A method of forming a textured surface layer along a substrate that includes disposing a plurality of polymer spheres on a surface of the metal substrate, and electroplating the metal substrate at a current density to deposit a metal layer along a body of each of the plurality of polymer spheres disposed on the surface of the metal substrate. The metal layer does not extend above a top surface of the plurality of polymer spheres. The method further includes removing the plurality of polymer spheres from the metal layer to form the textured surface defined by a size and shape of the plurality of polymer spheres.
Legal claims defining the scope of protection, as filed with the USPTO.
1. A method of forming a textured surface along a metal substrate comprising: disposing a plurality of polymer spheres on a surface of the metal substrate; electroplating the metal substrate at a current density to deposit a metal layer along a body of each of the plurality of polymer spheres disposed on the surface of the metal substrate, wherein the metal layer does not extend above a top surface of the plurality of polymer spheres; and removing the plurality of polymer spheres from the metal layer to form the textured surface defined by a size and shape of the plurality of polymer spheres.
2. The method of claim 1 , wherein the textured surface is defined by a plurality of protrusions and a plurality of dimples.
3. The method of claim 2 , wherein each of the plurality of dimples is disposed between and defined by an adjacent pair of protrusions of the plurality of protrusions.
4. The method of claim 2 , further comprising selectively adjusting a thickness of the plurality of protrusions and the plurality of dimples of the textured surface by manipulating a predetermine duration of the electroplating.
5. The method of claim 2 , further comprising ceasing the electroplating after a predetermined duration to control a thickness of the metal layer.
6. The method of claim 5 , wherein the predetermination duration is less than or equal to approximately ten minutes.
7. The method of claim 1 , further comprising coupling a cooling apparatus to the metal layer.
8. The method of claim 1 , wherein the metal layer includes a material composition similar to the metal substrate.
9. The method of claim 1 , wherein the metal layer includes a material composition different than the metal substrate.
10. The method of claim 1 , wherein the current density is less than or equal to approximately 50 milliampere per square centimeter (mA/cm 2 ).
11. The method of claim 1 , wherein removing the plurality of polymer spheres comprises dissolving the plurality of polymer spheres with a solution.
12. The method of claim 1 , further comprising bonding a semiconductor device onto a second surface of the metal substrate that is opposite of the metal layer.
Cooperative Patent Classification codes for this invention. Click any code to explore related patents in that topic.
November 26, 2019
July 5, 2022
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