A semiconductor packaging substrate is provided and includes: an insulating layer, a thinned circuit structure formed of circuit layers and conductive posts stacked on one another embedding in the insulating layer, and a supporting structure formed on the insulating layer and having at least one through hole exposing the conductive posts. As such, before a subsequent packaging operation, the packaging substrate can be electrically tested and screened so as to prevent a defective packaging substrate from being misused in the subsequent packaging operation and hence avoid the loss of normal electronic elements. A method for fabricating a semiconductor packaging substrate and a packaging process using the semiconductor packaging substrate are also provided.
Legal claims defining the scope of protection, as filed with the USPTO.
2. The semiconductor packaging substrate of claim 1, wherein the supporting structure is made of a photosensitive dielectric material or a photosensitive dry film material.
4. The semiconductor packaging process of claim 3, wherein the supporting structure is removed by a chemical method, laser, plasma, sandblasting or mechanical grinding.
5. The semiconductor packaging process of claim 3, further comprising, after completely removing the supporting structure, forming a conductive element on the first surface of the insulating layer to electrically connect the first end surfaces of the conductive posts.
7. The method of claim 6, wherein the through hole of the supporting structure is formed by lithography.
8. The method of claim 6, wherein the supporting structure is made of a photosensitive dielectric material or a photosensitive dry film material.
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March 16, 2021
November 22, 2022
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