A piezoelectric substrate manufacturing device that includes first and electrodes that face each other with a piezoelectric substrate interposed therebetween; a cover that surrounds the second electrode such that the leading end of the second electrode is exposed; a supply unit that supplies a processing gas to an internal space of the cover; a processing unit that performs surface processing on the piezoelectric substrate by applying a voltage between the first and second electrodes causing the processing gas to change into plasma; a detector that is provided outside the cover with its relative position fixed with respect to the second electrode; a measurement unit that measures the thickness of the piezoelectric substrate using the detector; a driving unit that changes the relative positions of the first and second electrodes; and a control unit that controls the supply unit, the processing unit, the measurement unit, and the driving unit.
Legal claims defining the scope of protection, as filed with the USPTO.
2. The piezoelectric substrate manufacturing device according to claim 1, further comprising a control unit including a processor and configured to control the supply unit, the processing unit, the measurement unit, and the driving unit.
3. The piezoelectric substrate manufacturing device according to claim 1, wherein the detector includes a third electrode, and the measurement unit is configured to apply a voltage between the first electrode and the third electrode and to measure the thickness of the piezoelectric substrate based on an electrical characteristic as the measurement signal detected by the detector.
4. The piezoelectric substrate manufacturing device according to claim 3, wherein a surface of the third electrode that faces the first electrode comprises a shape that is different from a shape of a surface of the second electrode that faces the first electrode.
5. The piezoelectric substrate manufacturing device according to claim 4, wherein the surface of the second electrode that faces the first electrode comprises a surface area that is larger than a surface area of the surface of the third electrode that faces the first electrode.
6. The piezoelectric substrate manufacturing device according to claim 4, wherein the surface of the second electrode that faces the first electrode comprises a surface area that is smaller than a surface area of the surface of the third electrode that faces the first electrode.
7. The piezoelectric substrate manufacturing device according to claim 3, wherein a distance between the first electrode and a surface of the second electrode that faces the first electrode is equal to a distance between the first electrode and a surface of the third electrode that faces the first electrode.
8. The piezoelectric substrate manufacturing device according to claim 3, wherein a distance between the first electrode and a surface of the second electrode that faces the first electrode is different from a distance between the first electrode and a surface of the third electrode that faces the first electrode.
9. The piezoelectric substrate manufacturing device according to claim 3, wherein the electrical characteristic is a frequency detected when the voltage is applied between the first and third electrodes.
11. The piezoelectric substrate manufacturing device according to claim 10, wherein the light-emitting unit is configured to radiate the light in a linear shape, and the light-receiving unit is configured to receive the light reflected in a linear shape.
12. The piezoelectric substrate manufacturing device according to claim 10, wherein the light-emitting unit is configured to radiate the light in a planar shape, and the light-receiving unit is configured to receive the light reflected in a planar shape.
13. The piezoelectric substrate manufacturing device according to claim 1, wherein the cover includes a gap between the cover and a surface of the second electrode that faces the first electrode.
14. The piezoelectric substrate manufacturing device according to claim 1, wherein the second electrode includes at least one through hole.
15. The piezoelectric substrate manufacturing device according to claim 1, wherein the piezoelectric substrate is disposed on the first electrode, and the second electrode and the detector are held and moved by the driving unit.
16. The piezoelectric substrate manufacturing device according to claim 1, wherein the piezoelectric substrate is a crystal substrate.
18. The piezoelectric substrate manufacturing method according to claim 17, wherein the detector includes a third electrode, and the measuring of the thickness of the piezoelectric substrate comprises applying a voltage between the first and third electrodes and measuring the thickness of the piezoelectric substrate based on an electrical characteristic in response to the applied voltage.
19. The piezoelectric substrate manufacturing method according to claim 18, wherein a surface of the third electrode that faces the first electrode comprises a shape that is different from a shape of a surface of the second electrode that faces the first electrode.
20. The piezoelectric substrate manufacturing method according to claim 19, wherein the surface of the second electrode that faces the first electrode comprises a surface area that is larger than a surface area of the surface of the third electrode that faces the first electrode.
21. The piezoelectric substrate manufacturing method according to claim 19, wherein the surface of the second electrode that faces the first electrode comprises a surface area that is smaller than a surface area of the surface of the third electrode that faces the first electrode.
22. The piezoelectric substrate manufacturing method according to claim 18, wherein a distance between the first electrode and a surface of the second electrode that faces the first electrode is equal to a distance between the first electrode and a surface of the third electrode that faces the first electrode.
23. The piezoelectric substrate manufacturing method according to claim 18, wherein a distance between the first electrode and a surface of the second electrode that faces the first electrode is different from a distance between the first electrode and a surface of the third electrode that faces the first electrode.
24. The piezoelectric substrate manufacturing method according to claim 18, wherein the measuring of the thickness of the piezoelectric substrate further comprises detecting the electrical characteristic as a frequency when the voltage is applied between the first and third electrodes.
28. The piezoelectric substrate manufacturing method according to claim 17, further comprising providing the cover with a gap between the cover and a surface of the second electrode that faces the first electrode.
29. The piezoelectric substrate manufacturing method according to claim 17, wherein the second electrode includes at least one through hole.
31. The piezoelectric substrate manufacturing method according to claim 17, wherein the piezoelectric substrate is a crystal substrate.
32. The piezoelectric substrate manufacturing method according to claim 17, wherein the performing of the surface processing further comprises etching the piezoelectric substrate by the plasma to performing the surface processing of the piezoelectric substrate.
Cooperative Patent Classification codes for this invention. Click any code to explore related patents in that topic.
February 13, 2020
September 6, 2022
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