Methods/structures of joining package structures are described. Those methods/structures may include a first side of a die disposed on a first side of a substrate, and a cooling structure on a second side of the die, wherein the cooling structure comprises a first section attached to the substrate, and a second section disposed on a second side of the die, wherein the first and second sections are separated by an opening in the cooling structure. The opening surrounds a portion of the second section, and at least one flexure beam structure connects the first and second sections.
Legal claims defining the scope of protection. Each claim is shown in both the original legal language and a plain English translation.
1. A microelectronic package structure comprising: a first side of a die on a substrate; a cooling structure on a second side of the die, wherein the cooling structure comprises: a first section and a second section; a first opening adjacent a first edge of the second section; and a second opening adjacent a second edge of the second section, wherein the second section is between the first opening and the second opening, and wherein the first section is on an outer edge the first and second openings, wherein at least one flexure beam structure extends between the first and the second sections, and wherein the at least one flexure beam structure comprises a first, a second and a third flexure beam structure, wherein the first, second and third flexure beam structures comprise about a 120 degree separation from each other around an edge of the second section.
This invention relates to microelectronic packaging with integrated cooling structures. The problem addressed is thermal management in high-performance microelectronic devices, where heat dissipation is critical to maintaining performance and reliability. The solution involves a microelectronic package structure featuring a die mounted on a substrate with a cooling structure on the opposite side of the die. The cooling structure includes two main sections: a central second section and an outer first section. The second section is positioned between two openings, one adjacent each edge, creating a configuration that facilitates heat transfer. The first section surrounds the openings and the second section. Three flexure beam structures connect the first and second sections, arranged with approximately 120-degree separation around the edge of the second section. These flexure beams provide mechanical support while allowing thermal expansion and contraction, reducing stress on the die and improving cooling efficiency. The design optimizes heat dissipation by enhancing airflow or fluid flow through the openings while maintaining structural integrity. This approach is particularly useful in applications requiring high thermal performance in compact electronic packages.
2. The microelectronic package structure of claim 1 , wherein the cooling structure comprises an integrated heat spreader.
The invention relates to microelectronic package structures designed to improve thermal management in electronic devices. The primary problem addressed is the dissipation of heat generated by high-performance microelectronic components, which can degrade performance and reliability. Traditional cooling solutions often lack efficiency or integration, leading to suboptimal thermal performance. The microelectronic package structure includes a cooling structure that is integrated into the package to enhance heat dissipation. This cooling structure features an integrated heat spreader, which is a component designed to evenly distribute heat away from the heat source. The heat spreader typically consists of a thermally conductive material, such as metal or composite materials, that spreads heat across a larger surface area, improving overall cooling efficiency. By integrating the heat spreader directly into the package, the design reduces thermal resistance and ensures more effective heat transfer from the microelectronic components to the surrounding environment. This integration also simplifies the manufacturing process and reduces the need for additional cooling mechanisms, such as external heat sinks or fans, leading to a more compact and efficient package design. The overall result is improved thermal management, which enhances the performance and longevity of the microelectronic device.
3. The microelectronic package structure of claim 1 , wherein the first section of the cooling structure comprises at least one attachment portion.
The invention relates to a microelectronic package structure with an integrated cooling system designed to address thermal management challenges in high-performance electronic devices. The structure includes a cooling structure with at least two sections, where the first section is configured to attach to a heat-generating component, such as a semiconductor chip, to facilitate heat dissipation. This first section includes at least one attachment portion, which may be a mechanical or adhesive interface, ensuring secure and efficient thermal coupling between the cooling structure and the component. The cooling structure may also include additional sections, such as a heat spreader or heat sink, to further enhance thermal performance. The design aims to improve heat transfer efficiency, reduce thermal resistance, and maintain optimal operating temperatures in compact electronic packages. The attachment portion ensures reliable contact, preventing thermal interface material degradation and improving long-term reliability. This solution is particularly useful in applications where space constraints and high thermal loads necessitate advanced cooling solutions.
