The subject application discloses a substrate. The substrate includes a first conductive layer, a first bonding layer, a first dielectric layer, and a conductive via. The first bonding layer is disposed on the first conductive layer. The first dielectric layer is disposed on the first bonding layer. The conductive via penetrates the first dielectric layer and is electrically connected with the first conductive layer.
Legal claims defining the scope of protection, as filed with the USPTO.
2. The substrate of claim 1, wherein the first dielectric layer includes a first surface and a second surface opposite to the first surface, the conductive via extends from the first surface to the second surface.
3. The substrate of claim 1, wherein the first bonding layer is configured for a promoter.
4. The substrate of claim 1, wherein the first bonding layer is configured for an adhesive layer.
5. The substrate of claim 1, wherein a thickness of the first bonding layer is in a range from about 50 Ångstrom (Å) to about 100 Å.
6. The substrate of claim 1, wherein a thickness of the first conductive layer is equal to or less than 3 micrometers (μm).
7. The substrate of claim 1, further comprising a carrier on which the first conductive layer is disposed.
8. The substrate of claim 1, wherein the conductive via penetrates the first bonding layer.
14. The substrate of claim 13, wherein the thickness of the conductive layer is equal to or less than 3 μm.
15. The substrate of claim 13, further comprising a conductive via penetrating the dielectric layer to be electrically connected to the conductive layer.
Cooperative Patent Classification codes for this invention. Click any code to explore related patents in that topic.
December 3, 2020
November 29, 2022
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