A transmission line (12) includes a multilayer substrate (20), a signal pattern line (30), a ground pattern conductor (50), and an intermediate ground pattern conductor (40) that is arranged between the signal pattern line (30) and the ground pattern conductor (50) and that is electrically connected to the ground pattern conductor (50). The signal pattern line (30) has a first connection point (30c) to which a signal conductor extending in a laminating direction of the multilayer substrate (20) is connected. A first cavity portion (41h) is formed in the intermediate ground pattern conductor (40) at a position overlapped with a first end portion (30a) of the signal pattern line (30) in a plan view of the multilayer substrate (20). A first end edge (41e) of the first cavity portion (41h) has a first overlapping portion (41a) overlapped with the signal pattern line (30).
Legal claims defining the scope of protection. Each claim is shown in both the original legal language and a plain English translation.
1. A transmission line comprising: a multilayer substrate comprised of a dielectric body; a signal pattern line arranged on the multilayer substrate; a ground pattern conductor arranged at a position different from a position of the signal pattern line in a laminating direction of the multilayer substrate and overlapped with the signal pattern line in a plan view of the multilayer substrate; and an intermediate ground pattern conductor arranged between the signal pattern line and the ground pattern conductor in the laminating direction of the multilayer substrate and electrically connected to the ground pattern conductor, wherein the signal pattern line has a first connection point to which a signal conductor is connected, the signal conductor extending from the signal pattern line in a direction away from the intermediate ground pattern conductor in the laminating direction of the multilayer substrate, wherein the first connection point is arranged in a first end portion being one end portion of the signal pattern line, wherein a first cavity portion opening at a position overlapped with the first end portion of the signal pattern line in a plan view of the multilayer substrate is provided in the intermediate ground pattern conductor, and wherein, in a plan view of the multilayer substrate, a first end edge being an end edge of the first cavity portion has a first overlapping portion overlapped with the signal pattern line, and wherein a distance between the first overlapping portion and the first connection point is shorter than a distance between any portion other than the first overlapping portion of the first end edge and the first connection point.
This invention relates to a transmission line structure designed to improve signal integrity in high-frequency applications. The transmission line includes a multilayer substrate with a dielectric body, a signal pattern line, a ground pattern conductor, and an intermediate ground pattern conductor. The signal pattern line is arranged on the substrate, while the ground pattern conductor is positioned at a different layer in the laminating direction, overlapping the signal pattern line when viewed from above. The intermediate ground pattern conductor is placed between the signal pattern line and the ground pattern conductor and is electrically connected to the ground conductor. The signal pattern line has a first connection point at one end where a signal conductor is attached, extending away from the intermediate ground pattern conductor in the laminating direction. A cavity is formed in the intermediate ground pattern conductor, aligned with the end portion of the signal pattern line. The cavity's end edge includes an overlapping portion that aligns with the signal pattern line, ensuring the distance from this overlapping portion to the connection point is shorter than any other part of the cavity edge. This design minimizes signal reflection and impedance mismatches, enhancing signal transmission quality in high-frequency circuits. The structure is particularly useful in applications requiring precise signal control, such as in RF and microwave systems.
2. The transmission line according to claim 1 , wherein the intermediate ground pattern conductor has a first projecting portion projecting toward an inside of the first cavity portion along the signal pattern line in a plan view of the multilayer substrate.
This invention relates to a transmission line structure within a multilayer substrate, addressing signal integrity issues in high-speed electronic circuits. The transmission line includes a signal pattern line and an intermediate ground pattern conductor positioned between the signal line and a ground plane. The intermediate ground conductor has a projecting portion that extends toward the interior of a cavity portion formed in the substrate, aligning with the signal line in a plan view. This configuration improves signal transmission by reducing crosstalk and electromagnetic interference, particularly in high-frequency applications. The cavity portion may be formed by removing part of the substrate layers, and the intermediate ground conductor is positioned to shield the signal line while maintaining controlled impedance. The projecting portion of the intermediate ground conductor enhances shielding effectiveness by closely following the signal line's path, minimizing signal distortion and reflection. The overall structure is designed for use in high-density interconnect substrates where signal integrity is critical, such as in high-speed digital and RF circuits. The invention provides a compact, efficient shielding solution without requiring additional substrate layers or complex manufacturing steps.
