A transfer method of transferring an object to a target substrate by using a deformable film is provided. The method includes: a first process of forming an object on a source substrate, a second process of placing a deformable film on the source substrate on which the object is formed, a third process of embedding the object into the deformable film, a fourth process of separating an object, which is to be transferred, from the source substrate, integrating the transfer object in or on a surface of the deformable film, and separating deformable film, in which the transfer object is integrated, from the source substrate, and a fifth process of transferring the object integrated into the deformable film to a target substrate.
Legal claims defining the scope of protection. Each claim is shown in both the original legal language and a plain English translation.
1. A transfer method using a deformable film, the transfer method comprising: a first process of forming an object directly on a source substrate that is a growth substrate for growing the object; a second process of placing a deformable film on the source substrate on which the object is formed; a third process of embedding the object into the deformable film; a fourth process of separating from the source substrate a transferred object that is embedded on the deformable film, wherein the fourth process further comprises: separating the transferred object from the source substrate by a Laser-lift-off method or a Chemical-lift-off-method; a fifth process of placing the transferred object to a target substrate, the fifth process further comprising coating or laminating the target substrate on the deformable film such that the target substrate contacts the deformable film and the transferred object; and the transfer method further comprising performing an anti-stiction process on a contact surface between the source substrate and the deformable film.
Technology Domain: Semiconductor manufacturing and materials transfer. Problem: Efficiently transferring delicate, directly grown objects from a source substrate to a target substrate without damage. This invention describes a method for transferring an object, such as a semiconductor layer or device, from a growth substrate (source substrate) to a different substrate (target substrate). The process begins by forming the object directly on the source substrate. Next, a deformable film is placed onto the source substrate, covering the formed object. The object is then embedded into this deformable film. The core of the transfer involves separating the object, now embedded in the film, from the source substrate. This separation is achieved using either a Laser-lift-off method or a Chemical-lift-off method. Following this lift-off, the object embedded in the deformable film is positioned onto a target substrate. This positioning involves coating or laminating the target substrate onto the deformable film, ensuring contact between the target substrate and the embedded object. An important aspect of the method is performing an anti-stiction process on the interface between the source substrate and the deformable film before or during the separation step. This anti-stiction treatment helps prevent the object and film from adhering too strongly to the source substrate, facilitating a cleaner and more effective lift-off. The deformable film then acts as a carrier for the object during its transfer and placement onto the target substrate.
2. The transfer method of claim 1 , further comprising deforming the deformable film by applying light, heat, or pressure, wherein the deformable film is formed of a material allowing control on a degree of deformation or a deformation frequency.
This invention relates to a method for transferring a deformable film, particularly in applications where precise control over deformation is required. The method addresses challenges in manipulating deformable films for applications such as flexible electronics, sensors, or microelectromechanical systems (MEMS), where traditional rigid substrates are impractical. The deformable film is made from a material that allows precise adjustment of deformation characteristics, including the degree of deformation or deformation frequency, in response to external stimuli such as light, heat, or pressure. By applying these stimuli, the film can be selectively deformed to achieve desired mechanical or functional properties. This controlled deformation enables the film to adapt to specific operational requirements, such as conforming to irregular surfaces or dynamically adjusting its shape during use. The method ensures that the film maintains structural integrity while allowing reversible or tunable deformation, enhancing its utility in dynamic environments. The invention improves upon prior approaches by providing a more versatile and responsive transfer process for deformable films, enabling advanced applications in flexible and adaptive technologies.
3. The transfer method of claim 2 , wherein the first process further comprises forming a plurality of objects on the source substrate; and the third process further comprises selectively specifying one or more objects among the plurality of objects to be transferred from the source substrate.
This invention relates to a method for transferring objects from a source substrate to a target substrate, addressing challenges in precision and selectivity during the transfer process. The method involves a first process of forming multiple objects on the source substrate, a second process of aligning the source substrate with the target substrate, and a third process of transferring the objects. The third process includes selectively specifying one or more objects from the plurality formed on the source substrate to be transferred, ensuring only the desired objects are moved. This selective transfer capability enhances control over the placement and arrangement of objects on the target substrate, improving efficiency and accuracy in applications such as semiconductor manufacturing, microelectromechanical systems (MEMS), or other microfabrication processes. The method may involve techniques like laser-assisted transfer, mechanical picking, or other selective detachment mechanisms to achieve precise object transfer. The alignment process ensures proper positioning between the source and target substrates, while the selective specification step allows for customization of the transferred objects based on specific requirements. This approach reduces waste and improves yield by avoiding unnecessary transfers of unwanted objects.
