Substrate processing management system

The substrate processing management system for a substrate processing line including a defect tallying section to calculate a defect rate representing a rate of occurrence of substrates or electronic components determined to be defective with the substrate inspection machine, or obtain a number of defective products having substrates or electronic components determined to be defective; an attribute change recognition section to recognize when an attribute, among the attributes of the electronic component, having a possibility of affecting the inspection, has changed in the component mounting machine; a fault point estimation section to estimate, when the defect rate or the number of defective products exceeds a predetermined value, which of the component mounting machine or the substrate inspection machine is a fault point depending on whether an attribute has changed; and a countermeasure calling section configured to call for a defect countermeasure to the estimated fault point.