Methods/structures of joining package structures are described. Those methods/structures may include a first side of a die disposed on a first side of a substrate, and a cooling structure on a second side of the die, wherein the cooling structure comprises a first section attached to the substrate, and a second section disposed on a second side of the die, wherein the first and second sections are separated by an opening in the cooling structure. The opening surrounds a portion of the second section, and at least one flexure beam structure connects the first and second sections.
Legal claims defining the scope of protection, as filed with the USPTO.
1. A microelectronic package structure comprising: a first side of a die on a substrate; a cooling structure on a second side of the die, wherein the cooling structure comprises: a first section and a second section; a first opening adjacent a first edge of the second section; and a second opening adjacent a second edge of the second section, wherein the second section is between the first opening and the second opening, and wherein the first section is on an outer edge the first and second openings, wherein at least one flexure beam structure extends between the first and the second sections, and wherein the at least one flexure beam structure comprises a first, a second and a third flexure beam structure, wherein the first, second and third flexure beam structures comprise about a 120 degree separation from each other around an edge of the second section.
2. The microelectronic package structure of claim 1 , wherein the cooling structure comprises an integrated heat spreader.
3. The microelectronic package structure of claim 1 , wherein the first section of the cooling structure comprises at least one attachment portion.
4. The microelectronic package structure of claim 3 , wherein the at least one attachment portion comprises a fastener, and wherein the fastener is connected to a top surface of a motherboard.
5. The microelectronic package structure of claim 1 , further comprising a second die on the substrate, wherein the cooling structure further comprises a third portion between third and fourth openings, wherein additional flexure beam structures are between the third portion and the first portion.
6. The microelectronic package structure of claim 1 , wherein the at least one flexure beam structure comprises a plurality of flexure beam structures on a first side of the second section and a plurality of flexure beam structures on a second side of the second section.
7. The microelectronic package structure of claim 1 , wherein the at least one flexure beam structure comprises a curved flexure beam structure.
8. The microelectronic package structure of claim 1 , wherein the first, the second and the third flexure beam structures each comprise a set of at least two flexure beam structures.
9. A microelectronic package structure comprising: a first side of a die on a first side of a substrate; a cooling structure on a second side of the die, wherein the cooling structure comprises: a first portion attached to the substrate; and a second portion a second side of the die, wherein the first and second portions are separated by an opening in the cooling structure, wherein the opening surrounds a portion of the second portion, and wherein at least one flexure beam structure connects the first and second portions, and wherein the at least one flexure beam structure comprises a first, a second and a third flexure beam structure, wherein the first, second and third flexure beam structures comprise about a 120 degree separation from each other around an edge of the second section.
10. The microelectronic package structure of claim 9 , wherein the cooling structure comprises copper.
11. The microelectronic package structure of claim 9 , wherein the first portion comprises an attachment portion capable of receiving a fastener to attach to the substrate.
12. The microelectronic package structure of claim 9 , wherein a heat sink is on a top surface of the cooling structure.
13. The microelectronic package structure of claim 9 , wherein the substrate comprises a motherboard.
14. The microelectronic package structure of claim 9 , wherein the die comprises a portion of a bare die package.
15. The microelectronic package structure of claim 9 , wherein the microelectronic package structure comprises a portion of a multi die package.
16. The microelectronic package structure of claim 9 , wherein the cooling structure comprises one of a cold plate or an integrated heat spreader.
17. A method of forming a microelectronic package structure, comprising: placing a cooling structure on a die on a substrate, wherein the cooling structure comprises: a first portion over a portion of the substrate adjacent the die; a second portion on a back side of the die, wherein the first and second portions are separated by an opening in the cooling structure, wherein the opening surrounds a portion of the second portion, and wherein at least one flexure structure connects the first and second portions, and wherein the at least one flexure beam structure comprises a first, a second and a third flexure beam structure, wherein the first, second and third flexure beam structures comprise about a 120 degree separation from each other around an edge of the second section; and attaching the cooling structure to the substrate, wherein the at least one flexure beam structure decouples a load strain from the first portion and the second portion.
18. The method of claim 17 , further comprising wherein the cooling structure comprises one of a heat spreader or a cold plate.
19. The method of claim 17 , wherein the load force components are distributed away from the die through a flexing motion of the at least one flexure beam structure.
20. The method of claim 17 , further comprising wherein the at least one flexure beam structure comprises a curved structure.
21. The method of claim 17 , wherein a heat sink is attached to the cooling structure, and wherein the cooling structure deflects the load of the attached heat sink.
22. The method of claim 17 , further comprising wherein the cooling structure comprises copper.
23. The method of claim 17 , further comprising a heat pipe coupled to the cooling structure.
24. The method of claim 17 , further comprising wherein the first portion comprises attachment portions to receive fasteners for fastening the first portion to the substrate.
25. The method of claim 17 , wherein the substrate comprises a motherboard.
Cooperative Patent Classification codes for this invention. Click any code to explore related patents in that topic.
September 29, 2016
March 15, 2022
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