4. The microelectronic package structure of claim 3 , wherein the at least one attachment portion comprises a fastener, and wherein the fastener is connected to a top surface of a motherboard.
The invention relates to a microelectronic package structure designed to enhance mechanical stability and electrical connectivity in electronic devices. The structure addresses the challenge of securely attaching microelectronic packages to motherboards while maintaining reliable electrical connections and thermal management. The package includes at least one attachment portion that mechanically couples the package to the motherboard, ensuring stability during operation and reducing the risk of detachment due to vibrations or thermal expansion. In this specific embodiment, the attachment portion comprises a fastener, such as a screw or clip, which is directly connected to the top surface of the motherboard. This fastener-based attachment method provides a robust mechanical connection, preventing misalignment or displacement of the package. The structure may also include additional features, such as conductive pads or thermal interfaces, to facilitate electrical and thermal coupling between the package and the motherboard. The overall design aims to improve durability, performance, and reliability in electronic systems where microelectronic packages are subjected to mechanical stress or environmental factors.
5. The microelectronic package structure of claim 1 , further comprising a second die on the substrate, wherein the cooling structure further comprises a third portion between third and fourth openings, wherein additional flexure beam structures are between the third portion and the first portion.
This invention relates to microelectronic package structures with enhanced thermal management. The problem addressed is the need for efficient heat dissipation in densely packed microelectronic devices, particularly where multiple dies are mounted on a common substrate. Traditional cooling solutions often fail to adequately dissipate heat from multiple heat sources while maintaining structural integrity and reliability. The invention describes a microelectronic package structure featuring a substrate with at least one die attached to it. A cooling structure is integrated into the package, comprising multiple interconnected portions and openings that facilitate heat transfer. The cooling structure includes a first portion with first and second openings, allowing for fluid or air flow to pass through, thereby removing heat from the die. The structure also includes flexure beam structures that provide mechanical support while allowing thermal expansion and contraction, reducing stress on the package. Additionally, the invention includes a second die on the same substrate, and the cooling structure is extended to cover this die as well. A third portion of the cooling structure is positioned between third and fourth openings, further enhancing heat dissipation. The third portion is connected to the first portion via additional flexure beam structures, ensuring uniform cooling and structural stability across the entire package. This design allows for efficient heat management in multi-die configurations while maintaining mechanical reliability.
6. The microelectronic package structure of claim 1 , wherein the at least one flexure beam structure comprises a plurality of flexure beam structures on a first side of the second section and a plurality of flexure beam structures on a second side of the second section.
The invention relates to microelectronic package structures designed to enhance mechanical stability and thermal performance. The structure includes a first section and a second section, where the second section is movable relative to the first section. The movement is facilitated by at least one flexure beam structure that connects the two sections, allowing controlled displacement while maintaining structural integrity. The flexure beam structure is designed to absorb mechanical stress and thermal expansion, preventing damage to the microelectronic components housed within the package. In this specific embodiment, the flexure beam structure comprises multiple flexure beams arranged on both sides of the second section. The beams on the first side and the second side of the second section work together to distribute stress evenly, improving the package's ability to withstand external forces and thermal cycling. This dual-sided arrangement enhances stability and reduces the risk of misalignment or failure during operation. The flexure beams may be fabricated from materials with high fatigue resistance and thermal conductivity to further improve performance. The overall design ensures reliable mechanical and thermal management in microelectronic applications.
7. The microelectronic package structure of claim 1 , wherein the at least one flexure beam structure comprises a curved flexure beam structure.