3. The transmission line according to claim 1 , further comprising: a first ground via hole conductor arranged in a portion of the intermediate ground pattern conductor overlapped with the signal pattern line in a plan view of the multilayer substrate, wherein the intermediate ground pattern conductor is connected to the ground pattern conductor with the first ground via hole conductor.
A transmission line structure for high-frequency signal transmission in a multilayer substrate addresses signal integrity issues such as crosstalk and impedance mismatches. The invention includes a signal pattern line embedded within the substrate, flanked by ground pattern conductors on adjacent layers to form a stripline configuration. An intermediate ground pattern conductor is positioned between the signal line and one of the ground conductors, enhancing shielding and reducing electromagnetic interference. To improve electrical connectivity and signal integrity, a first ground via hole conductor is placed in a region where the intermediate ground pattern conductor overlaps the signal pattern line in a plan view. This via hole establishes a direct electrical connection between the intermediate ground pattern conductor and the adjacent ground pattern conductor, ensuring consistent grounding and minimizing signal reflections. The design optimizes signal transmission by maintaining controlled impedance and reducing parasitic effects, making it suitable for high-speed digital and RF applications. The via hole placement ensures mechanical and electrical stability while preserving the compact form factor of the multilayer substrate.
4. The transmission line according to claim 2 , further comprising: a first ground via hole conductor arranged in a portion of the intermediate ground pattern conductor overlapped with the signal pattern line in a plan view of the multilayer substrate, wherein the intermediate ground pattern conductor is connected to the ground pattern conductor with the first ground via hole conductor, wherein the first ground via hole conductor is arranged in the first projecting portion.
This invention relates to a transmission line structure within a multilayer substrate, addressing signal integrity and noise reduction in high-speed electronic circuits. The transmission line includes a signal pattern line embedded in the substrate, an intermediate ground pattern conductor, and a ground pattern conductor. The intermediate ground conductor is positioned between the signal line and the ground conductor to improve shielding and reduce electromagnetic interference. The intermediate ground conductor has a first projecting portion that extends beyond the signal line in a plan view, enhancing ground coupling and signal isolation. A first ground via hole conductor is placed in the overlapping region between the intermediate ground conductor and the signal line, connecting the intermediate ground conductor to the ground conductor. This via hole is specifically located within the first projecting portion of the intermediate ground conductor, optimizing ground connectivity and minimizing signal reflection. The design ensures efficient signal transmission while mitigating crosstalk and noise in high-frequency applications. The via hole placement and ground conductor configuration work together to maintain signal integrity across the multilayer substrate.
5. The transmission line according to claim 2 , wherein the signal pattern line includes a wide width portion including the first end portion, and a narrow width portion connected to the wide width portion and narrower than the wide width portion, and wherein the first projecting portion is overlapped with the narrow width portion and is not overlapped with the wide width portion in a plan view of the multilayer substrate.
A transmission line for high-frequency signal transmission in a multilayer substrate addresses signal integrity issues such as impedance mismatches and crosstalk. The transmission line includes a signal pattern line with a wide width portion at one end and a narrower portion connected to it. A ground conductor layer is positioned adjacent to the signal pattern line, with a projecting portion extending toward the signal pattern line. The projecting portion overlaps only the narrow width portion of the signal pattern line, avoiding the wide width portion, to optimize electromagnetic coupling and reduce signal reflections. This design ensures controlled impedance and minimizes signal distortion, particularly in high-speed applications where precise signal transmission is critical. The ground conductor's selective overlap with the narrow portion of the signal pattern line enhances performance by maintaining consistent signal integrity while reducing unwanted coupling effects. The multilayer substrate configuration allows for compact integration in electronic devices, making it suitable for applications requiring high-frequency signal transmission with minimal interference.
