In an embodiment, a device includes: a package component including: integrated circuit dies; an encapsulant around the integrated circuit dies; a redistribution structure over the encapsulant and the integrated circuit dies, the redistribution structure being electrically coupled to the integrated circuit dies; sockets over the redistribution structure, the sockets being electrically coupled to the redistribution structure; and a support ring over the redistribution structure and surrounding the sockets, the support ring being disposed along outermost edges of the redistribution structure, the support ring at least partially laterally overlapping the redistribution structure.
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2. The device of claim 1, wherein the support ring has a first portion laterally overlapping the redistribution structure, and a second portion extending beyond the outermost edges of the redistribution structure.
3. The device of claim 1, wherein the support ring is laterally confined within the outermost edges of the redistribution structure.
A device includes a support ring integrated with a redistribution structure, where the support ring is laterally confined within the outermost edges of the redistribution structure. The redistribution structure provides electrical interconnections for a semiconductor device, such as a chip or die, and may include conductive traces, vias, and insulating layers. The support ring mechanically reinforces the redistribution structure, preventing warping or deformation during manufacturing or operation. By confining the support ring within the redistribution structure's boundaries, the device maintains a compact form factor while ensuring structural integrity. The support ring may be embedded within the redistribution layers or positioned between them, depending on the design. This configuration is particularly useful in advanced packaging applications where thin, high-density interconnects are required, and mechanical stability is critical. The support ring's placement within the redistribution structure's edges avoids interference with external connections or bonding pads, ensuring reliable electrical performance. The device may further include additional structural elements, such as underfill material or adhesive layers, to enhance robustness. This design addresses challenges in semiconductor packaging, such as thermal expansion mismatches and mechanical stress, by providing localized reinforcement without increasing the overall footprint.
4. The device of claim 1, wherein the support ring has a constant width.
5. The device of claim 1, wherein the support ring has a width decreasing in a direction extending away from a major surface of the redistribution structure.
6. The device of claim 5, wherein the width of the support ring decreases linearly.
7. The device of claim 5, wherein the width of the support ring decreases in steps.
8. The device of claim 1, wherein the support ring has a non-truncated circular shape.
A device for supporting a component, such as a lens or optical element, includes a support ring that maintains the component in a fixed position. The support ring has a non-truncated circular shape, meaning it forms a complete, uninterrupted circular loop without any flat or cut-off sections. This design ensures uniform structural support and stability for the component, preventing misalignment or distortion that could occur with truncated or irregular shapes. The support ring may be integrated into a larger assembly, such as an optical system, where precise positioning of the component is critical. The non-truncated circular shape allows for even distribution of forces and consistent performance under varying conditions. This configuration is particularly useful in applications requiring high precision, such as imaging systems, where any deviation in component alignment could degrade performance. The support ring may be made from rigid materials like metal or composite materials to provide durability and resistance to deformation. The circular design also simplifies manufacturing and assembly processes, as it does not require additional machining or modifications to achieve the desired shape.
9. The device of claim 1, wherein the support ring has a truncated circular shape.
14. The device of claim 12, wherein a width of the support ring decreases in a direction extending from the package component to the mechanical brace.
15. The device of claim 12, wherein a width of the support ring is constant in a direction extending from the package component to the mechanical brace.
A mechanical support system for electronic packages addresses the challenge of maintaining structural integrity and thermal performance in high-power applications. The system includes a support ring that mechanically couples a package component, such as a semiconductor die or heat spreader, to a mechanical brace, which may be a heat sink or housing. The support ring provides structural reinforcement to prevent warping or deformation under thermal or mechanical stress while also facilitating heat dissipation. The ring is designed with a constant width along its length, ensuring uniform load distribution and consistent thermal conductivity between the package component and the brace. This design minimizes stress concentrations and enhances reliability in harsh operating conditions. The support ring may be made of materials with high thermal conductivity, such as metals or composites, and can be integrated with additional features like alignment guides or mounting interfaces. The constant width ensures predictable performance and simplifies manufacturing by eliminating variations in material thickness or geometry. This solution is particularly useful in high-performance computing, power electronics, and aerospace applications where thermal management and mechanical stability are critical.
17. The device of claim 16, wherein the metal ring has a non-truncated circular shape in the top-down view.
A device is disclosed for use in mechanical or structural applications, particularly where precise alignment or rotational movement is required. The device includes a metal ring that maintains a non-truncated circular shape when viewed from above. This design ensures uniform structural integrity and consistent rotational properties, preventing deformation or misalignment during operation. The ring may be part of a larger assembly, such as a bearing, coupling, or rotational joint, where maintaining a perfect circular profile is critical for performance. The non-truncated shape avoids weak points or stress concentrations that could arise from truncated or irregular geometries, ensuring durability and reliability in high-load or high-precision applications. The ring may be integrated with other components, such as housings, shafts, or seals, to form a complete system. The invention addresses challenges in maintaining geometric precision in mechanical systems, particularly where rotational symmetry and load distribution are essential. The metal ring's design ensures consistent performance under dynamic conditions, such as vibration, thermal expansion, or repeated stress cycles. This solution is applicable in industries like aerospace, automotive, and industrial machinery, where precision and durability are paramount.
18. The device of claim 16, wherein the metal ring has a truncated circular shape in the top-down view.
A system for securing components in a mechanical assembly includes a metal ring with a truncated circular shape when viewed from above. The ring is designed to engage with a mating component, ensuring precise alignment and stability. The truncated circular shape allows for controlled deformation under load, distributing stress evenly and preventing localized failure. This design is particularly useful in applications where components must withstand high mechanical stress while maintaining precise positioning, such as in automotive, aerospace, or industrial machinery. The ring may be integrated into a larger assembly, where it interfaces with other structural elements to enhance overall rigidity. The truncated shape also facilitates easier installation and removal, reducing assembly time and maintenance costs. The material and dimensions of the ring are selected to optimize strength, durability, and compatibility with the mating component. This configuration improves the reliability and longevity of the mechanical system by minimizing wear and reducing the risk of misalignment or failure under operational conditions.
19. The device of claim 16, wherein the metal ring is disposed along outermost edges of the redistribution structure, the metal ring partially overlapping the redistribution structure and partially extending beyond the outermost edges of the redistribution structure.
This invention relates to semiconductor packaging, specifically a device with an improved redistribution structure for enhanced electrical and mechanical performance. The problem addressed is the need for better signal integrity, thermal management, and structural integrity in semiconductor packages, particularly where redistribution layers (RDLs) are used to route electrical connections. The device includes a redistribution structure with a metal ring positioned along its outermost edges. The metal ring partially overlaps the redistribution structure and extends beyond its edges, creating a protective and conductive boundary. This configuration improves electrical shielding, reduces signal interference, and enhances mechanical stability by reinforcing the edges of the redistribution structure. The metal ring also aids in heat dissipation, preventing localized overheating in high-performance semiconductor packages. The redistribution structure itself consists of conductive traces and insulating layers that route electrical signals between different components of the semiconductor device. The metal ring is integrated into this structure, ensuring compatibility with existing fabrication processes while providing additional functionality. The overlapping and extending design of the metal ring ensures optimal performance without increasing the overall footprint of the device. This solution is particularly useful in advanced packaging applications, such as fan-out wafer-level packaging (FOWLP), where maintaining signal integrity and structural robustness is critical. The metal ring's placement and design help mitigate issues like delamination and signal loss, improving the reliability of the semiconductor package.
20. The device of claim 16, wherein the metal ring is disposed along outermost edges of the redistribution structure, the metal ring completely overlapping the redistribution structure.
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May 10, 2021
November 15, 2022
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