A computing system can perform a layout-to-schematic process on a geometric layout design of an integrated circuit, which can generate a device-level layout design for the integrated circuit. The computing system also can perform a parasitic extraction process on the geometric layout design by utilizing the device-level layout design for the integrated circuit. The computing system implementing the parasitic extraction process can sub-divide a conductor in the device-level layout design into multiple sub-divided conductor portions based on conversion rules corresponding to the physical properties of layers for the integrated circuit described in a technology file. The computing system can generate a physical layout design of the integrated circuit from the device-level layout design having the sub-divided conductor portions based on the technology file. The computing system can extract electrical representations of nets corresponding to the conductors in the physical layout design to form a netlist for the physical layout design.
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1. A method comprising: sub-dividing, by a computing system, at least one conductor in a device-level layout design of an integrated circuit into multiple sub-divided conductor portions based on a technology file defining physical properties for layers in the integrated circuit at a different level of granularity than in the device-level layout design, wherein the device-level layout design is generated from a geometric layout design of the integrated circuit and corresponds to a physical representation of the geometric layout design of the integrated circuit at a device-level of abstraction; modifying, by the computing system, the device-level layout design to align with the granularity of the physical properties for layers in the integrated circuit defined by the technology file by replacing the at least one conductor in the device-level layout design with the sub-divided conductor portions; generating, by the computing system, a mapping between the modified device-level layout design and rules in the technology file defining the physical properties for the layers in the integrated circuit; generating, by the computing system, a physical layout design of the integrated circuit from the modified device-level layout design having the sub-divided conductor portions by applying the rules in the technology file to different portions of the modified device-level layout design according to the mapping; and extracting, by the computing system, electrical representations of nets corresponding to the conductors in the physical layout design to form a netlist for the physical layout design.
The field of integrated circuit (IC) design involves creating physical layouts from geometric designs, ensuring compatibility with manufacturing technology files that define physical properties at a finer granularity. A challenge arises when aligning device-level layout designs with technology files, as the original designs may not match the granularity of the physical properties specified. This misalignment can lead to inaccuracies in the final physical layout and netlist generation. A method addresses this by subdividing conductors in a device-level layout design into multiple portions based on a technology file's granularity. The device-level layout, derived from a geometric layout, represents the IC at a device-level abstraction. The method modifies the layout by replacing conductors with sub-divided portions to align with the technology file's granularity. It then generates a mapping between the modified layout and the technology file's rules, which define physical properties for different layers. Using this mapping, the method applies the rules to the modified layout to produce a physical layout design. Finally, it extracts electrical representations of nets from the physical layout to form a netlist, ensuring accurate representation of the IC's connectivity. This approach improves alignment between design and manufacturing constraints, enhancing layout accuracy and netlist generation.
2. The method of claim 1 , wherein sub-dividing the conductor in the device-level layout design of the integrated circuit is performed according to conversion rules corresponding to the physical properties of layers for the integrated circuit described in the technology file.
This invention relates to integrated circuit (IC) design, specifically optimizing conductor sub-division during device-level layout design. The problem addressed is ensuring accurate and efficient conductor segmentation in IC layouts, particularly when adapting designs for different manufacturing processes or technology nodes. The method involves sub-dividing conductors in the device-level layout based on conversion rules derived from physical properties of IC layers, as specified in a technology file. These rules account for material characteristics, manufacturing constraints, and electrical performance requirements of the layers. The technology file provides parameters like layer thickness, conductivity, and fabrication tolerances, which dictate how conductors should be segmented to maintain functionality and yield. By applying these rules, the method ensures that conductor sub-division aligns with the physical capabilities and limitations of the target IC fabrication process. This approach improves design portability across different technology nodes and reduces errors in conductor routing. The method may also include generating a modified layout with the subdivided conductors, which can then be used for further IC design stages. The technology file serves as a central reference for layer-specific rules, enabling consistent conductor segmentation across various IC designs and manufacturing processes.
3. The method of claim 1 , wherein sub-dividing the conductor in the device-level layout design of the integrated circuit automatically sets connectivity for the sub-divided conductor portions based on the connectivity of the conductor prior to the sub-dividing.