6. The transmission line according to claim 1 , further comprising: a signal via hole line connected to the signal pattern line and extending in the laminating direction of the multilayer substrate to pass through the intermediate ground pattern conductor at a position different from a position of the first cavity portion.
This invention relates to transmission lines in multilayer substrates, specifically addressing signal integrity and interference issues in high-frequency applications. The transmission line includes a signal pattern line embedded within the substrate layers, with a first cavity portion formed in an intermediate ground pattern conductor to reduce signal reflection and improve impedance matching. The invention further includes a signal via hole line connected to the signal pattern line, extending through the substrate in the laminating direction. This via hole line passes through the intermediate ground pattern conductor at a location distinct from the first cavity portion, ensuring signal transmission without interference from the cavity. The via hole line provides vertical signal routing while maintaining electrical isolation from the cavity region, preventing signal degradation. The design minimizes electromagnetic interference and signal loss, particularly in high-speed digital or RF applications where precise signal routing and ground plane integrity are critical. The via hole line's offset positioning relative to the cavity ensures consistent signal transmission characteristics across the substrate layers. This configuration is particularly useful in multilayer printed circuit boards (PCBs) and integrated circuit packages where compact, high-performance signal routing is required.
7. The transmission line according to claim 6 , further comprising: a second cavity portion provided in the intermediate ground pattern conductor, wherein the signal via hole line passes through the second cavity portion, and wherein, in a plan view of the multilayer substrate, a second end edge being an end edge of the second cavity portion has a second overlapping portion overlapped with the signal pattern line, the signal pattern line has a second connection point to which the signal via hole line is connected, and a distance between the second overlapping portion and the second connection point is shorter than a distance between any portion other than the second overlapping portion of the second end edge and the second connection point.
This invention relates to a transmission line structure within a multilayer substrate, addressing signal integrity and interference issues in high-frequency electronic circuits. The transmission line includes a signal pattern line and a ground pattern conductor with a cavity portion to reduce parasitic capacitance and improve signal transmission. The signal via hole line connects the signal pattern line to another layer, passing through a second cavity portion in the intermediate ground pattern conductor. In a plan view, the second cavity portion has an end edge with a second overlapping portion that aligns with the signal pattern line. The signal via hole line connects to a second connection point on the signal pattern line, where the distance from the second overlapping portion to this connection point is shorter than any other distance from the second cavity portion's end edge to the connection point. This design minimizes signal reflection and crosstalk by optimizing the alignment and proximity of the via hole line to the signal path, ensuring efficient signal transmission in high-density multilayer substrates. The ground pattern conductor's cavity portions further isolate the signal path, reducing unwanted coupling and improving signal integrity.
8. The transmission line according to claim 7 , wherein the intermediate ground pattern conductor has a second projecting portion projecting toward an inside of the second cavity portion along the signal pattern line.
A transmission line system is designed to improve signal integrity in high-frequency applications by reducing electromagnetic interference and signal loss. The system includes a signal pattern line embedded within a dielectric substrate, surrounded by a ground pattern conductor that forms a cavity around the signal line. This cavity structure helps isolate the signal from external noise and minimizes radiation losses. The ground pattern conductor includes an intermediate ground pattern conductor with a projecting portion that extends toward the inside of the cavity along the signal pattern line. This projecting portion further enhances signal shielding and reduces crosstalk between adjacent signal lines. The intermediate ground pattern conductor is positioned between the signal pattern line and an outer ground pattern conductor, creating a multi-layered shielding effect. The projecting portion of the intermediate ground pattern conductor is aligned with the signal line to provide localized shielding where signal integrity is most critical. This design is particularly useful in high-speed digital and RF applications where signal distortion and interference are significant concerns. The transmission line system ensures reliable signal transmission by combining a cavity structure with an optimized ground pattern conductor configuration.