4. The transfer method of claim 3 , wherein the third process further comprises selectively specifying a first transferred object; further comprising: after embedding the first transferred object on the deformable film: repeating the second process through the fourth process; and additionally embedding additional transferred objects in the deformable film where the first transferred object is embedded, the additional transferred objects comprising a second transferred object, a third transferred object, and an n th transferred object, where n is a natural number greater than zero; and wherein additionally embedding further comprises: additionally embedding the second transferred object, the third transferred object, and the n th transferred object at different positions respectively.
This invention relates to a method for transferring objects onto a deformable film, addressing challenges in precisely embedding multiple objects at specific locations. The method involves a multi-step process where a first transferred object is initially embedded on the deformable film. After this embedding, the process is repeated to embed additional transferred objects, including a second, third, and nth transferred object, where n is a natural number greater than zero. These additional objects are embedded at different positions relative to the first transferred object. The deformable film allows for precise placement and alignment of multiple objects, enabling layered or patterned embeddings. The method ensures that each subsequent object is positioned accurately, avoiding overlap or misalignment. This technique is useful in applications requiring precise multi-object embeddings, such as electronics manufacturing, biomedical devices, or advanced material fabrication. The deformable film's adaptability facilitates controlled embedding, enhancing the method's versatility and precision.
5. The transfer method of claim 4 , wherein deforming the deformable film further comprises deforming the deformable film to correspond to a shape of one or more additional transferred objects in the additional embedding process.
This invention relates to a method for transferring objects using a deformable film, particularly in applications where precise alignment and conformal contact are required. The method addresses challenges in transferring objects, such as microelectronic components or biological samples, where maintaining alignment and minimizing damage during transfer is critical. The deformable film is used to embed and transfer objects from a source substrate to a target substrate, with the film's shape dynamically adjusted to accommodate the objects' geometries. The method involves deforming the deformable film to match the shape of one or more objects during an initial embedding process, ensuring secure attachment. In a subsequent step, the film is further deformed to conform to the shape of additional objects during an additional embedding process. This allows for the transfer of multiple objects with varying shapes while maintaining precise alignment and minimizing stress on the objects. The deformable film may be actuated using mechanical, thermal, or pneumatic means to achieve the desired deformation. The method ensures that the film adapts to the objects' contours, facilitating efficient and damage-free transfer. This approach is particularly useful in applications requiring high-precision object placement, such as semiconductor manufacturing or biomedical engineering.
6. The transfer method of claim 4 , further comprising: forming an embedding pattern in the deformable film by a non-transferred object; and embedding said one or more additional transferred objects at a position adjacent to the embedding pattern.
This invention relates to a method for transferring objects onto a deformable film, particularly in applications like display manufacturing or electronic device assembly. The method addresses challenges in precisely positioning multiple transferred objects on a deformable substrate, ensuring alignment and avoiding defects during the transfer process. The method involves forming an embedding pattern in the deformable film using a non-transferred object. This pattern serves as a reference or guide for subsequent transfers. After forming the pattern, one or more additional transferred objects are embedded at a position adjacent to the embedding pattern. The deformable film may be a flexible substrate, such as a polymer or adhesive layer, capable of conforming to the shape of the transferred objects. The non-transferred object used to create the embedding pattern may be a rigid or semi-rigid element that indents or deforms the film without being permanently attached. The additional transferred objects may include micro-LEDs, semiconductor chips, or other small components that need precise placement. The embedding pattern ensures accurate alignment of the additional transferred objects, reducing misalignment and improving yield in manufacturing processes. This method is particularly useful in applications requiring high-precision assembly of multiple components on flexible substrates.
7. The transfer method of claim 4 , further comprising: forming embedding patterns corresponding to the second, the third and the n th transferred objects in the deformable film; and deforming the embedding patterns, in the additional embedding process, to correspond to forms of the additional transferred objects.
