A method for producing a radiofrequency device having a first antenna circuit connected to a radiofrequency chip and a second antenna circuit associated with, or coupled to, the first circuit, the method including the following steps: formation of the first antenna circuit in the form of a conductive wire deposited in a guided manner on a first substrate; and formation of the second antenna circuit in the form of a conductive wire deposited on the same first substrate in a guided manner and at a calibrated distance from the first antenna circuit.
Legal claims defining the scope of protection. Each claim is shown in both the original legal language and a plain English translation.
1. A method for producing a radiofrequency device comprising a first antenna circuit connected to a radiofrequency chip, and a second antenna circuit disposed at a distance from the first antenna circuit at which the second antenna circuit increases a communication range of the radiofrequency device, comprising the following steps: forming the first antenna circuit by depositing a conductive wire onto a first substrate, and after forming the first antenna circuit, forming the second antenna circuit by depositing a conductive wire onto the first substrate and at the distance from the first antenna circuit, wherein the method results in the final product in the fabrication flow.
This invention relates to radiofrequency (RF) devices, specifically addressing the challenge of limited communication range in conventional RF devices. The method involves fabricating a device with two antenna circuits: a primary antenna circuit connected to an RF chip and a secondary antenna circuit positioned at a specific distance from the primary circuit to enhance the device's communication range. The fabrication process begins by depositing a conductive wire onto a substrate to form the primary antenna circuit. After completing the primary circuit, a second conductive wire is deposited onto the same substrate at a predetermined distance from the first circuit to create the secondary antenna circuit. The distance between the two circuits is optimized to ensure the secondary circuit amplifies the communication range without causing interference. The method integrates both antenna circuits into a single substrate, resulting in a compact yet high-performance RF device. This approach improves signal transmission and reception efficiency, making it suitable for applications requiring extended range, such as wireless sensors or IoT devices. The fabrication flow ensures the final product is produced efficiently, with both antenna circuits formed sequentially on the same substrate.
2. A method according to claim 1 , wherein the first circuit includes terminal portions for interconnection to the radiofrequency chip in the form of alternations.
A method for improving radiofrequency (RF) signal transmission in electronic devices addresses the challenge of efficient interconnection between RF chips and circuit components. The method involves a first circuit designed to interface with an RF chip, where the first circuit includes terminal portions specifically configured for interconnection. These terminal portions are arranged in an alternating pattern to optimize signal integrity and reduce interference during transmission. The alternating arrangement ensures precise alignment and reliable contact with the RF chip, enhancing performance and minimizing signal loss. Additionally, the method may include a second circuit that interacts with the first circuit to further refine signal processing, such as filtering or amplification, to improve overall system efficiency. The alternating terminal design is particularly useful in high-frequency applications where signal integrity is critical, such as in wireless communication devices, radar systems, and other RF applications. This approach simplifies manufacturing while improving reliability and performance in RF signal transmission.
3. A method according to claim 1 , wherein portions of wire of the antenna circuit are deposited onto a substrate using embroidery or overlay.
This invention relates to the field of antenna manufacturing, specifically addressing the challenge of producing flexible, lightweight, and durable antennas for wearable or portable electronic devices. The method involves depositing conductive wire onto a substrate to form an antenna circuit, with the wire being applied using techniques such as embroidery or overlay. The conductive wire is arranged in a specific pattern to create an antenna structure capable of transmitting and receiving electromagnetic signals. The substrate may be a flexible material, such as fabric or a polymer, allowing the antenna to conform to various shapes and surfaces. The embroidery or overlay process ensures precise placement of the wire, enhancing electrical conductivity and mechanical stability. This approach enables the production of antennas that are lightweight, flexible, and resistant to environmental factors, making them suitable for integration into wearable electronics, medical devices, or other applications where flexibility and durability are critical. The method may also include additional steps, such as securing the wire to the substrate with adhesives or coatings to improve adhesion and protect against wear. The resulting antenna maintains high performance while being adaptable to different form factors and manufacturing processes.