9. The transmission line according to claim 7 , further comprising: a second ground via hole conductor arranged at a position of the intermediate ground pattern conductor overlapped with the signal pattern line in a plan view of the multilayer substrate, wherein the intermediate ground pattern conductor is connected to the ground pattern conductor with the second ground via hole conductor.
This invention relates to a transmission line structure within a multilayer substrate, addressing signal integrity and noise reduction in high-speed electronic circuits. The transmission line includes a signal pattern line for transmitting signals, an intermediate ground pattern conductor positioned adjacent to the signal pattern line, and a ground pattern conductor. The intermediate ground pattern conductor is connected to the ground pattern conductor through a first ground via hole conductor, forming a shielded transmission path to minimize electromagnetic interference and signal loss. The invention further includes a second ground via hole conductor positioned where the intermediate ground pattern conductor overlaps the signal pattern line in a plan view of the multilayer substrate. This second via hole conductor provides an additional connection between the intermediate ground pattern conductor and the ground pattern conductor, enhancing grounding stability and reducing impedance variations along the transmission line. The design ensures improved signal integrity by maintaining consistent electrical characteristics and reducing crosstalk between adjacent signal lines. The multilayer substrate configuration allows for compact integration while maintaining high-performance signal transmission.
10. The transmission line according to claim 8 , further comprising: a second ground via hole conductor arranged at a position of the intermediate ground pattern conductor overlapped with the signal pattern line in a plan view of the multilayer substrate, wherein the intermediate ground pattern conductor is connected to the ground pattern conductor with the second ground via hole conductor, wherein the second ground via hole conductor is arranged in the second projecting portion.
This invention relates to a transmission line structure within a multilayer substrate, addressing signal integrity and noise reduction in high-speed electronic circuits. The transmission line includes a signal pattern line for transmitting signals and a ground pattern conductor for providing a reference potential. An intermediate ground pattern conductor is positioned between the signal pattern line and the ground pattern conductor, with a first ground via hole conductor connecting the intermediate ground pattern conductor to the ground pattern conductor. The signal pattern line extends beyond the intermediate ground pattern conductor, forming a projecting portion. The intermediate ground pattern conductor also has a projecting portion that overlaps with the signal pattern line in a plan view of the multilayer substrate. A second ground via hole conductor is placed at this overlapping position, connecting the intermediate ground pattern conductor to the ground pattern conductor. This configuration improves signal transmission by reducing crosstalk and impedance mismatches, particularly in high-frequency applications. The second ground via hole conductor is specifically located in the projecting portion of the intermediate ground pattern conductor, enhancing grounding effectiveness and signal integrity.
11. The transmission line according to claim 1 , further comprising: a signal-layer ground pattern conductor arranged at a same position as a position of the signal pattern line in the laminating direction of the multilayer substrate, wherein the signal pattern line includes a strip line portion and a coplanar line portion, the strip line portion includes the first end portion, and the coplanar line portion is arranged in a slit portion provided in the signal-layer ground pattern conductor.
This invention relates to a transmission line structure within a multilayer substrate, addressing signal integrity and impedance matching challenges in high-frequency electronic circuits. The transmission line includes a signal pattern line embedded within the substrate, featuring a strip line portion and a coplanar line portion. The strip line portion is positioned at one end of the signal pattern line, while the coplanar line portion is integrated into a slit within a signal-layer ground pattern conductor. This ground conductor is aligned with the signal pattern line in the laminating direction of the substrate, ensuring consistent electrical performance. The coplanar line portion is surrounded by the ground conductor, which helps control impedance and reduce signal reflections. The strip line portion transitions to the coplanar line portion, enabling seamless signal propagation between different transmission line configurations. This design improves signal transmission efficiency and minimizes electromagnetic interference in high-speed digital and RF applications. The multilayer substrate construction allows for compact integration while maintaining precise impedance control. The invention is particularly useful in applications requiring high-frequency signal integrity, such as telecommunications, radar systems, and high-speed data processing.
