A method for producing a radiofrequency device having a first antenna circuit connected to a radiofrequency chip and a second antenna circuit associated with, or coupled to, the first circuit, the method including the following steps: formation of the first antenna circuit in the form of a conductive wire deposited in a guided manner on a first substrate; and formation of the second antenna circuit in the form of a conductive wire deposited on the same first substrate in a guided manner and at a calibrated distance from the first antenna circuit.
Legal claims defining the scope of protection, as filed with the USPTO.
1. A method for producing a radiofrequency device comprising a first antenna circuit connected to a radiofrequency chip, and a second antenna circuit disposed at a distance from the first antenna circuit at which the second antenna circuit increases a communication range of the radiofrequency device, comprising the following steps: forming the first antenna circuit by depositing a conductive wire onto a first substrate, and after forming the first antenna circuit, forming the second antenna circuit by depositing a conductive wire onto the first substrate and at the distance from the first antenna circuit, wherein the method results in the final product in the fabrication flow.
2. A method according to claim 1 , wherein the first circuit includes terminal portions for interconnection to the radiofrequency chip in the form of alternations.
3. A method according to claim 1 , wherein portions of wire of the antenna circuit are deposited onto a substrate using embroidery or overlay.
4. A method according to claim 1 , wherein the second circuit is a passive antenna coupled with a radiofrequency transponder.
5. A method according to claim 1 , further comprising a step of depositing an anisotropic conductive material onto each terminal portion of the first antenna circuit and a step of transferring and connecting a/an coated/encapsulated chip via said anisotropic conductive material.
6. A method according to claim 1 , further comprising a step of depositing a conductive material by printing, specifically screen printing, onto each terminal portion of the first antenna circuit and a step of transferring and connecting an unpackaged chip via said conductive material.
7. A method according to claim 1 , further comprising a step of coating/encapsulating the chip in a package, except for the studs thereof, prior to the transfer thereof against connection terminal portions.
8. A method according to claim 1 , further comprising at least a step of forming a part of the first circuit or fixing the radiofrequency chip in a cavity or an opening—provided in one of the substrates.
9. A method for producing a radiofrequency device comprising a first antenna circuit connected to a radiofrequency chip, and a second antenna circuit disposed at a distance from the first antenna circuit at which the second antenna circuit increases a communication range of the radiofrequency device, comprising the following steps: forming the first antenna circuit by depositing a conductive wire onto a first substrate, and after forming the first antenna circuit, forming the second antenna circuit by depositing a conductive wire onto a second substrate and at the distance from the first antenna circuit, wherein the method results in the final product in the fabrication flow.
10. A method according to claim 9 , wherein the first circuit includes terminal portions for interconnection to the radiofrequency chip in the form of alternations.
11. A method according to claim 9 , wherein portions of wire of the antenna circuit are deposited onto a substrate using embroidery or overlay.
12. A method according to claim 9 , wherein the second circuit is a passive antenna coupled with a radiofrequency transponder.
13. A method according to claim 9 , further comprising a step of depositing an anisotropic conductive material onto each terminal portion of the first antenna circuit and a step of transferring and connecting a/an coated/encapsulated chip via said anisotropic conductive material.
14. A method according to claim 9 , further comprising a step of depositing a conductive material by printing, specifically screen printing, onto each terminal portion of the first antenna circuit and a step of transferring and connecting an unpackaged chip via said conductive material.
15. A method according to claim 9 , further comprising a step of coating/encapsulating the chip in a package, except for the studs thereof, prior to the transfer thereof against connection terminal portions.
16. A method according to claim 9 , further comprising at least a step of forming a part of the first circuit or fixing the radiofrequency chip in a cavity or an opening provided in one of the substrates.
Cooperative Patent Classification codes for this invention. Click any code to explore related patents in that topic.
February 11, 2016
April 19, 2022
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