4. A method according to claim 1 , wherein the second circuit is a passive antenna coupled with a radiofrequency transponder.
A method for wireless communication involves a system with a first circuit and a second circuit. The first circuit generates a radiofrequency (RF) signal, while the second circuit receives and processes this signal. In this specific implementation, the second circuit is a passive antenna coupled with a radiofrequency transponder. The passive antenna captures the RF signal, and the transponder modulates and reflects the signal back to the first circuit, enabling data transmission without an internal power source. This approach is useful in applications where power efficiency and simplicity are critical, such as in RFID (radio-frequency identification) systems, wireless sensors, or contactless smart cards. The passive design eliminates the need for a battery, reducing cost and maintenance while ensuring reliable communication over short to medium distances. The system can be used in inventory tracking, access control, or environmental monitoring, where low-power, battery-free devices are advantageous. The method ensures robust signal transmission and reception, even in environments with limited power availability.
5. A method according to claim 1 , further comprising a step of depositing an anisotropic conductive material onto each terminal portion of the first antenna circuit and a step of transferring and connecting a/an coated/encapsulated chip via said anisotropic conductive material.
This invention relates to the field of antenna circuit manufacturing, specifically addressing the challenge of efficiently connecting encapsulated semiconductor chips to antenna circuits. The method involves depositing an anisotropic conductive material onto terminal portions of a first antenna circuit. This conductive material enables selective electrical conduction in one direction while preventing lateral conduction, ensuring precise connectivity. The method further includes transferring and connecting an encapsulated chip to the antenna circuit via the anisotropic conductive material. The encapsulated chip is coated or encapsulated to protect it during the connection process. This approach improves manufacturing efficiency by simplifying the chip-to-antenna bonding process while maintaining reliable electrical connections. The technique is particularly useful in applications requiring compact, high-performance antenna modules, such as wireless communication devices. The use of anisotropic conductive material ensures accurate alignment and minimizes defects, enhancing overall production yield. The method may also include additional steps, such as forming the antenna circuit on a substrate and patterning the circuit to define the terminal portions. The encapsulated chip may be a semiconductor device, such as an integrated circuit, designed for wireless communication. The process ensures robust mechanical and electrical connections, reducing the risk of failure in harsh environments.
6. A method according to claim 1 , further comprising a step of depositing a conductive material by printing, specifically screen printing, onto each terminal portion of the first antenna circuit and a step of transferring and connecting an unpackaged chip via said conductive material.
This invention relates to the field of printed electronics, specifically methods for manufacturing antenna circuits with integrated unpackaged chips. The problem addressed is the need for efficient and cost-effective techniques to connect unpackaged semiconductor chips to printed antenna circuits, particularly in applications like RFID or wireless communication devices. The method involves depositing a conductive material, such as conductive ink, onto terminal portions of a first antenna circuit using screen printing. This conductive material serves as both an adhesive and an electrical connection medium. An unpackaged chip is then transferred onto the printed conductive material, where it is physically and electrically connected to the antenna circuit. The screen printing process ensures precise deposition of the conductive material, enabling reliable chip attachment without traditional packaging or bonding steps. The invention may also include forming the first antenna circuit on a substrate, such as a flexible or rigid material, using printing techniques like screen printing or inkjet printing. The antenna circuit may be designed for specific frequency ranges, such as those used in RFID or wireless communication systems. The unpackaged chip may be a semiconductor die, such as an RFID chip or a sensor, which is directly mounted onto the printed conductive material without additional packaging. This approach reduces manufacturing complexity and cost by eliminating the need for traditional chip packaging and bonding processes, while ensuring robust electrical and mechanical connections between the chip and the antenna circuit. The method is particularly suitable for large-scale production of flexible or wearable electronic devices.
7. A method according to claim 1 , further comprising a step of coating/encapsulating the chip in a package, except for the studs thereof, prior to the transfer thereof against connection terminal portions.
