A light emitting diode, LED, filament arrangement (100), comprising at least one LED filament (120) comprising an array of a plurality of light emitting diodes (140), LEDs. The LED filament comprises a substrate (150) on which the plurality of LEDs is arranged. The substrate surface comprises at least one of a multi-faceted surface structure (160), a lens structure (161), and a grating structure (162) and is configured to at least partially refract, at least partially reflect, and/or at least partially diffract the light emitted from the at least one LED filament during operation.
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2. The LED filament arrangement according to claim 1, wherein the substrate is at least partially translucent or transparent.
The invention relates to LED filament arrangements, specifically addressing the need for improved light emission and aesthetic design in LED lighting. Traditional LED filaments often use opaque substrates, which can limit light diffusion and design flexibility. The invention provides an LED filament arrangement where the substrate is at least partially translucent or transparent. This allows light from the LED chips to pass through the substrate more efficiently, enhancing brightness and uniformity. The translucent or transparent substrate also enables innovative design possibilities, such as integrating decorative elements or patterns within the filament. The LED chips are mounted on the substrate, which may be a thin, elongated structure resembling a traditional incandescent filament. The translucent or transparent nature of the substrate ensures that light emitted from the LED chips is not blocked, resulting in a more even and aesthetically pleasing illumination. This design is particularly useful in applications where both functional lighting and visual appeal are important, such as decorative lamps, chandeliers, or other high-end lighting fixtures. The invention improves upon prior art by optimizing light output and design versatility while maintaining the compact and efficient nature of LED technology.
3. The LED filament arrangement according to claim 1, wherein the substrate is at least partially opaque.
The invention relates to LED filament arrangements, specifically addressing the issue of light distribution and visibility in LED lighting devices. Traditional LED filaments often use transparent substrates, which can lead to uneven light emission or unwanted visibility of internal components. This invention improves upon existing designs by incorporating a substrate that is at least partially opaque. The opaque substrate helps to diffuse light more evenly, reducing hotspots and improving the aesthetic appearance of the LED filament. Additionally, it can mask internal electrical connections or other structural elements, enhancing the overall visual quality of the lighting device. The opaque substrate may be made from materials such as ceramic, glass, or plastic, and can be combined with reflective or diffusive coatings to further optimize light output. This design is particularly useful in applications where uniform illumination and a clean, uncluttered appearance are desired, such as in decorative or high-end lighting fixtures. The invention ensures better light distribution while maintaining the efficiency and longevity of the LED filament.
4. The LED filament arrangement according to claim 1, wherein at least the one first portion of the substrate, on which the plurality of LEDs is arranged, is flat.
The invention relates to LED filament arrangements, specifically addressing the need for improved structural and optical performance in LED filaments. Traditional LED filaments often suffer from uneven light distribution or structural instability due to their design. This invention provides an LED filament with a substrate having at least one flat portion where multiple LEDs are arranged. The flat portion ensures uniform LED placement, enhancing light emission consistency and thermal management. The substrate may also include curved or bent sections to achieve desired aesthetic or functional shapes while maintaining structural integrity. The LEDs are electrically connected in series or parallel, and the substrate may be flexible or rigid, depending on the application. The flat portion allows for precise LED alignment, reducing optical distortions and improving luminous efficiency. This design is particularly useful in lighting applications where both performance and design flexibility are critical, such as in decorative or high-efficiency LED bulbs. The invention ensures reliable electrical connections and thermal dissipation while accommodating various filament shapes.
5. The LED filament arrangement according to claim 3, wherein the encapsulant comprises phosphor.
The invention relates to LED filament arrangements, specifically addressing the need for improved light emission characteristics in LED filaments. Traditional LED filaments often lack sufficient color conversion or uniformity in light output. The invention provides an LED filament arrangement where the encapsulant material surrounding the LED filament includes phosphor. The phosphor converts part of the LED's emitted light into a different wavelength, enabling tunable color properties such as white light or other desired spectral outputs. The encapsulant with phosphor ensures uniform light distribution and efficient color mixing, enhancing the filament's performance. The LED filament itself may be a linear or coiled structure, and the encapsulant is applied in a way that fully or partially encapsulates the filament, depending on the desired optical properties. This design improves light quality and consistency in LED filament-based lighting applications.
