A processing apparatus includes a chuck table mechanism including a chuck table configured to hold the wafer and a table base configured to support the chuck table in a detachable manner. The chuck table includes a porous plate having a suction surface that sucks the wafer, a frame body surrounding surfaces of the porous plate other than the suction surface of the porous plate, a wafer suction hole formed in the frame body and configured to transmit a suction force to the suction surface of the porous plate, and a bolt hole formed in the frame body and configured to fix the frame body to the table base.
Legal claims defining the scope of protection, as filed with the USPTO.
7. The processing apparatus according to claim 1, wherein the fastener is a bolt.
8. The processing apparatus according to claim 1, wherein the fixing hole is formed on an outer circumferential stepped portion formed along an outside side wall of the frame body.
Cooperative Patent Classification codes for this invention. Click any code to explore related patents in that topic.
June 10, 2021
July 26, 2022
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