This invention relates to microelectronic package structures designed to improve mechanical stability and reliability in electronic devices. The problem addressed is the susceptibility of microelectronic packages to mechanical stress, which can lead to failure or reduced performance. Traditional rigid structures often lack the flexibility needed to absorb stress, particularly in applications where thermal expansion or physical shock is a concern. The invention describes a microelectronic package structure that includes at least one flexure beam structure integrated into the package. This flexure beam structure is designed to flex or bend under applied forces, thereby absorbing mechanical stress and preventing damage to the package components. The flexure beam structure can be curved, which enhances its ability to distribute stress more evenly and provides greater flexibility compared to straight beams. The curved design allows for controlled deformation, reducing the risk of brittle failure in the package. The flexure beam structure is part of a larger microelectronic package that houses electronic components, such as integrated circuits or other sensitive elements. By incorporating the flexure beam, the package can withstand mechanical loads, thermal expansion, and vibrations without compromising the integrity of the enclosed components. This design is particularly useful in applications where the package may experience dynamic or static stress, such as in portable electronics, automotive systems, or aerospace components. The curved flexure beam structure ensures that the package remains stable while allowing for necessary movement to absorb stress, thereby extending the lifespan and reliability of the microelectronic device.
8. The microelectronic package structure of claim 1 , wherein the first, the second and the third flexure beam structures each comprise a set of at least two flexure beam structures.
The invention relates to microelectronic package structures designed to enhance mechanical stability and thermal performance. The structure addresses challenges in maintaining reliable electrical connections and thermal management in microelectronic devices, particularly under varying environmental conditions or mechanical stress. The package includes multiple flexure beam structures that provide flexibility and support to the components within the package, ensuring durability and performance. The flexure beam structures are arranged to distribute mechanical loads and thermal stresses, preventing damage to sensitive components. Each flexure beam structure comprises a set of at least two individual flexure beams, which work together to improve load distribution and reduce stress concentrations. These beams are designed to flex under mechanical or thermal loads, absorbing energy and preventing failure of the package. The arrangement of multiple beams in each set enhances the overall robustness of the structure, allowing it to withstand greater forces without deformation or damage. The package structure may also include additional features, such as electrical interconnects and thermal management elements, to ensure reliable operation. The flexure beams are strategically positioned to support these components while maintaining flexibility. The use of multiple beams in each set improves the structure's ability to adapt to different loading conditions, making it suitable for a wide range of microelectronic applications. This design ensures long-term reliability and performance in demanding environments.
9. A microelectronic package structure comprising: a first side of a die on a first side of a substrate; a cooling structure on a second side of the die, wherein the cooling structure comprises: a first portion attached to the substrate; and a second portion a second side of the die, wherein the first and second portions are separated by an opening in the cooling structure, wherein the opening surrounds a portion of the second portion, and wherein at least one flexure beam structure connects the first and second portions, and wherein the at least one flexure beam structure comprises a first, a second and a third flexure beam structure, wherein the first, second and third flexure beam structures comprise about a 120 degree separation from each other around an edge of the second section.
This invention relates to microelectronic packaging, specifically addressing thermal management and mechanical stress mitigation in integrated circuits. The structure includes a die mounted on a substrate, with a cooling structure attached to the die's opposite side. The cooling structure has two main portions: a first portion fixed to the substrate and a second portion in contact with the die. These portions are separated by an opening that surrounds part of the second portion, allowing for thermal expansion and mechanical flexibility. The first and second portions are connected by at least one flexure beam structure, which consists of three individual flexure beams spaced approximately 120 degrees apart around the edge of the second portion. This arrangement enables controlled movement between the cooling structure and the substrate, reducing stress while maintaining thermal conductivity. The design helps prevent damage from thermal cycling and mechanical shocks, improving the reliability of microelectronic devices. The flexure beams distribute stress evenly, ensuring the cooling structure remains securely attached while accommodating dimensional changes. This approach is particularly useful in high-performance computing and power electronics where thermal management is critical.
10. The microelectronic package structure of claim 9 , wherein the cooling structure comprises copper.
The invention relates to a microelectronic package structure designed to improve thermal management in electronic devices. The structure includes a cooling system integrated with the package to dissipate heat generated by microelectronic components. The cooling structure is made of copper, which provides high thermal conductivity to efficiently transfer heat away from the components. This design helps prevent overheating, ensuring reliable performance and extending the lifespan of the electronic device. The cooling structure is positioned in close proximity to the heat-generating components, optimizing heat dissipation. The use of copper enhances thermal performance compared to traditional materials, making the package suitable for high-power applications. The structure may also include additional features such as thermal interface materials or heat spreaders to further improve cooling efficiency. This invention addresses the challenge of thermal management in densely packed microelectronic systems, where excessive heat can degrade performance and reliability. By incorporating a copper-based cooling structure, the package ensures effective heat dissipation, maintaining optimal operating conditions for the electronic components.
