Patentable/Patents/US-11453208
US-11453208

Adhesive laminate film and method for manufacturing electronic device

PublishedSeptember 27, 2022
Assigneenot available in USPTO data we have
Inventorsnot available in USPTO data we have
Technical Abstract

An adhesive laminate film has a heat-resistant resin layer, a flexible resin layer, and an adhesive resin layer in this order, a peel strength P0 between the heat-resistant resin layer and the flexible resin layer, which is based on JIS Z0237 and measured under defined conditions, is equal to or more than 0.01 N/25 mm and equal to or less than 2.0 N/25 mm, and a peel strength P1 between the heat-resistant resin layer and the flexible resin layer after a thermal treatment of the adhesive laminate film at 160° C. for four hours is equal to or more than 0.05 N/25 mm and equal to or less than 1.5 N/25 mm.

Patent Claims
1 claims

Legal claims defining the scope of protection, as filed with the USPTO.

15

15. A structure including the adhesive laminate film according to claim 1, and one or more electronic components attached onto the adhesive resin layer.

Classification Codes (CPC)

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Patent Metadata

Filing Date

November 16, 2017

Publication Date

September 27, 2022

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