Patentable/Patents/US-11362263
US-11362263

Spin orbit torque (SOT) memory devices and methods of fabrication

PublishedJune 14, 2022
Assigneenot available in USPTO data we have
Inventorsnot available in USPTO data we have
Technical Abstract

A perpendicular spin orbit torque (SOT) memory device includes an electrode having a spin orbit coupling material and a magnetic tunnel junction (MTJ) device on a portion of the electrode. The electrode has a first SOC layer and a second SOC layer on a portion of the first SOC layer, where at least a portion of the first SOC layer at an interface with the second SOC layer includes oxygen.

Patent Claims
20 claims

Legal claims defining the scope of protection, as filed with the USPTO.

1

1. A spin orbit torque (SOT) device, comprising: a fixed magnet; a first electrode coupled with the fixed magnet; a free magnet; a tunnel barrier between the free magnet and the fixed magnet; and a spin orbit torque (SOT) electrode coupled with the free magnet, the SOT electrode comprising: a first layer comprising a spin orbit coupling material, wherein the first layer has a first lateral length; and a second layer comprising the spin orbit coupling material, wherein: the second layer is between the free magnet and the first layer; the second layer is in contact with the first layer over a second lateral length that is smaller than the first lateral length; and at least a portion of the first layer at an interface with the second layer comprises oxygen.

2

2. The SOT device of claim 1 , wherein the portion of the first layer comprising oxygen is a first portion and has a thickness between 0.1 nm and 0.3 nm.

3

3. The SOT device of claim 1 , wherein a second portion of the first layer at an interface with the second layer comprises no oxygen.

4

4. The SOT device of claim 1 , wherein the portion of the first layer at an interface with the second layer comprises a greater concentration of oxygen compared to oxygen at an interface between the second layer and the free magnet.

5

5. The SOT device of claim 1 , wherein an uppermost surface of the first layer has a surface roughness that is less than a surface roughness of an uppermost surface of the second layer.

6

6. The SOT device of claim 1 , wherein the first layer is a first width and the second layer is the first width.

7

7. The SOT device of claim 6 , wherein the free magnet has a diameter equal to the first width and the second lateral length.

8

8. The SOT device of claim 1 , wherein an uppermost surface of the first layer not covered by the second layer is recessed below a lowermost surface of the second layer, wherein the amount of recess is less than a thickness of the remaining first layer.

9

9. The SOT device of claim 1 , wherein the SOT device further comprises a conductive layer adjacent to a sidewall of the first layer and between the sidewall of the first layer and a dielectric layer.

10

10. The SOT device of claim 9 , wherein the first layer extends over an uppermost surface of the conductive layer.

11

11. The SOT device of claim 10 , wherein at least a portion of the uppermost surface of the conductive layer proximal to the second layer comprises oxygen.

12

12. A method of fabricating a spin orbit torque (SOT) device, the method comprising: depositing and planarizing a first layer including a spin orbit coupling material; depositing a second layer including the spin orbit coupling material on the first layer, wherein at least a portion of the first layer at an interface with the second layer comprises oxygen; forming a material layer stack for a magnetic tunnel junction (MTJ) memory device, the forming comprising: depositing a fixed magnetic layer; depositing a tunnel barrier layer over the fixed magnetic layer; and depositing a free magnetic layer over the tunnel barrier layer; etching the material layer stack, wherein the etching forms a magnetic tunnel junction (MTJ) device; and etching the second layer including the spin orbit coupling material to have a second lateral length that is smaller than a first lateral length of the first layer by using the MTJ device as a mask.

13

13. The method of claim 12 , wherein the method further comprises: forming an opening in a dielectric layer; depositing a conductive layer in the opening prior to depositing the first layer including the spin orbit coupling material; depositing the first layer including the spin orbit coupling material on the conductive layer; and planarizing the spin orbit coupling material, portions of the conductive layer and the dielectric layer to form a first spin orbit torque (SOT) electrode in the opening.

14

14. The method of claim 12 , wherein etching the second layer comprises etching the portion of the first layer comprising oxygen.

15

15. The method of claim 14 , wherein the etching further comprises recessing an uppermost portion of the first layer by an amount less than a thickness of the second layer.

16

16. The method of claim 12 , further comprises forming a dielectric spacer layer adjacent to the MTJ device.

17

17. An apparatus comprising: a transistor above a substrate, the transistor comprising: a drain contact coupled to a drain; a source contact coupled to a source; a gate contact coupled to a gate; and a spin orbit torque (SOT) device coupled with the drain contact, the SOT device comprising: a fixed magnet; a first electrode coupled with the fixed magnet; a free magnet; a tunnel barrier between the free magnet and the fixed magnet; and a spin orbit torque (SOT) electrode coupled with the free magnet, the SOT electrode comprising: a first layer comprising a spin orbit coupling material, wherein the first layer has a first lateral length; and a second layer comprising the spin orbit coupling material, wherein: the second layer is between the free magnet and the first layer; the second layer is in contact with the first layer over a second lateral length that is smaller than the first lateral length; and at least a portion of the first layer at an interface with the second layer comprises oxygen; and a conductive interconnect coupled with the SOT electrode, wherein the MTJ device is between the conductive electrode and the drain contact.

18

18. The apparatus of claim 17 , wherein the portion of the first layer comprising oxygen is a first portion and has a thickness between 0.1 nm and 0.3 nm.

19

19. The apparatus of claim 17 , wherein a second portion of the first layer at an interface with the second layer comprises no oxygen.

20

20. The apparatus of claim 17 , wherein the first layer is a first width and the second layer is the first width, and wherein the free magnet has a diameter equal to the first width and the second lateral length.

Classification Codes (CPC)

Cooperative Patent Classification codes for this invention. Click any code to explore related patents in that topic.

Patent Metadata

Filing Date

June 29, 2018

Publication Date

June 14, 2022

Want to explore more patents?

Browse 5M+ US patents with plain-English claim translations and AI-generated analysis.

Citation & reuse

Analysis on this page is generated by Patentable — an AI-powered patent intelligence platform. AI-generated summaries, explanations, and analysis may be reused with attribution and a visible link back to the canonical URL below. Patent abstracts and claims are USPTO public domain.

Cite as: Patentable. “Spin orbit torque (SOT) memory devices and methods of fabrication” (US-11362263). https://patentable.app/patents/US-11362263

© 2026 Patentable. All rights reserved.

Patentable is a research and drafting-assistant tool, not a law firm, and does not provide legal advice. Documents we generate are drafts for review by a licensed patent attorney.