12. The transmission line according to claim 6 , wherein the signal pattern line includes a plurality of signal pattern lines; and wherein the signal via hole line includes a plurality of signal via hole lines each connected to the respective plurality of signal pattern lines.
This invention relates to transmission lines used in high-frequency or high-speed signal transmission, particularly in printed circuit boards (PCBs) or other electronic substrates. The problem addressed is the need for improved signal integrity and reduced signal loss in transmission lines, especially when multiple signal paths are required. The transmission line includes a signal pattern line and a signal via hole line. The signal pattern line is a conductive path that carries electrical signals, while the signal via hole line is a conductive via that connects different layers of a PCB or substrate, allowing signals to transition between layers. The signal pattern line and signal via hole line are designed to minimize signal reflection, crosstalk, and impedance mismatches, ensuring reliable signal transmission. In this specific embodiment, the transmission line includes multiple signal pattern lines and multiple signal via hole lines. Each signal via hole line is connected to a respective signal pattern line, forming a network of interconnected signal paths. This configuration allows for parallel signal transmission, increasing data throughput and reducing latency. The arrangement of the signal pattern lines and signal via hole lines is optimized to maintain consistent impedance and minimize signal distortion, even at high frequencies. The invention is particularly useful in high-speed digital circuits, RF applications, and other systems where signal integrity is critical.
13. An antenna module comprising: the transmission line according to claim 12 ; and a plurality of patch antennas connected to the respective plurality of signal via hole lines of the transmission line and arranged in an array pattern.
This invention relates to an antenna module designed for high-frequency signal transmission, particularly in applications requiring compact, high-performance antenna arrays. The module addresses challenges in integrating multiple patch antennas with a transmission line while maintaining signal integrity and minimizing interference. The antenna module includes a transmission line with a plurality of signal via hole lines, each configured to carry distinct high-frequency signals. These via hole lines are arranged to minimize crosstalk and signal degradation. The module further comprises a plurality of patch antennas, each connected to a corresponding signal via hole line. The patch antennas are arranged in an array pattern to enhance directional signal transmission and reception, improving gain and beamforming capabilities. The transmission line ensures efficient signal routing from a signal source to the patch antennas, while the array configuration of the antennas allows for precise control over radiation patterns. This design is particularly useful in wireless communication systems, radar applications, and other high-frequency signal processing environments where compact, high-performance antenna solutions are required. The module's structure enables scalable deployment, allowing for adjustments in antenna count and arrangement based on specific application needs.
14. The antenna module according to claim 13 , further comprising: an integrated circuit including a plurality of terminals connected to the respective plurality of signal pattern lines of the transmission line.
The invention relates to antenna modules designed for wireless communication systems, particularly addressing the challenge of efficiently integrating multiple signal paths within a compact antenna structure. Traditional antenna modules often struggle with signal interference, limited bandwidth, and complex routing of multiple signals, which can degrade performance in high-frequency applications. The antenna module includes a transmission line with a plurality of signal pattern lines, each configured to carry distinct signals. These signal pattern lines are arranged to minimize interference and optimize signal integrity. An integrated circuit is connected to the signal pattern lines via a plurality of terminals, enabling direct interfacing between the antenna module and external circuitry. The integrated circuit processes and routes signals to and from the antenna module, ensuring efficient data transmission and reception. The design allows for scalable integration of additional signal paths without compromising performance, making it suitable for advanced wireless communication systems such as 5G and beyond. The module's compact form factor and high signal fidelity make it ideal for applications requiring high-speed data transfer and reliable connectivity.
15. The antenna module according to claim 14 , wherein the multilayer substrate has a first main surface and a second main surface positioned at a rear side of the first main surface, wherein the integrated circuit is arranged on the first main surface, and wherein the plurality of patch antennas is arranged at a side of the second main surface with respect to the first main surface.