This invention relates to a method for transferring objects using a deformable film, addressing challenges in precisely embedding and aligning multiple objects onto a target surface. The method involves forming embedding patterns in the deformable film that correspond to the shapes of the objects being transferred. These patterns are deformed to match the contours of the objects, ensuring accurate placement and adhesion. The deformable film is initially used to transfer a first set of objects, and then undergoes an additional embedding process to transfer additional objects. During this process, the film is deformed to accommodate the shapes of the new objects, allowing for precise alignment and embedding. The method ensures that the transferred objects maintain their intended positions and orientations, even when transferring multiple objects with varying shapes. This approach improves the efficiency and accuracy of object transfer processes, particularly in applications requiring high precision, such as electronics manufacturing or material assembly. The deformable film's ability to adapt to different object shapes enhances versatility and reduces errors in the transfer process.
8. The transfer method of claim 4 , wherein the additional transferred object includes a plurality of additional transferred objects, and the additional transferred objects are identical.
This invention relates to a method for transferring objects, specifically addressing the challenge of efficiently transferring multiple identical objects in a system. The method involves transferring a primary object and at least one additional object, where the additional object(s) are identical to each other. The primary object is transferred using a first transfer process, while the additional identical objects are transferred using a second transfer process. The second transfer process is optimized for handling multiple identical objects, improving efficiency and reducing redundancy. The method ensures that the additional objects are indistinguishable from one another, maintaining consistency in the transfer process. This approach is particularly useful in systems where identical objects need to be transferred in bulk, such as in manufacturing, logistics, or data processing, where uniformity and efficiency are critical. The method may involve synchronization mechanisms to ensure that the transfer of the primary object and the additional identical objects is coordinated, preventing conflicts or errors. By leveraging identical objects, the method minimizes the need for individual processing, streamlining the overall transfer operation.
9. The transfer method of claim 4 , wherein the additional transferred objects are embedded into the deformable film in an array form.
This invention relates to a method for transferring objects, particularly for embedding additional objects into a deformable film in an array form. The method addresses the challenge of precisely arranging and integrating multiple objects into a flexible substrate, such as a deformable film, to create structured or patterned assemblies. The deformable film is designed to conform to surfaces or substrates, allowing the embedded objects to be transferred in a controlled manner. The additional objects, which may include microstructures, electronic components, or other functional elements, are positioned in a predefined array pattern within the film. This arrangement ensures uniformity and alignment during the transfer process, enabling applications in fields like flexible electronics, sensors, or microfabrication. The method leverages the deformability of the film to facilitate precise placement and bonding of the objects, enhancing manufacturing efficiency and product performance. The array form of the embedded objects allows for scalable production and consistent quality in the final transferred assembly.
10. The transfer method of claim 1 , further comprising: forming a protection film having resistance to wet etching and surrounding a non-transferred object on the source substrate.
This invention relates to a method for transferring objects from a source substrate to a target substrate, addressing challenges in selective transfer while protecting non-transferred objects. The method involves forming a protection film around non-transferred objects on the source substrate, where the film is resistant to wet etching. This film prevents damage to the non-transferred objects during subsequent etching processes used to release the objects intended for transfer. The protection film is applied selectively, ensuring only the desired objects are exposed for transfer while shielding others. The method may include additional steps such as bonding the objects to the target substrate and removing the protection film after transfer. This approach improves yield and precision in microfabrication processes, particularly in semiconductor or MEMS manufacturing, where selective transfer of delicate structures is critical. The protection film's resistance to wet etching ensures that only the intended objects are affected during the release process, minimizing defects and enhancing reliability. The technique is applicable to various substrate materials and object types, providing a versatile solution for high-precision transfer applications.
11. The transfer method of claim 1 , further comprising: removing a non-transferred object with the Laser-lift-off method.
This invention relates to a method for transferring objects, such as microelectronic components or thin films, using a laser-lift-off technique. The method addresses the challenge of precisely transferring objects while ensuring that non-transferred objects are efficiently removed without damaging the target substrate or the transferred objects. The method involves a laser-lift-off process to selectively detach and remove unwanted objects from a substrate. The laser-lift-off technique uses a laser to irradiate a specific layer beneath the non-transferred objects, causing it to decompose or vaporize, thereby releasing the objects from the substrate. This step ensures that only the desired objects remain for subsequent transfer, improving yield and reducing defects. The method may also include additional steps such as aligning the objects, applying an adhesive layer, and precisely positioning the objects onto a target substrate. The laser-lift-off process is particularly useful in microfabrication, where precise control over material removal is critical. By integrating this removal step, the method enhances the efficiency and accuracy of object transfer in applications such as semiconductor manufacturing, display technology, and flexible electronics.
