Embodiments described herein generally relate to phased array antenna systems or packages and techniques of making and using the systems and packages. A phased array antenna package may include a distributed phased array antenna comprising (1) a plurality of antenna sub-arrays, which may each include a plurality of antennas, (2) a plurality of Radio Frequency Dies (RFDs), each of the RFDs located proximate and electrically coupled by a trace of a plurality of traces to a corresponding antenna sub-array of the plurality of antenna sub-arrays, and (3) wherein each trace of the plurality of traces configured to electrically couple an antenna of the plurality of antennas to the RFD located proximate the antenna, wherein each trace of the plurality of traces is configured to transmit millimeter wave (mm-wave) radio signals, and wherein the plurality of traces are each of a substantially uniform length.
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4. The semiconductor package of claim 3, wherein each sub-array of the first plurality of antenna sub-arrays situated on or at least partially in the first dielectric layer and the second dielectric layer, and the traces are situated on or at least partially in the third dielectric layer.
5. The semiconductor package of claim 1, wherein a maximum difference in a length of the traces is no more than two wavelengths of a signal being carried by the traces.
This invention relates to semiconductor packaging, specifically addressing signal integrity issues in high-speed electronic circuits. The problem being solved is signal distortion and interference caused by mismatched trace lengths in semiconductor packages, which can degrade performance in high-frequency applications. The semiconductor package includes multiple conductive traces that carry electrical signals between components. A key feature is that the maximum difference in the lengths of these traces is no more than two wavelengths of the signal being carried. This ensures that signal propagation delays are minimized, reducing reflections, crosstalk, and other forms of signal degradation. The controlled trace lengths help maintain signal integrity, particularly for high-frequency signals where timing and synchronization are critical. The package may also include a substrate with embedded traces, a heat spreader, and encapsulation materials to protect the internal components. The traces are designed to route signals efficiently while adhering to the length constraint. This design is particularly useful in applications such as high-speed data processing, telecommunications, and RF (radio frequency) circuits where precise signal timing is essential. By limiting the trace length difference to two wavelengths, the package ensures that signals arrive at their destinations with minimal distortion, improving overall system reliability and performance.
6. The package of claim 1, wherein each antenna sub-array is coupled to exactly one proximate radio die.
This invention relates to a packaged antenna system for high-frequency wireless communication, addressing challenges in signal integrity and integration density. The system includes multiple antenna sub-arrays, each directly coupled to a single nearby radio die. This proximity minimizes signal loss and interference, improving performance in applications like 5G, mmWave, or satellite communications. The radio die contains integrated circuits for signal processing, modulation, and amplification, tailored to the specific frequency band of the sub-array. The sub-arrays are arranged in a modular, scalable configuration, allowing flexible deployment in compact or high-density environments. Each sub-array consists of multiple antenna elements, optimized for beamforming and spatial multiplexing to enhance data throughput and coverage. The direct coupling between sub-arrays and radio dice eliminates the need for external interconnects, reducing complexity and improving reliability. The package may also include thermal management features to dissipate heat generated by the radio dice, ensuring stable operation. This design is particularly useful in applications requiring high-bandwidth, low-latency communication, such as data centers, autonomous vehicles, or IoT networks. The invention improves upon prior art by integrating radio functionality closer to the antenna elements, reducing signal degradation and enabling more efficient use of available spectrum.
7. The package of claim 1, wherein the antenna sub-arrays are laid out in a rectangular configuration.
This invention relates to antenna packages, specifically those designed for compact, high-performance wireless communication systems. The problem addressed is the need for efficient antenna layouts that maximize signal reception and transmission while minimizing physical space and interference. The invention features an antenna package with multiple antenna sub-arrays arranged in a rectangular configuration. Each sub-array consists of multiple antenna elements, which may be dipole, patch, or other types, optimized for specific frequency bands. The rectangular layout ensures uniform signal distribution, reduces mutual coupling between elements, and improves beamforming capabilities. The package may also include integrated circuitry for signal processing, such as amplifiers, filters, and phase shifters, to enhance performance. The design is particularly useful in applications like 5G, IoT devices, and satellite communications, where space constraints and high data rates are critical. The rectangular arrangement allows for scalable deployment, enabling the package to be adapted for different form factors and performance requirements. The invention improves upon prior art by providing a more structured and efficient antenna layout, leading to better signal integrity and system reliability.