This invention relates to semiconductor packaging, specifically addressing the challenge of protecting semiconductor chips during transfer and connection to substrates while maintaining electrical connectivity. The method involves coating or encapsulating a semiconductor chip, except for its conductive studs, before transferring the chip to a substrate with connection terminal portions. The studs remain exposed to allow electrical connections to be made with the substrate. The coating or encapsulation step ensures the chip is protected from environmental damage, mechanical stress, or contamination during handling and placement. The method is particularly useful in advanced packaging techniques where precise alignment and protection of delicate semiconductor components are critical. The invention builds on a base method that involves forming conductive studs on a semiconductor chip, aligning the chip with a substrate, and bonding the studs to corresponding connection terminal portions on the substrate. The additional coating or encapsulation step enhances reliability by shielding the chip while preserving the functionality of the exposed studs for electrical interfacing. This approach is applicable in high-density packaging, where minimizing defects and ensuring robust connections are essential for performance and longevity.
8. A method according to claim 1 , further comprising at least a step of forming a part of the first circuit or fixing the radiofrequency chip in a cavity or an opening—provided in one of the substrates.
This invention relates to the field of electronic device manufacturing, specifically methods for integrating radiofrequency (RF) chips into multi-substrate structures. The problem addressed is the precise placement and secure attachment of RF chips within layered substrates, ensuring reliable electrical and mechanical connections while maintaining compact form factors. The method involves forming a first circuit on a substrate, which may include conductive traces, antennas, or other RF components. A radiofrequency chip is then positioned and fixed within a cavity or opening provided in one of the substrates. This step ensures the chip is accurately aligned and mechanically secured, preventing misalignment or detachment during subsequent manufacturing processes. The cavity or opening may be formed by etching, laser cutting, or other substrate processing techniques. The RF chip is fixed using adhesives, solder, or other bonding methods, ensuring stable electrical and mechanical connections. This approach enables the integration of RF functionality into multi-layered devices, such as smart cards, RFID tags, or wearable electronics, while maintaining structural integrity and performance. The method is particularly useful in applications requiring high-frequency signal transmission and compact designs.
9. A method for producing a radiofrequency device comprising a first antenna circuit connected to a radiofrequency chip, and a second antenna circuit disposed at a distance from the first antenna circuit at which the second antenna circuit increases a communication range of the radiofrequency device, comprising the following steps: forming the first antenna circuit by depositing a conductive wire onto a first substrate, and after forming the first antenna circuit, forming the second antenna circuit by depositing a conductive wire onto a second substrate and at the distance from the first antenna circuit, wherein the method results in the final product in the fabrication flow.
This invention relates to radiofrequency (RF) devices with enhanced communication range. The problem addressed is the limited communication range of conventional RF devices, which often rely on a single antenna circuit. The solution involves a method for producing an RF device with two antenna circuits: a primary antenna circuit connected to an RF chip and a secondary antenna circuit positioned at a specific distance to boost communication range. The method includes depositing a conductive wire onto a first substrate to form the primary antenna circuit. Afterward, a secondary antenna circuit is formed by depositing a conductive wire onto a second substrate, positioned at a predetermined distance from the primary antenna circuit to enhance signal transmission. The two substrates may be separate or integrated into a single structure. The conductive wires can be deposited using techniques such as printing, etching, or plating. The resulting RF device achieves improved communication range by leveraging the interaction between the two antenna circuits, which may operate in different frequency bands or with different polarizations to optimize performance. This method ensures the final product is fabricated in a continuous flow, maintaining efficiency and scalability.
10. A method according to claim 9 , wherein the first circuit includes terminal portions for interconnection to the radiofrequency chip in the form of alternations.