This invention relates to antenna modules for wireless communication systems, specifically addressing the challenge of integrating multiple patch antennas with an integrated circuit in a compact, high-performance design. The module features a multilayer substrate with a first main surface and a second main surface positioned opposite the first. An integrated circuit is mounted on the first main surface, while a plurality of patch antennas are arranged on the second main surface, positioned at the rear side relative to the first. This configuration optimizes spatial efficiency by utilizing both sides of the substrate, allowing for a compact form factor while maintaining signal integrity and performance. The patch antennas are designed to operate at specific frequencies, enabling reliable wireless communication. The integrated circuit may include signal processing components to enhance functionality, such as amplification, filtering, or modulation. The arrangement ensures minimal interference between the antennas and the circuit, improving overall system performance. This design is particularly useful in applications requiring high-density antenna arrays, such as 5G, IoT, or satellite communication devices, where space constraints and signal quality are critical. The multilayer substrate further supports additional electronic components, enabling a fully integrated solution.
16. The transmission line according to claim 2 , further comprising: a first ground via hole conductor arranged in a portion of the intermediate ground pattern conductor overlapped with the signal pattern line in a plan view of the multilayer substrate, wherein the intermediate ground pattern conductor is connected to the ground pattern conductor with the first ground via hole conductor.
A transmission line structure for high-frequency signal transmission in a multilayer substrate addresses signal integrity issues such as crosstalk and impedance mismatches. The invention includes a signal pattern line embedded within the substrate layers, flanked by ground pattern conductors to shield the signal and maintain controlled impedance. An intermediate ground pattern conductor is positioned between the signal line and one of the ground conductors, enhancing shielding and reducing electromagnetic interference. To improve grounding and signal integrity, a first ground via hole conductor is placed in the portion of the intermediate ground pattern conductor that overlaps the signal pattern line in a plan view. This via hole connects the intermediate ground pattern conductor to the ground pattern conductor, ensuring a low-inductance path for return currents and minimizing signal reflections. The design optimizes signal transmission by combining layered shielding with direct grounding connections, particularly beneficial in high-speed digital and RF applications where signal fidelity is critical. The via hole placement ensures minimal disruption to the signal path while maintaining robust grounding. This configuration is suitable for applications requiring precise impedance control and low-loss signal propagation in dense electronic circuits.
17. The transmission line according to claim 3 , wherein the signal pattern line includes a wide width portion including the first end portion, and a narrow width portion connected to the wide width portion and narrower than the wide width portion, and wherein the first projecting portion is overlapped with the narrow width portion and is not overlapped with the wide width portion in a plan view of the multilayer substrate.
A transmission line for high-speed signal transmission in a multilayer substrate addresses signal integrity issues such as impedance mismatches and crosstalk. The transmission line includes a signal pattern line with a wide width portion at one end and a narrow width portion connected to it, where the narrow portion is narrower than the wide portion. A first projecting portion, which is part of a ground or shielding structure, overlaps only the narrow width portion of the signal pattern line when viewed from above the multilayer substrate. This design ensures controlled impedance and reduces signal reflections by maintaining a consistent dielectric environment around the signal path. The wide width portion at the end of the signal pattern line facilitates connection to other components or traces, while the narrow width portion optimizes signal propagation. The overlapping first projecting portion provides localized shielding, minimizing electromagnetic interference without disrupting the signal path. This configuration is particularly useful in high-density interconnect applications where signal integrity and space efficiency are critical.
18. The transmission line according to claim 4 , wherein the signal pattern line includes a wide width portion including the first end portion, and a narrow width portion connected to the wide width portion and narrower than the wide width portion, and wherein the first projecting portion is overlapped with the narrow width portion and is not overlapped with the wide width portion in a plan view of the multilayer substrate.
