A semiconductor package may include a package substrate, a molded interposer package (MIP) and a first stiffener. The MIP may be arranged on the package substrate. The MIP may include an interposer, at least one first semiconductor chip and at least one second semiconductor chip molded by a molding member. The first stiffener may be attached to any one of outer surfaces of the MIP. The first stiffener may be spaced apart from the upper surface of the package substrate to suppress a warpage of the MIP. Thus, central conductive bumps between the MIP and the package substrate may not be upwardly floated to improve an electrical connection between the central conductive bumps and the package substrate. Further, a short between edge conductive bumps between the MIP and the package substrate may not be generated.
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6. The semiconductor package of claim 5, wherein each of the first stiffeners has a length in the first direction substantially same as a length of the outer surface of the first molding portions.
7. The semiconductor package of claim 5, wherein the first stiffeners comprises aluminum.
13. The semiconductor package of claim 11, wherein a thickness of the first stiffener is less than or equal to a thickness of the molding member.
The semiconductor package relates to electronic device packaging, specifically addressing the need for improved structural integrity and reliability in semiconductor modules. The invention involves a semiconductor package with a stiffener structure designed to enhance mechanical stability while maintaining efficient heat dissipation. The package includes a substrate, a semiconductor chip mounted on the substrate, and a molding member encapsulating the chip. A first stiffener is attached to the substrate, providing structural reinforcement. The first stiffener has a thickness that is less than or equal to the thickness of the molding member, ensuring balanced mechanical support without excessive bulk. This configuration prevents warping or deformation during manufacturing and operation, particularly in high-temperature environments. The stiffener may also include features such as openings or recesses to optimize heat dissipation or reduce weight. The package may further include additional stiffeners or thermal interface materials to improve thermal performance. The invention is particularly useful in high-performance computing, automotive electronics, and other applications requiring robust and thermally efficient semiconductor packaging.
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January 29, 2021
October 11, 2022
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