A method for improving interconnection between a radiofrequency (RF) chip and a circuit is disclosed. The RF chip generates or processes high-frequency signals, and reliable interconnection is critical for signal integrity and performance. The method involves configuring a first circuit with terminal portions designed for interconnection to the RF chip. These terminal portions are structured as alternations, which may include alternating conductive and non-conductive segments, staggered contact points, or other patterned arrangements to optimize signal transmission, reduce interference, or enhance mechanical stability. The alternations may also facilitate alignment during assembly or improve impedance matching between the circuit and the RF chip. The method ensures efficient signal transfer while minimizing losses and reflections, addressing challenges in high-frequency applications where traditional interconnection techniques may introduce signal degradation or reliability issues. The circuit may further include additional components or features, such as shielding, grounding, or signal conditioning elements, to further enhance performance. This approach is particularly useful in RF modules, wireless communication devices, and other systems where precise signal handling is essential.
11. A method according to claim 9 , wherein portions of wire of the antenna circuit are deposited onto a substrate using embroidery or overlay.
This invention relates to the fabrication of antenna circuits, particularly for flexible or wearable electronics. The problem addressed is the need for efficient, durable, and scalable methods to integrate conductive antenna structures onto substrates, especially in applications where flexibility, conformability, and lightweight design are critical. The method involves depositing conductive wire portions onto a substrate using embroidery or overlay techniques. Embroidery refers to stitching conductive threads or wires into the substrate, while overlay involves placing pre-formed conductive elements onto the substrate. These techniques enable precise patterning of conductive paths without complex lithography or etching processes, reducing material waste and production costs. The deposited wire portions form an antenna circuit capable of transmitting or receiving electromagnetic signals, with the substrate providing mechanical support and flexibility. The method may include additional steps such as securing the deposited wire portions to the substrate using adhesives or mechanical fasteners, ensuring long-term durability and resistance to environmental factors. The conductive wire can be made from materials like copper, silver, or conductive polymers, chosen based on conductivity, flexibility, and cost requirements. The substrate can be a flexible material such as fabric, polymer films, or composite materials, depending on the application. This approach is particularly useful in wearable electronics, IoT devices, and flexible antennas where traditional rigid PCB-based antennas are impractical. The embroidery or overlay techniques allow for customizable antenna designs that can conform to irregular surfaces while maintaining electrical performance.
12. A method according to claim 9 , wherein the second circuit is a passive antenna coupled with a radiofrequency transponder.
A method for wireless communication involves a system with a first circuit and a second circuit. The first circuit generates a radiofrequency (RF) signal, which is then transmitted to the second circuit. The second circuit, which is a passive antenna, receives the RF signal and couples it to a radiofrequency transponder. The transponder modulates the received RF signal to encode data, which is then transmitted back to the first circuit. This method enables wireless data transfer without requiring an active power source for the second circuit, as the passive antenna harvests energy from the RF signal to power the transponder. The system is particularly useful in applications where power efficiency and wireless communication are critical, such as in RFID (radio-frequency identification) systems, sensor networks, or other low-power wireless devices. The passive antenna design ensures minimal power consumption while maintaining reliable communication over short to medium distances. The method leverages existing RF signal transmission techniques to facilitate bidirectional communication between the first and second circuits, with the second circuit operating passively to reduce overall system power requirements.
13. A method according to claim 9 , further comprising a step of depositing an anisotropic conductive material onto each terminal portion of the first antenna circuit and a step of transferring and connecting a/an coated/encapsulated chip via said anisotropic conductive material.
This invention relates to the field of antenna circuit manufacturing, specifically addressing the challenge of efficiently connecting encapsulated chips to antenna terminals in a reliable and precise manner. The method involves depositing an anisotropic conductive material onto terminal portions of a first antenna circuit. Anisotropic conductive materials are used to enable electrical conduction in specific directions while preventing unwanted conduction in others, ensuring precise connectivity. The deposited material facilitates the transfer and connection of a coated or encapsulated chip to the antenna circuit. The chip is positioned such that its conductive elements align with the terminal portions, and the anisotropic conductive material ensures a secure electrical connection without short-circuiting adjacent terminals. This process enhances manufacturing efficiency by simplifying the chip attachment step while maintaining high reliability in the electrical connection. The method is particularly useful in applications where miniaturization and precision are critical, such as in wearable electronics or compact wireless devices. By using anisotropic conductive materials, the invention avoids the need for complex soldering or bonding techniques, reducing production time and cost while ensuring robust performance. The encapsulated chip may include integrated circuits or other electronic components, and the coating or encapsulation protects the chip from environmental factors while allowing electrical connectivity through the anisotropic conductive material. This approach improves yield and reliability in mass production environments.
