A package structure includes a circuit substrate, a semiconductor package, a lid structure, a passive device and a barrier structure. The semiconductor package is disposed on and electrically connected to the circuit substrate. The lid structure is disposed on the circuit substrate covering the semiconductor package. The lid structure is attached to the circuit substrate through an adhesive material. The passive device is disposed on the circuit substrate in between the semiconductor package and the lid structure. The barrier structure is separating the passive device from the lid structure and the adhesive material, and the barrier structure is in contact with the adhesive material.
Legal claims defining the scope of protection, as filed with the USPTO.
2. The package structure according to claim 1, wherein the first dam portion has a first sidewall that faces the lid structure and a second sidewall opposite to the first sidewall that faces the first passive device, and the first sidewall of the first dam portion is in physical contact with the adhesive material.
3. The package structure according to claim 2, wherein the barrier structure further comprises a second dam portion located in between the first dam portion and the second passive device and spaced apart from the second passive device and the first dam portion.
4. The package structure according to claim 2, wherein the first dam portion comprises a bottom section and a top section, and a width of the first dam portion decreases from the bottom section to the top section.
5. The package structure according to claim 2, wherein the first dam portion comprises a bottom section, a middle section and a top section, and a width of the first dam portions increases from the bottom section to the middle section, and the width decreases from the middle section to the top section.
6. The package structure according to claim 1, wherein the barrier structure further comprises a cover portion that covers side surfaces and a top surface of a third passive device located aside the first passive device.
7. The package structure according to claim 6, wherein the cover portion is in contact with the third passive device.
9. The package structure according to claim 8, further comprising an auxiliary second dam portion disposed in between the auxiliary first dam portion and the second passive device, and in between the auxiliary first dam portion and the fourth passive device, wherein the auxiliary second dam portion surrounds the three side surfaces of the second passive device and uncovers the side surface of the second passive device that is facing the second side of the semiconductor package, and surrounds three side surfaces of the fourth passive device and uncovers a side surface of the fourth passive device that is facing the second side of the semiconductor package.
11. The package structure according to claim 10, wherein the interposer structure is electrically connected to the circuit substrate through a plurality of conductive terminals, and the package structure further comprises an underfill structure surrounding the plurality of conductive terminals.
12. The package structure according to claim 10, wherein the first dam portion has a first sidewall that faces the lid structure and a second sidewall opposite to the first sidewall that faces the first passive device and the second passive device, and the first sidewall of the first dam portion is in contact with the adhesive material.
13. The package structure according to claim 12, wherein the first dam portion comprises a bottom section and a top section, and a width of the first dam portion decreases from the bottom section to the top section.
14. The package structure according to claim 12, wherein a height of the ring-shaped second dam portion is different than a height of the first dam portion.
15. The package structure according to claim 10, wherein the plurality of barrier structures further comprises a cover portion that covers the first surface, the second surface, the third surface, the fourth surface and a top surface of the second passive device.
17. The method according to claim 16, wherein the first dam portion has a first sidewall that faces the lid structure and a second sidewall opposite to the first sidewall that faces the first passive device, and the lid structure is attached to the circuit substrate so that the adhesive material contacts the first sidewall.
18. The method according to claim 17, wherein the polymer ink material is further dispensed on the circuit substrate to surround the first passive device.
19. The method according to claim 17, wherein after forming the auxiliary first dam portion, the polymer ink material is further dispensed on the circuit substrate in an area located in between the auxiliary first dam portion and the second passive device, and after curing the polymer ink material, the barrier structure comprising a second dam portion is formed, and the second dam portion is separated from the auxiliary first dam portion.
20. The method according to claim 16, wherein the polymer ink material is further dispensed on the circuit substrate in an area overlapped with a third passive device adjacent to the first passive device, to cover the third passive device, and after curing the polymer ink material, the barrier structure comprising a cover portion that covers side surfaces and a top surface of the third passive device is formed.
Cooperative Patent Classification codes for this invention. Click any code to explore related patents in that topic.
April 12, 2020
September 27, 2022
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