11. The microelectronic package structure of claim 9 , wherein the first portion comprises an attachment portion capable of receiving a fastener to attach to the substrate.
The invention relates to a microelectronic package structure designed to enhance mechanical stability and electrical connectivity. The structure includes a first portion and a second portion, where the first portion is configured to attach to a substrate. Specifically, the first portion includes an attachment portion that can receive a fastener, such as a screw or bolt, to securely fasten the microelectronic package to the substrate. This attachment mechanism ensures proper alignment and mechanical stability during operation. The second portion of the structure is designed to interface with a microelectronic component, such as a semiconductor die or module, providing electrical and thermal pathways. The attachment portion may include threaded holes, mounting holes, or other fastening features to accommodate different types of fasteners. The overall design aims to improve reliability by reducing mechanical stress and ensuring consistent electrical connections. The structure may also include additional features, such as conductive traces or thermal management elements, to enhance performance. This invention addresses challenges in microelectronic packaging, particularly in applications requiring robust mechanical attachment and stable electrical connections.
12. The microelectronic package structure of claim 9 , wherein a heat sink is on a top surface of the cooling structure.
The invention relates to microelectronic package structures designed to improve thermal management. The problem addressed is the need to efficiently dissipate heat generated by microelectronic components to prevent overheating and ensure reliable performance. The structure includes a cooling mechanism integrated with the package to enhance heat dissipation. A heat sink is positioned on the top surface of the cooling structure to further improve thermal conductivity and heat transfer. The cooling structure may include features such as microchannels, fins, or other heat-dissipating elements to maximize surface area and cooling efficiency. The heat sink, typically made of a thermally conductive material like metal, is directly attached to the cooling structure to facilitate the transfer of heat away from the microelectronic components. This design ensures that heat is effectively conducted and dissipated, maintaining optimal operating temperatures for the microelectronic package. The integration of the heat sink with the cooling structure provides a compact and efficient thermal management solution, particularly useful in high-performance computing and power electronics applications.
13. The microelectronic package structure of claim 9 , wherein the substrate comprises a motherboard.
The invention relates to microelectronic package structures designed to improve thermal management and electrical performance in electronic devices. The structure addresses the challenge of heat dissipation and signal integrity in high-density microelectronic assemblies, particularly those mounted on a motherboard. The package includes a substrate, such as a motherboard, with embedded conductive traces and thermal management features. These features may include heat spreaders, thermal vias, or other heat-dissipating elements integrated into the substrate to enhance cooling efficiency. The package also incorporates microelectronic components, such as integrated circuits or semiconductor devices, which are electrically connected to the substrate via conductive interconnects. The substrate may further include insulating layers to isolate conductive paths and prevent signal interference. The thermal and electrical properties of the substrate are optimized to support high-performance computing, telecommunications, or other applications requiring reliable operation under thermal stress. The structure ensures efficient heat transfer from the microelectronic components to the motherboard, reducing thermal resistance and improving overall system reliability. The invention is particularly useful in compact electronic devices where space constraints limit traditional cooling solutions.
14. The microelectronic package structure of claim 9 , wherein the die comprises a portion of a bare die package.
The invention relates to microelectronic packaging, specifically addressing the integration of bare die packages within larger microelectronic assemblies. Bare die packages are semiconductor dies that are not fully encapsulated in traditional packaging, allowing for direct integration into more complex systems. The challenge addressed is efficiently incorporating these bare die packages into larger microelectronic structures while maintaining electrical connectivity and mechanical stability. The microelectronic package structure includes a die, which is part of a bare die package, integrated into a larger assembly. The bare die package is a semiconductor die that has not been fully encapsulated in a traditional package, allowing for direct integration into the larger structure. The die is electrically and mechanically connected to other components within the package, ensuring reliable performance. The structure may also include additional features such as interconnects, substrates, or encapsulation layers to support the bare die package and enhance its functionality within the larger assembly. This approach enables more compact and efficient microelectronic designs by leveraging the flexibility of bare die integration.