This invention relates to integrated circuit (IC) design, specifically to methods for automatically subdividing conductors in a device-level layout while preserving their original connectivity. The problem addressed is the manual effort and potential errors involved in ensuring that subdivided conductor portions maintain correct electrical connections after modification. The method involves analyzing the connectivity of a conductor in the IC layout before subdivision and then automatically assigning connectivity to the resulting sub-divided portions based on the original connections. This ensures that the subdivided segments remain electrically continuous and functionally equivalent to the original conductor. The approach reduces design time and minimizes errors by eliminating the need for manual re-connection of subdivided parts. The method is particularly useful in IC design flows where conductors must be split for optimization, routing, or other layout adjustments while maintaining signal integrity. The solution automates the connectivity preservation process, improving efficiency and reliability in IC layout design.
4. The method of claim 1 , wherein the device-level layout design for the integrated circuit was generated based on a layout-to-schematic (LVS) rule deck from a foundry to manufacture the integrated circuit.
The invention relates to integrated circuit (IC) design and manufacturing, specifically addressing the challenge of ensuring accurate and manufacturable IC layouts. The method involves generating a device-level layout design for an IC using a layout-to-schematic (LVS) rule deck provided by a semiconductor foundry. The LVS rule deck defines the design rules and constraints required to ensure that the physical layout of the IC matches its intended schematic representation, which is critical for correct functionality and manufacturability. By using the foundry's LVS rule deck, the method ensures compliance with the foundry's specific manufacturing requirements, reducing errors and improving yield. The device-level layout design is generated in a way that adheres to these rules, allowing for seamless translation from the schematic to the physical layout. This approach minimizes discrepancies between the intended design and the final manufactured IC, enhancing reliability and performance. The method is particularly useful in advanced semiconductor manufacturing processes where precision and adherence to foundry-specific rules are essential.
5. The method of claim 4 , wherein the technology file defines the physical properties of the layers in the integrated circuit in a greater level of detail than the LVS rule deck defines the layers and the layer connectivity for the integrated circuit.
This invention relates to integrated circuit (IC) design verification, specifically addressing inconsistencies between detailed physical layer properties and higher-level logical connectivity rules. The problem arises when a technology file, which defines precise physical characteristics of IC layers (e.g., thickness, material properties), lacks alignment with the logical verification (LVS) rule deck, which specifies layer connectivity and design rules for circuit functionality. This misalignment can lead to manufacturing defects or functional failures despite passing LVS checks. The solution involves a method where the technology file provides more granular physical layer details than the LVS rule deck. This ensures that physical properties (e.g., layer dimensions, material composition) are accurately reflected in the verification process, reducing discrepancies between design intent and fabrication outcomes. The method may also include comparing the technology file against the LVS rule deck to identify and resolve inconsistencies, ensuring both physical and logical design requirements are met. By enhancing the detail in the technology file, the invention improves verification accuracy, minimizing errors in IC manufacturing and performance.
6. The method of claim 1 , wherein the conductor in the device-level layout design of the integrated circuit corresponds to a conductor layer in the integrated circuit or to a via coupling a plurality of the layers in the integrated circuit.
This invention relates to integrated circuit (IC) design, specifically improving the accuracy of physical verification processes for conductor layers and vias in IC layouts. The problem addressed is ensuring that conductors and vias in a device-level layout design correctly correspond to their physical implementations in the fabricated IC, which is critical for functionality and reliability. The method involves analyzing a device-level layout design to identify conductors and vias, then verifying their correspondence to specific conductor layers or via structures in the IC. Conductors in the layout are mapped to their respective layers (e.g., metal layers, polysilicon) or to vias that connect multiple layers. This ensures that the design intent matches the physical implementation, preventing misalignments or connectivity errors that could lead to manufacturing defects or circuit failures. The verification process includes checking that each conductor or via in the layout is properly assigned to its intended layer or via type, ensuring consistency between the design and the fabrication process. This step is essential for maintaining design integrity and avoiding costly rework or yield loss. The method may also involve cross-referencing design rules or process technology specifications to validate the assignments. By systematically verifying the correspondence between layout elements and their physical counterparts, this approach enhances the reliability of IC manufacturing and reduces the risk of design-to-fabrication mismatches. The technique is particularly useful in advanced semiconductor processes where multiple conductor layers and complex via structures are common.
7. The method of claim 1 , wherein generating the physical layout design for the integrated circuit further comprises converting the modified device-level layout design describing the integrated circuit in two-dimensions into the physical layout design describing the integrated circuit in three-dimensions.
