A light emitting device includes a light emitting diode chip, a light transmitting member, a white barrier member, and a conductive adhesive member. The light emitting diode chip has a bump pad formed on the lower surface thereof. The light transmitting member covers the side surfaces and the upper surface of the light emitting diode chip, and the upper surface of the light transmitting member has a rectangular shape having long sides and short sides. The conductive adhesive member is formed to extend through the white barrier member from the bottom of the light emitting diode chip. The upper surface of the conductive adhesive member is connected to the bump pad of the light emitting diode chip, and the lower surface of the conductive adhesive member is exposed at the lower surface of the white barrier member.
Legal claims defining the scope of protection, as filed with the USPTO.
3. The light emitting module according to claim 2, wherein a portion of a wavelength conversion member covering a short side surface of the light emitting diode chip has a smaller thickness than a portion of the wavelength conversion member covering a long side surface of the light emitting diode chip.
4. The light emitting module according to claim 1, wherein an inner wall of the white barrier member covering a side surface of a wavelength conversion member has an inclination.
6. The light emitting module according to claim 5, wherein the first inner wall of the white barrier member has a greater inclination angle than the second inner wall thereof with reference to the side surface of the light emitting diode chip.
7. The light emitting module according to claim 1, wherein the predetermined separation distance between the opposite short side surfaces of the light emitting device is adjusted to permit light emitted from the side surfaces of adjacent light emitting devices to reach a region corresponding to the separation distance.
8. The light emitting module according to claim 1, wherein the circuit board is formed with an electrically conductive circuit pattern and the plurality of light emitting devices are electrically connected to the circuit pattern.
9. The light emitting module according to claim 8, wherein the plurality of light emitting devices are connected in series to each other by the circuit pattern.
10. The light emitting module according to claim 1, wherein one or more of the plurality of light emitting devices further comprise a wavelength conversion material dispersed in the light transmitting member.
16. The light emitting module according to claim 15, wherein first inner walls of the white barrier member define the plurality of through-holes and have one or more inclinations in the plurality of through-holes.
17. The light emitting module according to claim 11, wherein the circuit board comprises a first region in which the light emitting device is disposed and a second region coupled to the first region and perpendicular to the first region.
19. The light emitting module according to claim 18, wherein the Zener device further comprises a white barrier member covering the Zener diode.
20. The light emitting module according to claim 11, wherein second inner walls of the white barrier member define a cavity and an inclination angle of the second inner walls is different from one or more inclination angles of the first inner walls.
Cooperative Patent Classification codes for this invention. Click any code to explore related patents in that topic.
March 13, 2020
August 23, 2022
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