15. The microelectronic package structure of claim 9 , wherein the microelectronic package structure comprises a portion of a multi die package.
The invention relates to microelectronic packaging, specifically addressing the integration of multiple semiconductor dies within a single package to improve performance, reduce size, and enhance functionality. Traditional packaging methods often struggle with thermal management, electrical connectivity, and mechanical stability when combining multiple dies. This invention provides a microelectronic package structure designed for multi-die integration, ensuring reliable interconnections and efficient heat dissipation. The package structure includes a substrate with embedded conductive traces and vias for electrical routing, along with a heat spreader or thermal interface material to manage heat generated by the multiple dies. The dies are mounted on the substrate using flip-chip or wire-bonding techniques, depending on the application. The package may also incorporate underfill material to reinforce mechanical bonds and prevent delamination. Additionally, the structure may include shielding layers to reduce electromagnetic interference between dies. The multi-die package is designed to support high-density interconnects, enabling efficient communication between dies while minimizing signal loss and crosstalk. The package may also feature modular design elements, allowing for scalable integration of additional dies as needed. This approach enhances computational power, memory capacity, or mixed-signal functionality in a compact form factor, making it suitable for advanced computing, telecommunications, and IoT applications. The invention improves upon prior art by optimizing thermal and electrical performance in multi-die configurations.
16. The microelectronic package structure of claim 9 , wherein the cooling structure comprises one of a cold plate or an integrated heat spreader.
The microelectronic package structure includes a cooling system designed to manage heat dissipation in electronic devices. The cooling structure is integrated into the package and can be either a cold plate or an integrated heat spreader. A cold plate is a heat sink that uses a liquid cooling system to absorb and transfer heat away from the electronic components, while an integrated heat spreader is a solid metal plate that spreads heat evenly across its surface to improve thermal conductivity. The cooling structure is positioned in close proximity to the heat-generating components, such as processors or memory chips, to ensure efficient heat removal. This design helps prevent overheating, which can degrade performance or cause component failure. The cooling structure may also include additional features, such as microchannels or fins, to enhance heat transfer. The overall structure is optimized for compactness and thermal efficiency, making it suitable for high-performance computing and other applications where thermal management is critical.
17. A method of forming a microelectronic package structure, comprising: placing a cooling structure on a die on a substrate, wherein the cooling structure comprises: a first portion over a portion of the substrate adjacent the die; a second portion on a back side of the die, wherein the first and second portions are separated by an opening in the cooling structure, wherein the opening surrounds a portion of the second portion, and wherein at least one flexure structure connects the first and second portions, and wherein the at least one flexure beam structure comprises a first, a second and a third flexure beam structure, wherein the first, second and third flexure beam structures comprise about a 120 degree separation from each other around an edge of the second section; and attaching the cooling structure to the substrate, wherein the at least one flexure beam structure decouples a load strain from the first portion and the second portion.
This invention relates to microelectronic packaging, specifically addressing thermal management and mechanical stress reduction in integrated circuits. The method involves forming a microelectronic package structure with an improved cooling system that minimizes strain between the die and the substrate. The cooling structure includes two main portions: a first portion placed over a substrate area adjacent to the die and a second portion positioned on the back side of the die. These portions are separated by an opening that surrounds part of the second portion. The cooling structure is designed with at least one flexure beam structure connecting the first and second portions to decouple load strain between them. The flexure beam structure consists of three individual beams arranged with approximately 120-degree separation around the edge of the second portion. This configuration allows the cooling structure to effectively dissipate heat while reducing mechanical stress that could otherwise damage the die or substrate. The cooling structure is then attached to the substrate, ensuring thermal conductivity and mechanical stability. The invention improves reliability and performance of microelectronic devices by mitigating thermal and mechanical stresses.