This invention relates to integrated circuit (IC) design, specifically methods for generating physical layout designs from device-level layouts. The problem addressed is the need to accurately represent IC structures in three dimensions (3D) to improve design verification, manufacturing, and performance analysis. The method involves modifying a device-level layout design, which describes the IC in two dimensions (2D), to include additional design constraints or optimizations. This modified 2D layout is then converted into a 3D physical layout design. The conversion process accounts for physical characteristics such as layer thicknesses, material properties, and geometric relationships between components. The resulting 3D layout enables more precise simulations, manufacturing process adjustments, and performance evaluations compared to traditional 2D representations. The invention ensures that the 3D conversion preserves the structural integrity and functional specifications of the original 2D design while adding depth information critical for advanced IC fabrication and analysis. This approach is particularly useful for modern ICs with complex 3D structures, such as FinFETs or stacked dies, where accurate 3D modeling is essential for reliability and performance. The method may also integrate with other design steps, such as design rule checking or lithography simulations, to further refine the IC layout before manufacturing.
8. An apparatus comprising at least one memory device storing instructions configured to cause one or more processing devices to perform operations comprising: sub-dividing at least one conductor in a device-level layout design of an integrated circuit into multiple sub-divided conductor portions based on a technology file defining physical properties for layers in the integrated circuit at a different level of granularity than in the device-level layout design, wherein the device-level layout design is generated from a geometric layout design of the integrated circuit and corresponds to a physical representation of the geometric layout design of the integrated circuit at a device-level of abstraction; modifying the device-level layout design to align with the granularity of the physical properties for layers in the integrated circuit defined by the technology file by replacing the at least one conductor in the device-level layout design with the sub-divided conductor portions; generating a mapping between the modified device-level layout design and rules in the technology file defining physical properties for layers in the integrated circuit; generating a physical layout design of the integrated circuit from the modified device-level layout design having the sub-divided conductor portions by applying the rules in the technology file to different portions of the modified device-level layout design according to the mapping; and extracting electrical representations of nets corresponding to the conductors in the physical layout design to form a netlist for the physical layout design.
This invention relates to integrated circuit (IC) design, specifically addressing the challenge of aligning device-level layout designs with technology file specifications during physical layout generation. The technology file defines physical properties for IC layers at a finer granularity than the device-level layout design, which is derived from a geometric layout design and represents the IC at a device-level abstraction. The apparatus includes a memory storing instructions to perform operations that sub-divide conductors in the device-level layout into multiple portions based on the technology file's granularity. The device-level layout is then modified by replacing the original conductors with these sub-divided portions. A mapping is generated between the modified layout and the technology file rules, which define physical properties for IC layers. Using this mapping, the modified device-level layout is converted into a physical layout design by applying the technology file rules to different portions of the layout. Finally, electrical representations of the conductors (nets) in the physical layout are extracted to form a netlist. This process ensures compatibility between the device-level design and the technology file's specifications, facilitating accurate physical layout generation and netlist extraction.
9. The apparatus of claim 8 , wherein sub-dividing the conductor in the device-level layout design of the integrated circuit is performed according to conversion rules corresponding to the physical properties of layers for the integrated circuit described in the technology file.
This invention relates to integrated circuit (IC) design, specifically to a method and apparatus for optimizing conductor routing in IC layouts. The problem addressed is the need to efficiently subdivide conductors in device-level layouts while ensuring compatibility with the physical properties of different IC layers, as defined in a technology file. The apparatus includes a layout design tool that processes an initial IC layout design and a technology file containing layer-specific physical properties. The tool identifies conductors in the layout that require subdivision based on predefined criteria, such as electrical performance or manufacturability constraints. The subdivision process is governed by conversion rules derived from the technology file, which specify how conductors should be split or modified to meet layer-specific requirements, such as material conductivity, thickness, or spacing rules. The tool then applies these rules to generate an optimized layout where conductors are subdivided appropriately, ensuring compliance with the physical limitations of each layer while maintaining design integrity. The technology file serves as a reference for the conversion rules, ensuring that the subdivision process accounts for variations in layer properties across different IC manufacturing processes. This approach improves layout efficiency, reduces design errors, and enhances manufacturability by aligning conductor subdivisions with the actual physical constraints of the IC fabrication process.
10. The apparatus of claim 8 , wherein sub-dividing the conductor in the device-level layout design of the integrated circuit automatically sets connectivity for the sub-divided conductor portions based on the connectivity of the conductor prior to the sub-dividing.