6. The LED filament arrangement according to claim 1, wherein the substrate has the shape of a rectangular slab and elongates along a longitudinal first axis, A, wherein the substrate further extends along a second axis, B, being perpendicular to said first axis, A, and further extends along a third axis C, being perpendicular to both said first and second axes, wherein at least one of the surfaces, S1-S6, of the substrate comprises at least one of a multi-faceted surface structure, a lens structure, and/or grating structure.
Light-emitting diode (LED) technology, specifically addressing the physical configuration and optical properties of LED filament arrangements. The invention provides a substrate for an LED filament arrangement that enhances light management and distribution. The substrate is designed in the form of a rectangular slab with defined dimensions along three perpendicular axes: a longitudinal first axis (A), a second axis (B) perpendicular to A, and a third axis (C) perpendicular to both A and B. Crucially, at least one of the surfaces of this rectangular slab substrate is modified to incorporate specific optical features. These features can include a multi-faceted surface structure, a lens structure, or a grating structure. The inclusion of these structures on the substrate surface aims to control, shape, or diffract the light emitted by the LED filaments positioned on or within it, thereby improving the overall luminous performance and application suitability of the LED filament arrangement.
9. The LED filament arrangement according to claim 7, wherein the substrate comprises a respective edge between any pair of adjacently arranged surfaces, S1-S6, wherein at least one of the respective edges comprises at least one multi-faceted surface structure, lens structure, and/or grating structure.
Lighting technology. This invention relates to an LED filament arrangement, specifically addressing the management of light emission from the filament. The arrangement includes a substrate with multiple surfaces, designated S1 through S6. Between each adjacent pair of these surfaces, there exists an edge. The core of this invention lies in modifying these edges. At least one of these edges is characterized by the inclusion of a multi-faceted surface structure, a lens structure, or a grating structure. These specialized edge structures are designed to control and direct the light emitted by the LED filament, potentially improving light distribution, intensity, or pattern.
12. The method of manufacturing a LED filament arrangement according to claim 11, wherein the substrate is at least partially translucent or transparent.
A method for manufacturing a light-emitting diode (LED) filament arrangement involves creating a translucent or transparent substrate to support LED elements. The substrate serves as a base for mounting and electrically connecting multiple LED elements in a linear or curved configuration, forming a filament structure. The translucent or transparent nature of the substrate allows light emitted by the LED elements to pass through, enhancing light distribution and efficiency. The LED elements are arranged in a series or parallel configuration to ensure proper electrical connectivity and uniform light emission. The substrate may be made from materials such as glass, sapphire, or transparent polymers, which provide structural support while maintaining optical transparency. The method includes steps for attaching the LED elements to the substrate, establishing electrical connections between them, and encapsulating the arrangement to protect the components while preserving transparency. This approach improves light extraction and reduces optical losses, making the LED filament suitable for applications requiring high brightness and uniform illumination, such as lighting fixtures and displays.
13. The method of manufacturing a LED filament arrangement according to claim 11, wherein the substrate is at least partially opaque.
A method for manufacturing a light-emitting diode (LED) filament arrangement involves creating a filament structure with a substrate that is at least partially opaque. The substrate serves as a base for mounting multiple LED chips, which are electrically connected in series or parallel to form a filament. The opaque substrate helps control light emission by blocking or reflecting light in certain directions, improving light extraction efficiency and uniformity. The LED chips are mounted on the substrate using conductive bonding materials, and electrical connections are established between the chips to form the filament. The substrate may be flexible or rigid, depending on the application. The method ensures proper alignment and spacing of the LED chips to optimize light output and thermal management. The opaque substrate can be made from materials such as ceramic, metal, or polymer composites, chosen based on thermal conductivity, mechanical strength, and optical properties. This manufacturing approach enhances the performance and reliability of LED filament arrangements in lighting applications.
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March 12, 2020
December 6, 2022
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