18. The method of claim 17 , further comprising wherein the cooling structure comprises one of a heat spreader or a cold plate.
A method for thermal management in electronic systems involves using a cooling structure to regulate the temperature of a component. The cooling structure is designed to interface with the component and may include a heat spreader or a cold plate. The heat spreader distributes heat away from localized hot spots, while the cold plate actively or passively cools the component by circulating a coolant. The cooling structure is thermally coupled to the component to ensure efficient heat dissipation, preventing overheating and maintaining optimal performance. The method may also include monitoring temperature and adjusting cooling parameters dynamically to respond to varying thermal loads. This approach is particularly useful in high-performance computing, power electronics, and other applications where thermal management is critical. The cooling structure's design ensures compatibility with different component types and cooling requirements, enhancing system reliability and longevity.
19. The method of claim 17 , wherein the load force components are distributed away from the die through a flexing motion of the at least one flexure beam structure.
This invention relates to a mechanical system for distributing load forces in a die assembly, particularly in applications where precise force distribution is critical, such as semiconductor manufacturing or precision machining. The problem addressed is the concentration of excessive load forces on a die, which can lead to deformation, wear, or failure. The solution involves a flexure beam structure that redistributes these forces through a controlled flexing motion, preventing localized stress concentrations. The system includes at least one flexure beam structure mechanically coupled to the die. When a load is applied, the flexure beam flexes, allowing the load force components to be distributed away from the die rather than being concentrated at a single point. This flexing motion ensures that the load is spread across a larger area, reducing stress on the die and improving its durability. The flexure beam may be designed with specific stiffness properties to optimize force distribution based on the application requirements. The system may also include additional components, such as alignment mechanisms or damping elements, to enhance stability and precision during operation. The overall design ensures that the die remains structurally intact while maintaining the necessary precision for its intended function.
20. The method of claim 17 , further comprising wherein the at least one flexure beam structure comprises a curved structure.
A system and method for precision mechanical positioning involves a flexure-based mechanism designed to provide controlled movement with high accuracy and repeatability. The mechanism includes at least one flexure beam structure that allows for controlled deflection while minimizing backlash and friction, which are common issues in traditional mechanical linkages. The flexure beam structure is configured to enable precise linear or rotational motion by bending under applied forces, with its geometry optimized to ensure predictable and repeatable movement. In an advanced configuration, the flexure beam structure includes a curved design. This curvature enhances the flexibility and load-bearing capacity of the beam, allowing for greater deflection ranges while maintaining structural integrity. The curved structure also improves stress distribution, reducing the risk of material fatigue and extending the lifespan of the mechanism. This design is particularly useful in applications requiring fine adjustments, such as in optical alignment systems, semiconductor manufacturing equipment, or high-precision measurement devices. The curved flexure beam may be integrated into a larger positioning system, where multiple beams work in concert to achieve multi-axis motion with sub-micron precision. The overall system ensures minimal hysteresis and high stiffness, making it suitable for environments where accuracy and reliability are critical.
21. The method of claim 17 , wherein a heat sink is attached to the cooling structure, and wherein the cooling structure deflects the load of the attached heat sink.
This invention relates to cooling systems for electronic devices, specifically addressing the challenge of managing heat dissipation while maintaining structural integrity. The system includes a cooling structure designed to support and cool electronic components, such as processors or power modules, by transferring heat away from these components. A heat sink is attached to the cooling structure to enhance heat dissipation. The cooling structure is engineered to deflect or absorb the mechanical load imposed by the attached heat sink, preventing stress or deformation in the electronic components. This deflection capability ensures that the cooling structure can support the weight and thermal expansion of the heat sink without compromising the stability or performance of the electronic system. The design may incorporate flexible or load-bearing materials to achieve this deflection, allowing the cooling structure to maintain efficient heat transfer while accommodating the physical forces exerted by the heat sink. This approach improves reliability and longevity in high-performance electronic applications where thermal management is critical.
