The present application provides a method of fabricating a light-emitting diode (LED) display panel, including the following steps: forming an LED substrate including a first substrate, an LED chip disposed on the first substrate, and a first electrode disposed on the LED chip; forming a driving substrate including a second substrate and a second electrode disposed on the second substrate; activating surfaces of the first electrode and the second electrode; aligning and pre-bonding the first electrode with the second electrode; and bonding the first electrode and the second electrode.
Legal claims defining the scope of protection, as filed with the USPTO.
1. A method of fabricating a light-emitting diode (LED) display panel, comprising the following steps: forming an LED substrate comprising a first substrate, an LED chip disposed on the first substrate, and a first electrode disposed on the LED chip; forming a driving substrate comprising a second substrate and a second electrode disposed on the second substrate; activating surfaces of the first electrode and the second electrode by performing hydrophilic treatment on the surfaces of the first electrode and the second electrode; aligning and pre-bonding the first electrode with the second electrode, the first electrode and the second electrode in a one-to-one correspondence with each other; and bonding the first electrode and the second electrode.
2. The method of fabricating the LED display panel according to claim 1 , wherein the first electrode and the second electrode are aligned, pre-bonded, and bonder in vacuum or an atmospheric environment.
3. The method of fabricating the LED display panel according to claim 1 , wherein the step of bonding the first electrode and the second electrode comprises: placing the pre-bonded LED substrate and driving substrate into a bonding system; and annealing the pre-bonded LED substrate and driving substrate to bond the first electrode and the second electrode.
4. The method of fabricating the LED display panel according to claim 3 , wherein during the annealing, a temperature in the bonding system is lower than or equal to 400 degrees Celsius and greater than or equal to 150 degrees Celsius.
5. The method of fabricating the LED display panel according to claim 1 , wherein the step of activating surfaces of the first electrode and the second electrode further comprises activating the surfaces of the first electrode and the second electrode by plasma.
6. The method of fabricating the LED display panel according to claim 5 , wherein the surfaces of the first electrode and the second electrode are subjected to the hydrophilic treatment with a mixed solution.
7. The method of fabricating the LED display panel according to claim 1 , wherein the step of forming a driving substrate comprises: providing the second substrate; forming the second electrode on the second substrate; and forming a patterned protective layer on the second substrate, wherein the protective layer covers the second substrate and exposes the second electrode.
8. The method of fabricating the LED display panel according to claim 7 , wherein the protective layer has a height less than or equal to a height of the second electrode.
9. The method of fabricating the LED display panel according to claim 1 , wherein the step of forming an LED substrate comprises: providing the first substrate; disposing the LED chip on the first substrate; and disposing the first electrode on the LED chip.
10. The method of fabricating the LED display panel according to claim 1 wherein the step of disposing the LED chip on the first substrate comprises: grooving the first substrate to form a patterned groove; disposing a colloid on a bottom surface of the groove; and adhering the LED chip to the colloid.
11. A method of fabricating a light-emitting diode (LED) display panel, comprising the following steps: forming an LED substrate comprising a first substrate, an LED chip disposed on the first substrate, and a first electrode disposed on the LED chip; forming a driving substrate comprising a second substrate and a second electrode disposed on the second substrate; activating surfaces of the first electrode and the second electrode; aligning and pre-bonding the first electrode with the second electrode, the first electrode and the second electrode in a one-to-one correspondence with each other; and bonding the first electrode and the second electrode; wherein the step of activating surfaces of the first electrode and the second electrode comprises: performing hydrophilic or hydrophobic treatment on the surfaces of the first electrode and the second electrode; and activating the surfaces of the first electrode and the second electrode by plasma; and the step of bonding the first electrode and the second electrode comprises: placing the pre-bonded LED substrate and driving substrate into a bonding system; and annealing the pre-bonded LED substrate and driving substrate to bond the first electrode and the second electrode.
12. The method of fabricating the LED display panel according to claim 11 , wherein during the annealing, a temperature in the bonding system is lower than or equal to 400 degrees Celsius and greater than or equal to 150 degrees Celsius.
13. The method of fabricating the LED display panel according to claim 11 , wherein the surfaces of the first electrode and the second electrode are subjected to the hydrophilic treatment with a mixed solution.
14. The method of fabricating the LED display panel according to claim 11 , wherein the first electrode and the second electrode are aligned, pre-bonded, and bonded in vacuum or an atmospheric environment.
15. The method of fabricating the LED display panel according to claim 11 , wherein the step of forming a driving substrate comprises: providing the second substrate; forming the second electrode on the second substrate; and forming a patterned protective layer on the second substrate, wherein the protective layer covers the second substrate and exposes the second electrode.
16. The method of fabricating the LED display panel according to claim 15 , wherein the protective layer has a height less than or equal to a height of the second electrode.
17. The method of fabricating the LED display panel according to claim 11 , wherein the step of forming an LED substrate comprises: providing the first substrate; disposing the LED chip on the first substrate; and disposing the first electrode on the LED chip.
18. The method of fabricating the LED display panel according to claim 17 , wherein the step of disposing the LED chip on the first substrate comprises: grooving the first substrate to form a patterned groove; disposing a colloid on a bottom surface of the groove; and adhering the LED chip to the colloid.
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November 28, 2019
July 19, 2022
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