A method and structure for receiving a micro device on a receiving substrate are disclosed. A micro device such as a micro LED device is punched-through a passivation layer covering a conductive layer on the receiving substrate, and the passivation layer is hardened. In an embodiment the micro LED device is punched-through a B-staged thermoset material. In an embodiment the micro LED device is punched-through a thermoplastic material.
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2. The display of claim 1, wherein the plurality of transparent top conductive layers span within the plurality of openings to make electrical contact the plurality of electrode lines.
A display system includes a transparent substrate with a plurality of openings and a plurality of electrode lines positioned on the substrate. The electrode lines are arranged to form a pattern, such as a grid, for driving display elements. The display further includes a plurality of transparent top conductive layers that span across the openings to make electrical contact with the electrode lines. These conductive layers are positioned above the openings and extend to connect with the electrode lines, ensuring electrical continuity. The transparent top conductive layers may be part of a larger conductive structure, such as a transparent conductive oxide (TCO) layer, that facilitates signal transmission across the display. The openings in the substrate allow for the integration of additional components, such as light-emitting diodes (LEDs) or other display elements, while maintaining electrical connectivity through the conductive layers. The design ensures efficient signal distribution and minimizes optical interference, improving display performance. The transparent top conductive layers bridge the openings, ensuring reliable electrical contact with the underlying electrode lines, which may be used for addressing individual pixels or driving larger display sections. This configuration enhances manufacturability and reliability in transparent or flexible display applications.
3. The display of claim 1, wherein each transparent top conductive layer is in electrical contact with more than one LED device of the plurality of groups of LED devices.
4. The display of claim 3, wherein each transparent top conductive layer is in electrical contact with an LED device from each group of LED devices.
This invention relates to display technologies, specifically addressing the challenge of integrating transparent conductive layers with LED devices to enhance display performance. The display includes a substrate with multiple groups of LED devices arranged in a matrix. Each group of LED devices is electrically connected to a corresponding transparent top conductive layer. The transparent top conductive layer is positioned above the LED devices and is configured to provide electrical contact to each LED device within its associated group. This configuration allows for efficient electrical communication between the conductive layer and the LED devices, ensuring uniform power distribution and improved display functionality. The transparent nature of the conductive layer ensures that the display remains visually unobstructed while maintaining electrical connectivity. The arrangement optimizes the display's brightness, contrast, and energy efficiency by ensuring that each LED device receives consistent electrical signals. This design is particularly useful in high-resolution displays where precise control over individual LED devices is required. The invention improves upon existing display technologies by providing a more reliable and efficient method of electrically connecting transparent conductive layers to LED devices, addressing issues related to signal integrity and power distribution in advanced display systems.
5. The display of claim 3, wherein each group of LED devices comprises a pixel group.
6. The display of claim 1, wherein the passivation layer is a thermoset material.
7. The display of claim 1, wherein the passivation is transparent.
8. The display of claim 1, wherein the plurality of groups of LED devices is connected to the plurality of bottom conductive lines with a corresponding plurality of bonding layers.
9. The display of claim 8, wherein each bonding layer in the plurality of bonding layers an alloy bonding layer.
A technical solution involves a display device with multiple bonding layers between a display panel and a backlight unit. The bonding layers are designed to enhance structural integrity and optical performance. Each bonding layer in the plurality of bonding layers is an alloy bonding layer, which provides improved adhesion, thermal stability, and optical transparency compared to conventional bonding materials. The alloy bonding layers may include metal alloys or other composite materials that bond the display panel to the backlight unit while maintaining optical clarity and mechanical strength. This configuration ensures reliable bonding under varying environmental conditions, such as temperature fluctuations and mechanical stress, while minimizing light scattering or reflection that could degrade display quality. The alloy bonding layers may also facilitate efficient heat dissipation, reducing thermal buildup in the display device. This approach is particularly useful in high-performance displays, such as OLED or microLED displays, where bonding integrity and optical performance are critical. The alloy bonding layers may be applied using techniques such as sputtering, evaporation, or lamination, depending on the specific alloy composition and display requirements. The solution addresses challenges related to bonding durability, optical clarity, and thermal management in advanced display technologies.
10. The display of claim 1, wherein the display substrate has a pixel density of greater than 300 pixels per inch.
11. The display of claim 1, wherein each LED device has a maximum width of 1 to 100 μm.
12. The display of claim 1, wherein each LED device has a maximum width of 1 to 10 μm.
13. The display of claim 1, wherein each LED device has a top doped layer, a lower doped layer, and a quantum well layer between the top doped layer and the lower doped layer.
This invention relates to light-emitting diode (LED) displays, specifically addressing the need for improved LED device structures to enhance performance and efficiency. The invention describes an LED display where each LED device includes a top doped layer, a lower doped layer, and a quantum well layer positioned between the top and lower doped layers. The quantum well layer is a thin semiconductor layer that confines charge carriers, enabling efficient light emission when an electric current is applied. The top and lower doped layers provide electrical conductivity and facilitate charge injection into the quantum well layer. This structure allows for precise control over the emission wavelength and improves the overall efficiency of the LED display. The invention may also include additional features such as multiple quantum wells, different doping concentrations, or specific materials to further optimize performance. The described LED device structure is particularly useful in high-brightness, energy-efficient displays for applications like televisions, digital signage, and lighting systems. The invention aims to overcome limitations in conventional LED designs, such as low efficiency, poor color uniformity, or high power consumption, by leveraging advanced semiconductor layer configurations.
14. The display of claim 1, wherein the plurality of groups of LED devices includes a first group of LED devices designed to emit a first color, and a second group of LED devices designed to emit a second color different from the first color.
15. The display of claim 1, wherein the plurality of transparent top conductive layers is formed of a transparent conductive oxide material.
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October 16, 2020
October 18, 2022
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