14. A method according to claim 9 , further comprising a step of depositing a conductive material by printing, specifically screen printing, onto each terminal portion of the first antenna circuit and a step of transferring and connecting an unpackaged chip via said conductive material.
This invention relates to the field of antenna circuit manufacturing, specifically for integrating unpackaged semiconductor chips directly onto printed antenna structures. The problem addressed is the need for efficient and cost-effective methods to connect unpackaged chips to antenna circuits without traditional packaging, which can be bulky and expensive. The method involves first forming a first antenna circuit on a substrate, which may include conductive patterns such as loops, traces, or other configurations. A second antenna circuit is then formed on a separate substrate, which may be a flexible or rigid material. The two antenna circuits are aligned and bonded together, ensuring electrical and mechanical connection between corresponding terminal portions. A key innovation is the deposition of a conductive material, specifically through screen printing, onto the terminal portions of the first antenna circuit. This printed conductive material serves as both an adhesive and a conductive medium. An unpackaged chip is then transferred and connected to the terminal portions via this printed conductive material, eliminating the need for traditional packaging or soldering processes. This approach simplifies assembly, reduces material costs, and enables more compact and flexible antenna designs. The method is particularly useful in applications requiring lightweight, low-profile, or flexible antenna systems, such as wearable electronics or IoT devices.
15. A method according to claim 9 , further comprising a step of coating/encapsulating the chip in a package, except for the studs thereof, prior to the transfer thereof against connection terminal portions.
This invention relates to semiconductor packaging, specifically addressing the challenge of protecting semiconductor chips during transfer and connection to substrates while maintaining electrical connectivity. The method involves coating or encapsulating a semiconductor chip, except for its conductive studs, before transferring the chip to a target substrate. The studs remain exposed to allow electrical connection to terminal portions on the substrate. The coating or encapsulation step ensures mechanical protection and environmental isolation for the chip during handling and placement, reducing damage and improving yield. The studs, typically metal bumps or pillars, provide direct electrical contact points that remain accessible for bonding or soldering to the substrate. This approach is particularly useful in advanced packaging techniques where chips are transferred at wafer or die level, requiring robust protection during intermediate steps. The method may involve using materials like polymers, epoxies, or other encapsulants that are applied selectively to cover the chip while leaving the studs exposed. The encapsulation can be applied using techniques such as spin coating, dispensing, or molding, depending on the specific requirements of the packaging process. The invention aims to enhance reliability and manufacturing efficiency by minimizing defects during chip transfer and connection.
16. A method according to claim 9 , further comprising at least a step of forming a part of the first circuit or fixing the radiofrequency chip in a cavity or an opening provided in one of the substrates.
This invention relates to the field of electronic device manufacturing, specifically methods for integrating radiofrequency (RF) chips with circuit substrates. The problem addressed is the efficient and precise assembly of RF chips into electronic devices, particularly ensuring proper alignment and secure attachment to circuit components. The method involves forming a first circuit on a substrate, which may include conductive traces, antennas, or other electronic elements. A radiofrequency chip is then positioned relative to the first circuit, either by forming part of the circuit or by being fixed in a cavity or opening within one of the substrates. This ensures accurate placement and mechanical stability of the RF chip during subsequent processing steps. The method may also include aligning the RF chip with the first circuit using alignment features, such as fiducial marks or mechanical guides, to ensure proper electrical and mechanical connections. The substrates may be flexible or rigid, depending on the application. The technique is particularly useful in applications requiring compact, high-frequency electronic components, such as wireless communication devices, sensors, or wearable electronics. The method improves manufacturing efficiency and reliability by reducing misalignment and enhancing the structural integrity of the assembled device.
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February 11, 2016
April 19, 2022
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