A wafer forming apparatus includes a conveying tray having an ingot accommodating section that accommodates a semiconductor ingot and a wafer accommodating section that accommodates a wafer formed from the semiconductor ingot, a belt conveyor unit that conveys the conveying tray to each processing apparatus, a cassette rack on which cassettes accommodating the wafers are placed correspondingly to the conveying trays, and a transferring unit that transfers the wafer from the wafer accommodating section of the conveying tray to the cassette placed on the cassette rack. The conveying tray is provided with an identification mark. The cassette rack or the cassette corresponding to the conveying tray is provided with the same identification mark as the identification mark provided on the conveying tray.
Legal claims defining the scope of protection, as filed with the USPTO.
1. A wafer forming apparatus for forming a wafer from a semiconductor ingot, the wafer forming apparatus comprising: a conveying tray having an ingot accommodating section that accommodates the semiconductor ingot and a wafer accommodating section that accommodates the wafer formed from the semiconductor ingot; a belt conveyor unit that conveys the conveying tray to at least one processing apparatus; a cassette rack on which cassettes accommodating the wafers are placed correspondingly to the conveying trays; and a transferring unit that transfers the wafer from the wafer accommodating section of the conveying tray to the cassette placed on the cassette rack, wherein the conveying tray is provided with an identification mark, and the cassette rack or the cassette corresponding to the conveying tray is provided with a same identification mark as the identification mark provided on the conveying tray.
2. The wafer forming apparatus according to claim 1 , wherein the identification mark is any one of a color, a symbol, a character, a figure, a pattern, and a picture or a combination thereof.
Cooperative Patent Classification codes for this invention. Click any code to explore related patents in that topic.
March 24, 2021
May 10, 2022
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