22. The method of claim 17 , further comprising wherein the cooling structure comprises copper.
A method for enhancing thermal management in electronic devices involves integrating a cooling structure to dissipate heat generated during operation. The cooling structure is designed to efficiently transfer heat away from critical components, such as processors or power modules, to maintain optimal performance and reliability. The cooling structure may include materials with high thermal conductivity, such as copper, to improve heat dissipation. Copper is particularly effective due to its excellent thermal properties, allowing for rapid heat transfer from the electronic components to the surrounding environment. The cooling structure may be integrated into the device's housing or directly attached to heat-generating components, ensuring direct contact for maximum efficiency. This method addresses the problem of overheating in electronic devices, which can lead to reduced performance, component degradation, or system failure. By using a cooling structure with copper, the method provides a reliable and efficient solution for thermal management, extending the lifespan and functionality of electronic devices. The cooling structure may also include additional features, such as fins or heat pipes, to further enhance heat dissipation and maintain stable operating temperatures.
23. The method of claim 17 , further comprising a heat pipe coupled to the cooling structure.
A cooling system for electronic devices addresses the challenge of efficiently dissipating heat generated by high-performance components. The system includes a cooling structure, such as a heat sink or vapor chamber, designed to absorb and distribute thermal energy away from heat sources. The cooling structure is thermally coupled to one or more electronic components, ensuring direct heat transfer. To enhance cooling performance, a heat pipe is integrated into the system. The heat pipe, typically a sealed tube containing a working fluid, leverages phase-change cooling by absorbing heat at the evaporator section near the heat source, transporting the vapor to a condenser section, and releasing the heat before returning the condensed liquid to the evaporator. This passive cooling mechanism improves thermal management by efficiently transferring heat over longer distances with minimal temperature gradients. The heat pipe may be directly coupled to the cooling structure or embedded within it, optimizing heat dissipation pathways. The system may also include additional features such as fins, fans, or liquid cooling loops to further enhance thermal performance. This approach is particularly useful in compact or high-power-density applications where traditional cooling methods are insufficient.
24. The method of claim 17 , further comprising wherein the first portion comprises attachment portions to receive fasteners for fastening the first portion to the substrate.
This invention relates to a method for manufacturing a composite structure, specifically addressing the challenge of securely attaching a composite material to a substrate. The method involves forming a composite structure with at least two portions, where the first portion includes attachment features designed to receive fasteners. These fasteners are used to mechanically secure the first portion to the substrate, ensuring a strong and durable bond. The second portion of the composite structure may be formed separately or in conjunction with the first portion, depending on the specific application. The attachment portions are strategically integrated into the first portion to facilitate efficient assembly and enhance structural integrity. This approach improves the reliability of composite-to-substrate connections, particularly in applications where traditional bonding methods may be insufficient. The method is particularly useful in industries such as aerospace, automotive, and construction, where lightweight yet robust structural connections are critical. By incorporating fastener-receiving attachment portions, the invention provides a versatile solution for attaching composite materials to various substrates, ensuring long-term performance and stability.
25. The method of claim 17 , wherein the substrate comprises a motherboard.
A method for manufacturing electronic devices involves the use of a substrate, which in this case is specifically a motherboard. The motherboard serves as a base structure for mounting and interconnecting electronic components. The method includes processes for preparing the motherboard, such as cleaning, surface treatment, and applying conductive or insulating layers. It also involves attaching electronic components, such as integrated circuits, resistors, and capacitors, to the motherboard using techniques like soldering or surface-mount technology. The method further includes electrical testing and quality assurance steps to ensure proper functionality and reliability of the assembled electronic device. The use of a motherboard as the substrate ensures compatibility with standard electronic device architectures, allowing for efficient assembly and integration of components. This approach is particularly useful in the production of computers, servers, and other complex electronic systems where a robust and scalable base structure is required. The method optimizes the manufacturing process by leveraging the motherboard's pre-existing design and connectivity features, reducing assembly time and improving overall device performance.
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September 29, 2016
March 15, 2022
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