A transmission line for high-frequency signal transmission in a multilayer substrate addresses signal integrity issues such as impedance mismatches and crosstalk. The transmission line includes a signal pattern line with a wide width portion at one end and a narrow width portion connected to it, where the narrow portion is narrower than the wide portion. A first projecting portion of the transmission line overlaps only the narrow width portion in a plan view of the multilayer substrate, ensuring precise signal routing and minimizing signal reflections. The wide width portion at the end facilitates connection to other components or layers, while the narrow width portion optimizes signal propagation. The overlapping configuration of the projecting portion with only the narrow width portion prevents signal distortion and maintains consistent impedance. This design improves signal transmission efficiency and reduces electromagnetic interference in high-density electronic circuits. The transmission line is particularly useful in applications requiring high-frequency signal integrity, such as telecommunications and high-speed computing.
19. The transmission line according to claim 2 , further comprising: a signal via hole line connected to the signal pattern line and extending in the laminating direction of the multilayer substrate to pass through the intermediate ground pattern conductor at a position different from a position of the first cavity portion.
This invention relates to a transmission line structure within a multilayer substrate, addressing signal integrity and interference issues in high-frequency electronic circuits. The transmission line includes a signal pattern line embedded within the substrate layers, surrounded by intermediate ground pattern conductors that provide shielding and reduce electromagnetic interference. A key feature is the inclusion of a first cavity portion in the ground conductor, which creates a controlled discontinuity to manage signal propagation characteristics. To further enhance performance, the transmission line incorporates a signal via hole line connected to the signal pattern line. This via hole extends through the substrate in the laminating direction, passing through the intermediate ground conductor at a location distinct from the first cavity portion. This design allows for precise signal routing while maintaining shielding integrity, minimizing reflections, and ensuring consistent signal transmission across the multilayer structure. The via hole's placement avoids interference with the cavity portion, optimizing signal integrity and reducing crosstalk in high-density electronic applications. The overall structure is particularly useful in high-frequency communication systems where signal fidelity and noise reduction are critical.
20. An antenna module comprising: a transmission line and at least one of a patch antenna and an integrated circuit connected to the transmission line, wherein the transmission line includes a multilayer substrate comprised of a dielectric body, a signal pattern line arranged in the multilayer substrate, a ground pattern conductor arranged at a position different from a position of the signal pattern line in a laminating direction of the multilayer substrate and overlapped with the signal pattern line in a plan view of the multilayer substrate, an intermediate ground pattern conductor arranged between the signal pattern line and the ground pattern conductor in the laminating direction of the multilayer substrate and electrically connected to the ground pattern conductor, and a signal via hole line connected to one end portion of the signal pattern line and extending from the signal pattern line in a direction away from the intermediate ground pattern conductor in the laminating direction of the multilayer substrate, wherein a cavity portion opening at a position overlapped with the one end portion in a plan view of the multilayer substrate is provided in the intermediate ground pattern conductor, and wherein the signal via hole line is connected to the patch antenna or the integrated circuit via no line extending in the laminating direction.
This invention relates to an antenna module designed for compact and efficient signal transmission in electronic devices. The module addresses the challenge of integrating antennas and integrated circuits (ICs) with transmission lines while minimizing signal interference and maintaining high performance in a limited space. The antenna module includes a transmission line with a multilayer substrate. The substrate contains a dielectric body, a signal pattern line, a ground pattern conductor, and an intermediate ground pattern conductor. The signal pattern line and ground pattern conductor are positioned at different layers but overlap in plan view. The intermediate ground pattern conductor, located between the signal and ground pattern conductors, is electrically connected to the ground conductor. A signal via hole line connects to one end of the signal pattern line and extends away from the intermediate ground pattern conductor in the laminating direction. A cavity is formed in the intermediate ground pattern conductor at the position overlapping the signal via hole line's connection point. This cavity reduces signal reflection and improves transmission efficiency. The signal via hole line directly connects to either a patch antenna or an integrated circuit without additional vertical lines, simplifying the design and reducing signal loss. The module ensures reliable signal transmission while maintaining a compact form factor, making it suitable for modern wireless communication devices.
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May 15, 2020
March 8, 2022
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