable connections are essential, such as in power electronics, sensors, or high-frequency devices. The invention provides a robust solution for attaching components in electronic assemblies while maintaining electrical and mechanical reliability.
14. The module according to claim 1 , wherein a material of the positioning component includes a ceramic.
This invention relates to a positioning module used in precision engineering or manufacturing systems, particularly for aligning or securing components with high accuracy. The module addresses the challenge of maintaining precise positioning under varying environmental conditions, such as temperature fluctuations or mechanical stress, which can cause misalignment or degradation in performance. The positioning module includes a positioning component designed to hold or adjust the position of a workpiece or tool with sub-micron precision. The material of this positioning component is specified to include a ceramic, which provides high stiffness, thermal stability, and resistance to wear. Ceramics are chosen for their ability to maintain dimensional accuracy in harsh environments, reducing the risk of thermal expansion or deformation compared to metals or polymers. The module may also incorporate additional features, such as actuators or sensors, to enable active positioning adjustments or real-time monitoring of alignment. The ceramic material ensures that these adjustments remain precise and repeatable, even under dynamic operating conditions. This design is particularly useful in applications like semiconductor manufacturing, optical systems, or high-precision machining, where stability and accuracy are critical. The use of ceramics enhances durability and reliability, extending the module's operational lifespan.
15. The module according to claim 1 , wherein a material of the positioning component includes silicon.
A positioning component made of silicon is used in a module designed for precise alignment or positioning of components in electronic or mechanical systems. The module addresses challenges in maintaining accurate positioning under varying environmental conditions, such as thermal expansion or mechanical stress, which can disrupt alignment in high-precision applications. Silicon is chosen for its thermal stability, mechanical strength, and compatibility with semiconductor manufacturing processes, ensuring consistent performance. The positioning component may include structural elements like guides, supports, or alignment features that interface with other module components, such as optical elements, sensors, or microelectronic devices. The use of silicon allows for precise fabrication using techniques like etching or lithography, enabling sub-micron tolerances. The module may also incorporate additional features, such as thermal management elements or electrical interconnects, to enhance functionality. The silicon-based positioning component ensures reliable operation in applications requiring high precision, such as semiconductor manufacturing, optical systems, or medical devices.
16. The module according to claim 1 , wherein a material of the positioning component includes glass.
A positioning component made of glass is used in a module designed for precise alignment or positioning of optical or mechanical elements. The module addresses challenges in maintaining accurate alignment under varying environmental conditions, such as temperature fluctuations or mechanical stress, which can cause misalignment in traditional materials. Glass offers high dimensional stability, low thermal expansion, and resistance to deformation, making it suitable for applications requiring long-term precision. The positioning component may include features like grooves, slots, or mounting surfaces to interface with other module components, ensuring consistent alignment of optical fibers, lenses, or other elements. The use of glass also provides chemical resistance and transparency, which are beneficial in optical systems where light transmission is critical. This design is particularly useful in telecommunications, laser systems, or high-precision instrumentation where alignment accuracy directly impacts performance. The module may further include additional components, such as housings or fasteners, to secure the positioning component and maintain its alignment under operational conditions. The glass material may be selected based on specific optical or mechanical properties, such as refractive index or hardness, to optimize performance for the intended application.
17. The module according to claim 9 , wherein a material of the positioning component includes a ceramic.
A positioning component for use in a module, particularly in applications requiring precise alignment or structural support, is disclosed. The component is designed to maintain accurate positioning of elements within the module, ensuring consistent performance and reliability. The positioning component is constructed from a ceramic material, which provides high strength, thermal stability, and resistance to wear, making it suitable for demanding environments. Ceramics are particularly advantageous in applications where thermal expansion mismatches or chemical corrosion could otherwise degrade performance. The component may be integrated into a larger assembly, such as a sensor, actuator, or electronic module, where precise positioning is critical. The use of ceramic materials ensures long-term durability and minimal dimensional changes under varying operational conditions. This design addresses challenges in maintaining alignment and structural integrity in high-precision or high-stress applications, such as aerospace, automotive, or industrial systems. The ceramic positioning component may also include additional features, such as mounting interfaces or alignment guides, to facilitate integration into the module. The overall solution enhances the module's reliability and performance by leveraging the inherent properties of ceramic materials.
18. The module according to claim 9 , wherein a material of the positioning component includes silicon.
This invention relates to a module for positioning components in semiconductor manufacturing or microelectromechanical systems (MEMS). The problem addressed is the need for precise, stable positioning of components during fabrication or operation, particularly in environments where thermal expansion or mechanical stress could cause misalignment. The module includes a positioning component that holds or aligns other components with high precision. The positioning component is made of silicon, which provides excellent thermal stability, low thermal expansion, and compatibility with semiconductor processes. Silicon is also easily machined at micro and nanoscales, allowing for precise structural features. The positioning component may include features such as grooves, holes, or surfaces that interface with other components to ensure accurate alignment. The module may also include additional structural elements, such as supports or fasteners, to maintain the position of the components under external forces. The use of silicon ensures that the positioning component does not deform significantly under temperature changes, which is critical in semiconductor and MEMS applications where thermal cycling is common. The material choice also allows for integration with other silicon-based components, reducing assembly complexity. The module may be used in wafer-level packaging, sensor alignment, or microactuator positioning, among other applications.
19. The module according to claim 9 , wherein a material of the positioning component includes glass.
A system for precise positioning in optical or electronic devices addresses the challenge of maintaining alignment and stability in components subjected to environmental stresses or mechanical vibrations. The invention includes a positioning component designed to securely hold and adjust the position of optical or mechanical elements, such as lenses, sensors, or circuit boards, within a housing. The positioning component is constructed from a rigid material, such as glass, to ensure dimensional stability and resistance to thermal expansion or deformation. The component features adjustable mechanisms, such as threaded rods or sliding rails, allowing fine-tuning of the element's position in multiple axes. The glass material provides high transparency for optical applications while maintaining structural integrity. The system may also include damping elements to reduce vibrations and locking mechanisms to secure the adjusted position. This design ensures long-term reliability in applications requiring precise alignment, such as microscopy, telecommunications, or semiconductor manufacturing. The use of glass enhances durability and precision, particularly in environments with temperature fluctuations or mechanical stress.
20. The module according to claim 1 , wherein the bonding material includes a solder, a metal film is provided at a surface of the positioning component facing the metal pad, and the positioning component is fixed to the metal pad by the solder.
This invention relates to a module with an improved bonding structure for attaching a positioning component to a metal pad. The problem addressed is ensuring reliable mechanical and electrical connection between the positioning component and the metal pad, particularly in applications where stability and conductivity are critical. The module includes a positioning component and a metal pad, where the positioning component is fixed to the metal pad using a bonding material. The bonding material is a solder, which provides both mechanical adhesion and electrical conductivity. A metal film is deposited on the surface of the positioning component that faces the metal pad. This metal film enhances the bonding strength and ensures a stable electrical connection between the positioning component and the metal pad. The solder bonds the metal film to the metal pad, forming a robust joint that resists mechanical stress and maintains electrical conductivity over time. The metal film may be composed of materials such as copper, nickel, or other conductive metals, chosen based on compatibility with the solder and the metal pad. The solder may be a lead-free or lead-containing alloy, depending on the application requirements. This design ensures that the positioning component remains securely attached to the metal pad, even under thermal cycling or mechanical vibration, while maintaining low electrical resistance. The invention is particularly useful in electronic packaging, semiconductor devices, and other applications where precise positioning and reliable electrical connections are essential.
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March 4, 2020
February 1, 2022
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