This invention relates to integrated circuit (IC) design, specifically to a method for automatically subdividing conductors in a device-level layout while preserving their original connectivity. The problem addressed is the manual effort and potential errors involved in ensuring that subdivided conductor portions maintain correct electrical connections after modification. The apparatus includes a layout design tool that processes an IC design at the device level, where conductors are initially defined as continuous elements. When a user or automated process subdivides a conductor, the tool automatically determines the connectivity of the original conductor and applies the same connectivity rules to the resulting sub-divided portions. This ensures that the subdivided segments remain electrically connected as intended, eliminating the need for manual reconfiguration. The tool may also enforce design rules, such as spacing and width constraints, during the subdivision process to maintain compliance with manufacturing requirements. The invention improves efficiency in IC design by reducing manual intervention and minimizing errors in conductor connectivity.
11. The apparatus of claim 8 , wherein the device-level layout design for the integrated circuit was generated based on a layout-to-schematic (LVS) rule deck from a foundry to manufacture the integrated circuit.
The apparatus relates to integrated circuit (IC) design and manufacturing, specifically addressing the challenge of ensuring accurate and manufacturable IC layouts. The invention involves an apparatus that generates a device-level layout design for an IC using a layout-to-schematic (LVS) rule deck provided by a semiconductor foundry. The LVS rule deck defines the design rules and constraints required to ensure that the physical layout of the IC matches its intended schematic representation, which is critical for correct functionality and manufacturability. The apparatus ensures compliance with foundry-specific LVS rules, reducing errors and improving yield during IC fabrication. This approach streamlines the design verification process by automating the application of foundry-provided rules, minimizing manual intervention and potential inconsistencies. The apparatus may also include features for optimizing the layout design, such as adjusting transistor placements or routing paths to meet performance and power requirements while adhering to the LVS constraints. By leveraging foundry-provided LVS rule decks, the apparatus ensures that the final IC design is both functionally correct and manufacturable, reducing the risk of costly rework or fabrication failures.
12. The apparatus of claim 11 , wherein the technology file defines the physical properties of the layers in the integrated circuit in a greater level of detail than the LVS rule deck defines the layers and the layer connectivity for the integrated circuit.
This invention relates to integrated circuit (IC) design verification, specifically addressing inconsistencies between detailed physical layer properties and high-level connectivity rules. The problem arises when a technology file, which defines precise physical characteristics of IC layers (e.g., thickness, material properties), conflicts with the layer connectivity rules specified in a Layout Versus Schematic (LVS) rule deck. The LVS rule deck typically provides a simplified abstraction of layer connectivity for verification purposes, but this abstraction may not align with the detailed physical properties defined in the technology file, leading to verification errors or design flaws. The apparatus includes a processor and memory storing instructions to compare the technology file and LVS rule deck during IC design verification. The technology file provides a more granular definition of layer properties than the LVS rule deck, which focuses on connectivity rules. The apparatus identifies discrepancies between the two, ensuring that the physical layer properties do not violate the connectivity rules and vice versa. This comparison helps resolve conflicts early in the design process, improving accuracy and reducing manufacturing defects. The system may also generate alerts or corrections when mismatches are detected, streamlining the verification workflow. The invention enhances IC design reliability by ensuring consistency between physical layer definitions and connectivity rules.
13. The apparatus of claim 8 , wherein the conductor in the device-level layout design of the integrated circuit corresponds to a conductor layer in the integrated circuit or to a via coupling a plurality of the layers in the integrated circuit.
This invention relates to integrated circuit (IC) design, specifically improving the accuracy of physical verification processes for conductor layers and vias in device-level layout designs. The problem addressed is ensuring that the layout design correctly represents the physical structure of the IC, particularly for conductors and vias that connect multiple layers. The apparatus includes a device-level layout design of an IC with a conductor, where the conductor corresponds to either a conductor layer in the IC or a via that couples multiple layers. The apparatus also includes a physical verification tool that checks the layout design against design rules to ensure compliance. The verification process involves analyzing the conductor's properties, such as dimensions, spacing, and connectivity, to detect potential manufacturing defects or violations. The apparatus further includes a correction module that modifies the layout design if violations are detected, ensuring the design meets manufacturing requirements. The invention improves IC design accuracy by ensuring that conductors and vias are correctly represented and verified in the layout, reducing errors during fabrication.
14. The apparatus of claim 8 , wherein generating the physical layout design for the integrated circuit further comprises converting the modified device-level layout design describing the integrated circuit in two-dimensions into the physical layout design describing the integrated circuit in three-dimensions.
