A semiconductor package carrier board, a method for fabricating the same, and an electronic package having the same are provided. The method includes forming on a circuit structure a graphene layer that acts as an insulation heat dissipating layer. Since the heat conductivity of the graphene layer is far greater than the heat conductivity of ink (about 0.4 W/m·k), which is used as solder resist, the heat of the semiconductor package carrier board can be conducted quickly, and thus can avoid the problem that the heat will be accumulated on the semiconductor package carrier board.
Legal claims defining the scope of protection, as filed with the USPTO.
3. The semiconductor package carrier board of claim 2, wherein the rigid layer is made of a conductive material.
4. The semiconductor package carrier board of claim 2, wherein the rigid layer is made of a non-conductive material.
5. The semiconductor package carrier board of claim 2, further comprising a plurality of conductive elements bonded to the plurality of solder pads in the plurality of holes and being in contact with the insulation heat dissipating layer.
6. The semiconductor package carrier board of claim 1, further comprising a plurality of conductive elements bonded to the plurality of solder pads exposed from the plurality of holes on at least one of the first side and the second side of the circuit structure and being in contact with the insulation heat dissipating layer.
9. The electronic package of claim 8, wherein the rigid layer is made of a conductive material.
10. The electronic package of claim 8, wherein the rigid layer is made of a non-conductive material.
13. The method of claim 12, wherein the rigid layer is made of a conductive material.
14. The method of claim 12, wherein the rigid layer is made of a non-conductive material.
Cooperative Patent Classification codes for this invention. Click any code to explore related patents in that topic.
June 5, 2020
August 2, 2022
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