A thermal management unit includes a heat sink, which includes a base portion having a first side and a second side opposite the first side. The heat sink also includes a first protrusion structure and a second protrusion structure. The first protrusion structure protrudes from the first side of the base portion, and the first protrusion structure includes a plurality of fins. The second protrusion structure protrudes from the second side of the base portion, and the second protrusion structure includes a plurality of ribs.
Legal claims defining the scope of protection, as filed with the USPTO.
2. The thermal management unit of claim 1, wherein the fins extend along a first direction on the first side of the base portion, and wherein the ribs extend along a second direction on the second side of the base portion, the first direction and second direction orthogonal to one another.
3. The thermal management unit of claim 1, wherein each of the fins respectively includes a base connected to the base portion and a tip opposite the base thereof, wherein a surface facing an adjacent fin and connecting the tip and the base of a fin of the plurality of fins is greater than 90° with respect to a plane defined by the first side of the base portion.
4. The thermal management unit of claim 1, wherein each of the ribs respectively includes a base connected to the base portion and a tip opposite the base thereof, wherein a surface facing an adjacent rib and connecting the tip and the base of a rib of the plurality of ribs is greater than 90° with respect to a plane defined by the second side of the base portion.
5. The thermal management unit of claim 1, wherein the second protrusion structure further comprises a mounting pad.
7. The thermal management unit of claim 6, wherein the heat-generating device comprises a ball-bumped integrated-circuit (IC) chip, and wherein the substrate comprises a printed circuit board (PCB).
8. The thermal management unit of claim 6, wherein the heat-generating device is bonded to the substrate and the mounting pad of the heat sink.
9. The thermal management unit of claim 8, wherein the heat-generating device is bonded by a thermal epoxy or metal solder.
10. The thermal management unit of claim 1, wherein the heat sink further comprises a recess on the second side of the base portion.
12. The thermal management unit of claim 10, wherein the heat-generating device comprises a ball-bumped integrated-circuit (IC) chip, and wherein the substrate comprises a printed circuit board (PCB).
13. The thermal management unit of claim 10, wherein the second protrusion structure further comprises a mounting pad, and wherein the heat-generating device is bonded to the substrate and the mounting pad of the heat sink.
14. The thermal management unit of claim 13, wherein the heat-generating device is bonded by a thermal epoxy or metal solder.
Cooperative Patent Classification codes for this invention. Click any code to explore related patents in that topic.
November 8, 2020
August 23, 2022
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