8. The package of claim 1, further comprising a plurality of male or female connection features configured to couple to female or male connection features on a logic die package.
10. The distributed antenna array package of claim 9, wherein the radio dies are situated at least partially in a fourth dielectric layer of the package.
11. The distributed antenna array package of claim 9, wherein the first radio die is situated within a footprint of the first antenna sub-array and electrically coupled to each of the antennas of the first antenna sub-array through first traces of the plurality of traces.
12. The distributed antenna array package of claim 11, wherein the second radio die is situated within a footprint of the second antenna sub-array and electrically coupled to each of the antennas of the first antenna sub-array through second traces of the plurality of traces.
13. The distributed antenna array package of claim 9, wherein each trace of the plurality of traces is configured to electrically couple an antenna of a sub-array to a radio die located most proximate the sub-array.
This invention relates to distributed antenna array packages used in wireless communication systems, particularly for optimizing signal routing between antennas and radio components. The problem addressed is the inefficiency in signal transmission when antennas are connected to distant radio components, leading to signal loss and reduced performance. The solution involves a package with a plurality of traces, each trace electrically coupling an antenna of a sub-array to the nearest radio die. This minimizes signal path length, reducing signal degradation and improving overall system efficiency. The package includes multiple sub-arrays, each with one or more antennas, and a corresponding radio die for each sub-array. The traces are designed to ensure that each antenna in a sub-array is connected to the radio die closest to that sub-array, optimizing signal integrity. The package may also include additional components such as power distribution networks and thermal management features to support the radio dies and antennas. This design enhances signal quality, reduces power consumption, and improves the reliability of wireless communication systems.
14. The distributed antenna array package of claim 9, wherein each trace of the plurality of traces is configured to transmit millimeter wave (mm-wave) radio signals.
15. The distributed antenna array package of claim 9, wherein a maximum difference in length of the plurality of traces is no more than two wavelengths of a signal being carried by the traces.
16. The package of claim 15, wherein the antenna sub-arrays are laid out in a rectangular configuration.
18. The system of claim 17, wherein the radio dies are situated at least partially in a fourth dielectric layer of the package, the first radio die situated within a footprint of a first antenna sub-array of the antenna sub-arrays and electrically coupled to each of the antennas of the first antenna sub-array through first traces of the plurality of traces and the second radio die situated within a footprint of a second antenna sub-array of the antenna sub-arrays and electrically coupled to each of the antennas of the first antenna sub-array through second traces of the plurality of traces.
19. The system of claim 17, wherein each trace of the plurality of traces is configured to transmit millimeter wave (mm-wave) radio.
This invention relates to a system for transmitting millimeter wave (mm-wave) radio signals using a plurality of traces. The system addresses challenges in high-frequency signal transmission, particularly in applications requiring compact, high-bandwidth communication links. The traces are designed to carry mm-wave signals, which operate at frequencies typically between 30 GHz and 300 GHz, enabling high data rates but requiring precise signal integrity and low loss. The system includes a substrate with multiple traces, each optimized for mm-wave transmission. These traces are configured to minimize signal attenuation and distortion, ensuring reliable communication over short distances. The traces may be arranged in a specific layout to reduce interference and crosstalk, which are critical concerns at mm-wave frequencies. The substrate may also incorporate shielding or grounding structures to further improve signal quality. Additionally, the system may include connectors or interfaces for coupling the traces to other components, such as antennas or transceivers, facilitating seamless integration into larger communication systems. The traces may be fabricated using advanced materials or techniques to enhance performance, such as low-loss dielectrics or high-conductivity metals. The overall design ensures efficient mm-wave signal propagation while maintaining compact form factors, making it suitable for applications like 5G networks, radar systems, and high-speed data links.
20. The system of claim 17, further comprising a plurality of male or female connection features configured to couple to female or male connection features on a logic die.
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June 15, 2020
November 22, 2022
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