This invention relates to integrated circuit (IC) design, specifically improving the physical layout design process by incorporating three-dimensional (3D) modeling. The problem addressed is the limitations of traditional two-dimensional (2D) layout designs, which fail to accurately represent the complex 3D structures of modern ICs, leading to manufacturing defects and performance issues. The apparatus includes a processor and memory storing instructions for generating a physical layout design for an IC. The process begins with a device-level layout design, which is modified to include additional design rules and constraints. This modified 2D layout is then converted into a 3D physical layout design, enabling more accurate representation of the IC's structure, including features like finFETs, through-silicon vias, and other 3D components. The conversion process accounts for physical interactions between layers, such as stress effects and thermal gradients, which are critical for advanced IC manufacturing. By generating a 3D layout, the apparatus improves design verification, reduces manufacturing defects, and enhances IC performance. The 3D model allows for better analysis of electrical, thermal, and mechanical properties, ensuring compliance with manufacturing requirements. This approach is particularly useful for advanced nodes and 3D-IC designs where traditional 2D methods are insufficient. The invention provides a more accurate and efficient way to design ICs, addressing the growing complexity of semiconductor manufacturing.
15. A system comprising: a memory device configured to store machine-readable instructions; and a computing system including one or more processing devices, in response to executing the machine-readable instructions, configured to: sub-divide at least one conductor in a device-level layout design of an integrated circuit into multiple sub-divided conductor portions based on a technology file defining physical properties for layers in the integrated circuit at a different level of granularity than in the device-level layout design, wherein the device-level layout design is generated from a geometric layout design of the integrated circuit and corresponds to a physical representation of the geometric layout design of the integrated circuit at a device-level of abstraction; modify the device-level layout design to align with the granularity of the physical properties for layers in the integrated circuit defined by the technology file by replacing the at least one conductor in the device-level layout design with the sub-divided conductor portions; generate a mapping between the modified device-level layout design and rules in the technology file defining physical properties for layers in the integrated circuit; generate a physical layout design of the integrated circuit from the modified device-level layout design having the sub-divided conductor portions by applying the rules in the technology file to different portions of the modified device-level layout design according to the mapping; and extract electrical representations of nets corresponding to the conductors in the physical layout design to form a netlist for the physical layout design.
This invention relates to integrated circuit (IC) design, specifically improving the conversion of geometric layout designs into physical layouts while ensuring alignment with technology-specific physical properties. The problem addressed is the mismatch between the granularity of device-level layout designs and the finer physical properties defined in technology files, which can lead to inaccuracies in the final IC layout and netlist generation. The system includes a memory storing machine-readable instructions and a computing system with processing devices. The computing system executes the instructions to process an IC layout design. First, it subdivides at least one conductor in the device-level layout design into multiple smaller portions based on a technology file that defines physical properties at a finer granularity than the original design. The device-level layout design is derived from a geometric layout and represents the IC at a device-level abstraction. Next, the system modifies the device-level layout by replacing the original conductor with the subdivided portions, ensuring alignment with the technology file's granularity. It then generates a mapping between the modified layout and the technology file's rules, which define physical properties for different layers. Using this mapping, the system applies the rules to the modified layout to produce a final physical layout design. Finally, it extracts electrical representations of the conductors (nets) from the physical layout to form a netlist, which is used for further IC design and verification steps. This approach ensures accurate physical layout generation and netlist extraction while maintaining consistency with technology-specific constraints.
16. The system of claim 15 , wherein sub-dividing the conductor in the device-level layout design of the integrated circuit is performed according to conversion rules corresponding to the physical properties of layers for the integrated circuit described in the technology file.
This invention relates to integrated circuit (IC) design, specifically optimizing conductor routing in device-level layout designs. The problem addressed is ensuring accurate and efficient conductor sub-division during IC layout generation, particularly when converting high-level designs into physical layouts. The system uses a technology file containing physical properties of IC layers to guide conductor sub-division. The technology file defines conversion rules that dictate how conductors should be split or modified based on material characteristics, layer constraints, and manufacturing requirements. These rules ensure that the resulting layout maintains electrical performance, manufacturability, and compliance with design rules. The system applies these rules during the layout process to automatically adjust conductor segments, preventing issues like signal integrity degradation or manufacturing defects. This approach improves design automation by reducing manual intervention while ensuring consistency across different IC fabrication technologies. The technology file serves as a centralized reference for layer-specific parameters, enabling scalable and adaptable conductor routing solutions.
17. The system of claim 15 , wherein sub-dividing the conductor in the device-level layout design of the integrated circuit automatically sets connectivity for the sub-divided conductor portions based on the connectivity of the conductor prior to the sub-dividing.
