A semiconductor device includes an insulated circuit board in which a metal layer is formed on one surface of an insulating board and a semiconductor element having a polygonal shape when viewed in a plan view that is bonded to the metal layer via a bonding material. The metal layer of the insulated circuit board has a recess that exposes the insulating board at a position corresponding to at least one corner of the semiconductor element.
Legal claims defining the scope of protection, as filed with the USPTO.
2. The semiconductor device according to claim 1, wherein the bonding material forms a fillet connecting from the back surface of the semiconductor element that faces the recess to an inner sidewall of the recess.
4. The semiconductor device according to claim 1, wherein the recess has a triangular shape that overlaps with the corner when viewed in a plan view.
5. The semiconductor device according to claim 1, wherein the recess has an arc portion that, when viewed in a plan view, curves so as to be adjacent to or tangential to two sides of the semiconductor element that define the corner.
7. The semiconductor device according to claim 6, wherein at each corner of the semiconductor element, the recess has a triangular shape that overlaps with the corner when viewed in a plan view.
8. The semiconductor device according to claim 6, wherein at each corner of the semiconductor element, the recess has an arc portion that, when viewed in a plan view, curves so as to be adjacent to or tangential to two sides of the semiconductor element that define the corner.
Cooperative Patent Classification codes for this invention. Click any code to explore related patents in that topic.
September 26, 2019
September 27, 2022
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