12. The transfer method of claim 4 , wherein the additional transferred objects are different from one another in size, material, function, or shape.
This invention relates to a transfer method for moving multiple objects, addressing the challenge of efficiently handling diverse objects in automated systems. The method involves transferring a primary object along with additional objects, where these additional objects differ from one another in at least one characteristic such as size, material, function, or shape. The primary object is initially positioned on a transfer device, and the additional objects are placed in designated areas of the transfer device. The transfer device then moves the primary object and the additional objects together to a target location. The method ensures that the additional objects remain securely positioned during transfer, preventing misalignment or damage. The transfer device may include mechanisms like clamps, grippers, or adhesive surfaces to hold the objects in place. The method is particularly useful in manufacturing, assembly lines, or logistics where multiple distinct objects must be moved simultaneously. The invention improves efficiency by reducing the need for separate transfers and minimizes the risk of errors or delays in handling diverse objects.
13. The transfer method of claim 1 , further comprising forming a sacrificial layer between the object and the source substrate.
A method for transferring an object from a source substrate to a target substrate involves forming a sacrificial layer between the object and the source substrate. The sacrificial layer facilitates separation of the object from the source substrate during the transfer process. The method includes bonding the object to the target substrate, followed by detaching the object from the source substrate, where the sacrificial layer enables clean separation without damaging the object or the source substrate. The sacrificial layer may be composed of a material that can be selectively removed or weakened to assist in the detachment process. This method is particularly useful in semiconductor manufacturing, where precise transfer of microstructures or thin films is required without compromising their integrity. The sacrificial layer acts as a temporary adhesive, ensuring that the object remains securely attached to the source substrate during initial processing steps but can be easily released when needed. The method may also include additional steps such as aligning the object with the target substrate before bonding and removing any residual sacrificial material after transfer. This approach improves yield and reliability in microfabrication processes by minimizing defects and ensuring accurate placement of the transferred object.
14. The transfer method of claim 13 , wherein the first process includes forming a plurality of objects on the source substrate; further comprising: fixing a portion of the transferred object among the plurality of objects to the source substrate by an anchor; and forming, with the transferred object, a freestanding structure or an undercut structure to the source substrate by wet etching.
This invention relates to a method for transferring objects from a source substrate to a target substrate, particularly in microfabrication or semiconductor manufacturing. The method addresses challenges in precisely transferring micro-scale or nano-scale objects while maintaining structural integrity and alignment. The process involves forming multiple objects on the source substrate, then selectively transferring them to the target substrate. A key aspect is the use of an anchor to fix a portion of the transferred object to the source substrate, ensuring stability during the transfer. After transfer, the object forms either a freestanding structure or an undercut structure relative to the source substrate through wet etching. This technique enables precise control over the transferred objects' positioning and structural configuration, which is critical for applications in microelectronics, MEMS, or photonics. The method improves yield and reliability by minimizing damage during transfer and ensuring accurate placement of the objects on the target substrate. The wet etching step allows for fine-tuning the structural features, such as undercuts or freestanding elements, which are essential for certain device functionalities. The invention provides a scalable and repeatable approach to transferring micro/nano-scale objects with high precision.
15. The transfer method of claim 1 , wherein the object comprises an electronic device, an optical device, a sensor device, a diode, a transistor, a photovoltaic device, a laser, a P-N junction, a nano device, an MEMS device, a nano material, a quantum dot, a nano line, or a combination thereof, and the object is provided in the form of an array thereof.
This invention relates to a method for transferring objects, particularly micro or nanoscale devices, to a target substrate. The method addresses challenges in precision placement and alignment of small-scale components, which are critical for applications in electronics, photonics, and sensing. The objects being transferred can include electronic devices, optical devices, sensor devices, diodes, transistors, photovoltaic devices, lasers, P-N junctions, nano devices, MEMS (microelectromechanical systems) devices, nanomaterials, quantum dots, nanolines, or combinations thereof. These objects are typically arranged in an array format, allowing for batch processing and high-throughput manufacturing. The transfer method ensures accurate positioning of these objects on the target substrate, overcoming limitations in conventional techniques that struggle with precise alignment at such small scales. The invention enables the fabrication of advanced integrated circuits, sensors, and other micro/nanoscale systems with improved performance and reliability. The method is particularly useful in industries requiring high-precision assembly, such as semiconductor manufacturing, optoelectronics, and nanotechnology research.