This invention relates to integrated circuit (IC) design, specifically to a system for automatically managing conductor connectivity during layout design. The problem addressed is the manual effort required to maintain correct electrical connections when conductors are subdivided during the design process, which can lead to errors and inefficiencies. The system operates within a device-level layout design environment for ICs. When a conductor is subdivided into multiple portions, the system automatically preserves the original connectivity of the conductor by ensuring the subdivided portions remain electrically connected as intended. This is achieved by analyzing the pre-subdivision connectivity and applying the same connections to the resulting sub-divided segments. The system may also include features for visualizing the subdivided conductor portions and their connectivity, allowing designers to verify the changes without manual intervention. Additionally, the system may support user-defined constraints or rules for conductor subdivision, such as minimum segment length or spacing requirements, to ensure compliance with design specifications. The automatic connectivity preservation reduces design time and minimizes errors that could arise from manual adjustments. This approach is particularly useful in complex IC layouts where conductors are frequently modified during the design iteration process.
18. The system of claim 15 , wherein the device-level layout design for the integrated circuit was generated based on a layout-to-schematic (LVS) rule deck from a foundry to manufacture the integrated circuit.
The system relates to integrated circuit (IC) design and manufacturing, specifically addressing the challenge of ensuring accurate and manufacturable IC layouts. The system generates a device-level layout design for an IC using a layout-to-schematic (LVS) rule deck provided by a semiconductor foundry. This rule deck defines the design rules and verification criteria necessary to ensure that the layout matches the intended circuit schematic and complies with the foundry's manufacturing requirements. By leveraging the foundry's LVS rule deck, the system ensures that the IC design is both functionally correct and manufacturable, reducing errors and improving yield. The system may also include a layout generation module that creates the device-level layout based on the LVS rules, ensuring consistency between the design and the foundry's fabrication capabilities. Additionally, the system may incorporate a verification module to validate the layout against the LVS rule deck, further enhancing design accuracy and reliability. This approach streamlines the IC design process by automating compliance checks and minimizing manual intervention, ultimately accelerating time-to-market while maintaining high-quality standards.
19. The system of claim 18 , wherein the technology file defines the physical properties of the layers in the integrated circuit in a greater level of detail than the LVS rule deck defines the layers and the layer connectivity for the integrated circuit.
This invention relates to integrated circuit (IC) design verification systems, specifically addressing the challenge of accurately verifying IC designs against both high-level design rules and detailed physical properties. The system includes a technology file that defines the physical properties of the IC layers in greater detail than the LVS (Layout Versus Schematic) rule deck, which specifies layer definitions and connectivity rules. The technology file provides finer granularity in describing layer characteristics, such as material properties, thickness, and geometric constraints, while the LVS rule deck focuses on ensuring logical correctness between the layout and schematic. The system uses these files to perform comprehensive verification, ensuring that the IC design adheres to both functional and physical specifications. This dual-layer approach improves verification accuracy by resolving discrepancies between high-level design rules and detailed physical constraints, reducing errors in IC manufacturing. The system may also include a user interface for defining and modifying the technology file and LVS rule deck, allowing designers to adjust verification parameters dynamically. The invention enhances IC design verification by bridging the gap between abstract design rules and precise physical implementation, ensuring manufacturability and performance.
20. The system of claim 15 , wherein the conductor in the device-level layout design of the integrated circuit corresponds to a conductor layer in the integrated circuit or to a via coupling a plurality of the layers in the integrated circuit.
This invention relates to integrated circuit (IC) design, specifically improving the accuracy of physical verification processes for conductor layers and vias in IC layouts. The problem addressed is ensuring that conductor paths and vias in a device-level layout design correctly correspond to their physical implementations in the fabricated IC, which is critical for functionality and reliability. The system includes a device-level layout design for an integrated circuit, where the design specifies conductors and vias that connect different layers of the IC. The system also includes a physical verification tool that checks the layout design against design rules and manufacturing constraints. A key feature is that the conductor in the device-level layout design corresponds to either a conductor layer in the IC or a via that couples multiple layers. This ensures that the layout design accurately reflects the physical structure of the IC, preventing misalignments or connectivity errors during fabrication. The system further includes a database storing design rules and manufacturing constraints, which the physical verification tool uses to validate the layout. The verification process identifies any discrepancies between the layout design and the physical implementation, such as incorrect via placements or conductor layer mismatches. By ensuring accurate correspondence between the layout design and the fabricated IC, the system reduces defects and improves yield in semiconductor manufacturing.
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August 31, 2018
February 15, 2022
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