A semiconductor module includes: an insulated circuit board; a semiconductor device mounted on the insulated circuit board; a printed wiring board arranged above the insulated circuit board and the semiconductor device and having a through-hole; a metal pile having a lower end bonded to an upper surface of the semiconductor device and a cylindrical portion penetrating through the through-hole and bonded to the printed wiring board; a case surrounding the insulated circuit board, the semiconductor device, the printed wiring board and the metal pile; and a sealing material sealing an inside of the case.
Legal claims defining the scope of protection, as filed with the USPTO.
4. The semiconductor module according to claim 1, wherein the semiconductor device includes a plurality of devices having different thicknesses and mounted on the insulated circuit board.
5. The semiconductor module according to claim 1, wherein the semiconductor device is made of a wide-band-gap semiconductor.
6. The semiconductor module according to claim 1, wherein the bonding material is conductive.
Cooperative Patent Classification codes for this invention. Click any code to explore related patents in that topic.
April 9, 2020
August 23, 2022
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