Source/drain via having reduced resistance

3. The device of claim 2, wherein the first via and the second via are offset with respect to one another in both an X-direction and a Y-direction in a top view.

4. The device of claim 2, further comprising: a glue layer disposed on side surfaces and a bottom surface of the second via.

5. The device of claim 4, wherein the glue layer contains titanium or titanium nitride.

6. The device of claim 1, wherein a first maximum lateral dimension of the laterally-protruding bottom portion is greater than a second maximum lateral dimension of the top portion.

7. The device of claim 1, wherein the source/drain contact and the first via have different metal material compositions.

8. The device of claim 1, wherein an uppermost surface of the source/drain contact is narrower than a bottommost surface of the first via.

9. The device of claim 1, wherein the laterally-protruding bottom portion is in direct contact with the source/drain contact.

13. The device of claim 11, wherein the source/drain via and the gate via are offset from each other in both a first horizontal direction and a second horizontal direction that is perpendicular to the first horizontal direction in a top view.

14. The device of claim 11, wherein the glue layer contains titanium or titanium nitride.

17. The device of claim 16, further comprising: a glue layer disposed on side surfaces and a bottom surface of the gate via, wherein the glue layer contains titanium or titanium nitride.

19. The device of claim 15, wherein a bottom surface of the source/drain via is in direct contact with a top surface of the source/drain contact.

20. The device of claim 15, wherein the top portion of the source/drain via is more slanted than the laterally-protruding bottom portion of the source/drain via in the cross-sectional side view.