16. The transfer method of claim 1 , wherein the third process further comprises adjusting an embedding depth by adjusting pressure applied to the object at the time of embedding.
This invention relates to a method for transferring an object, such as a microelectronic component, into a substrate with precise control over the embedding depth. The method addresses the challenge of accurately embedding objects at a desired depth within a substrate, which is critical for applications like semiconductor packaging, microelectronics assembly, and other precision manufacturing processes. Traditional embedding techniques often lack fine control over depth, leading to inconsistencies in performance or functionality. The method involves a multi-step process where an object is positioned relative to a substrate, and an embedding tool applies force to embed the object into the substrate. A key aspect of the invention is the ability to adjust the embedding depth by modulating the pressure applied during the embedding step. This adjustment ensures that the object is embedded to the exact required depth, improving reliability and performance. The method may also include pre-processing steps, such as preparing the substrate or object surface, and post-processing steps, such as securing the embedded object or inspecting the result. The pressure adjustment can be achieved through mechanical, hydraulic, or pneumatic means, allowing for precise depth control in real-time. This technique is particularly useful in applications where depth accuracy is critical, such as in microelectronic device fabrication or advanced material assembly.
17. The transfer method of claim 16 , wherein the third process further comprises adjusting an adhesion between the target substrate and the transferred object delivered thereto according to the embedding depth.
This invention relates to a method for transferring objects, such as microstructures or electronic components, onto a target substrate with precise control over adhesion. The method addresses challenges in ensuring proper bonding between the transferred object and the target substrate, particularly when the embedding depth of the object varies. The process involves a sequence of steps to detach an object from a carrier substrate, position it over the target substrate, and embed it to a desired depth. A key aspect is the adjustment of adhesion forces between the target substrate and the transferred object based on the embedding depth. This adjustment ensures that the object is securely bonded at the correct depth, preventing issues like incomplete adhesion or excessive force that could damage the object or substrate. The method may involve modifying surface properties, applying controlled pressure, or using thermal or chemical treatments to fine-tune adhesion. This approach is particularly useful in manufacturing processes where precise placement and reliable bonding of micro-scale components are critical, such as in semiconductor fabrication or flexible electronics.
18. The transfer method of claim 1 , wherein the frist first process includes forming a plurality of objects on the source substrate, and further comprising forming the deformable film on a support substrate and placed on the source substrate.
The invention relates to a method for transferring objects from a source substrate to a target substrate using a deformable film. The method addresses challenges in precisely transferring micro-scale or nano-scale objects, such as semiconductor devices or sensors, while maintaining alignment and integrity. The process involves forming a plurality of objects on the source substrate, which may include microelectronic components, sensors, or other functional structures. A deformable film is separately formed on a support substrate and then placed onto the source substrate. The deformable film facilitates the transfer of the objects from the source substrate to the target substrate by conformally contacting the objects and allowing controlled detachment. The deformable film may be made of a flexible material, such as a polymer or elastomer, that can be stretched or compressed to align and transfer the objects accurately. The method ensures high precision and yield in the transfer process, which is critical for applications in semiconductor manufacturing, flexible electronics, and other advanced technologies. The deformable film's properties and the alignment process are optimized to prevent damage to the objects during transfer.
19. The transfer method of claim 1 , wherein the target substrate comprises at least one of a semiconductor substrate, a polymer substrate, glass, metal, paper, and an insulator.
This invention relates to a method for transferring a thin film or material layer from a donor substrate to a target substrate. The method addresses challenges in precision material transfer, particularly in applications requiring compatibility with diverse substrate types. The process involves separating a thin film from a donor substrate and transferring it to a target substrate, which can include semiconductor substrates, polymer substrates, glass, metal, paper, or insulators. The transfer method ensures high accuracy and reliability, accommodating various target materials while maintaining the integrity of the transferred layer. The technique is particularly useful in manufacturing processes where different substrate materials are involved, such as in electronics, optoelectronics, or flexible device fabrication. The method may include steps for aligning, bonding, and detaching the thin film to ensure proper transfer without damage. The invention enhances versatility in material transfer applications by supporting a wide range of target substrates, enabling broader industrial adoption.
20. The transfer method of claim 1 , wherein the first process includes forming a plurality of objects on the source substrate, and further comprising forming the deformable film by laminating or coating on the source substrate.
This invention relates to a method for transferring objects from a source substrate to a target substrate using a deformable film. The method addresses challenges in precision transfer of micro or nanoscale objects, such as semiconductor devices or sensors, where alignment and damage prevention are critical. The process involves forming a plurality of objects on the source substrate, followed by the creation of a deformable film through lamination or coating onto the source substrate. The deformable film facilitates the transfer of objects by allowing controlled deformation during detachment and attachment steps, ensuring minimal stress and high accuracy. The method may also include aligning the source substrate with the target substrate and applying pressure or energy to transfer the objects while maintaining their integrity. The deformable film can be selectively patterned or treated to enhance adhesion or release properties, improving transfer efficiency. This approach is particularly useful in semiconductor manufacturing, flexible electronics, and microelectromechanical systems (MEMS), where precise object placement is essential. The invention aims to overcome limitations of traditional transfer techniques, such as poor alignment or damage to delicate structures, by leveraging the deformable film's adaptability.
21. The transfer method of claim 1 , further comprising forming an adhesion layer on the target substrate or a delivery surface of the transferred object.
This invention relates to a method for transferring objects, such as microelectronic devices or thin films, from a carrier substrate to a target substrate. The method addresses challenges in achieving precise, damage-free transfers, particularly when dealing with delicate or high-value components. The process involves aligning the target substrate with the object on the carrier substrate, then applying energy to selectively release the object from the carrier. The energy may be thermal, optical, or mechanical, depending on the adhesion properties of the materials involved. The method ensures controlled detachment and placement, minimizing defects and improving yield. A key aspect of the invention is the use of an adhesion layer, which can be applied to either the target substrate or the delivery surface of the transferred object. This layer enhances bonding between the object and the target, ensuring stable attachment during and after transfer. The adhesion layer may be a temporary or permanent coating, depending on the application. The method is particularly useful in semiconductor manufacturing, display production, and other industries requiring high-precision material transfers. By optimizing adhesion and release mechanisms, the invention improves transfer efficiency and reliability.
22. The transfer method of claim 1 , further comprising: after the fifth process, forming a passivation layer on the target substrate onto which the transferred object has been transferred.
This invention relates to a method for transferring objects, such as microelectronic devices or components, onto a target substrate. The method addresses challenges in precisely transferring delicate objects while maintaining their structural integrity and functionality. The process involves multiple steps to ensure accurate alignment and secure attachment. After the initial transfer steps, a passivation layer is formed on the target substrate to protect the transferred object. This passivation layer enhances durability, prevents contamination, and improves performance by shielding the object from environmental factors. The method is particularly useful in semiconductor manufacturing, where precise placement and protection of microstructures are critical. The passivation layer can be applied using techniques such as chemical vapor deposition, physical vapor deposition, or spin coating, depending on the material and application requirements. This additional step ensures long-term reliability and stability of the transferred objects, making the method suitable for high-performance electronic devices.
23. The transfer method of claim 1 , further comprising performing an electrode forming process for driving the transferred object on the target substrate or connecting with an external circuit.
This invention relates to a method for transferring an object, such as a semiconductor device or electronic component, from a carrier substrate to a target substrate. The method addresses challenges in precision placement and electrical integration of transferred objects, ensuring proper functionality after transfer. The process involves aligning the object on the carrier substrate with the target substrate, then applying energy or force to detach and transfer the object to the target substrate. The transferred object may require additional processing to ensure proper operation. The method includes performing an electrode forming process on the target substrate to either drive the transferred object or connect it to an external circuit. This step ensures electrical functionality by forming conductive pathways or terminals that enable power delivery, signal transmission, or control of the transferred object. The electrode forming process may involve deposition, patterning, or bonding techniques to create the necessary electrical connections. This method is particularly useful in manufacturing flexible electronics, displays, or other applications where precise object placement and electrical integration are critical.
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June 22, 2020
March 15, 2022
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