A light emitting diode, LED, filament arrangement (100), comprising at least one LED filament (120) comprising an array of a plurality of light emitting diodes (140), LEDs. The LED filament comprises a substrate (150) on which the plurality of LEDs is arranged. The substrate surface comprises at least one of a multi-faceted surface structure (160), a lens structure (161), and a grating structure (162) and is configured to at least partially refract, at least partially reflect, and/or at least partially diffract the light emitted from the at least one LED filament during operation.
Legal claims defining the scope of protection, as filed with the USPTO.
2. The LED filament arrangement according to claim 1, wherein the substrate is at least partially translucent or transparent.
3. The LED filament arrangement according to claim 1, wherein the substrate is at least partially opaque.
4. The LED filament arrangement according to claim 1, wherein at least the one first portion of the substrate, on which the plurality of LEDs is arranged, is flat.
5. The LED filament arrangement according to claim 3, wherein the encapsulant comprises phosphor.
6. The LED filament arrangement according to claim 1, wherein the substrate has the shape of a rectangular slab and elongates along a longitudinal first axis, A, wherein the substrate further extends along a second axis, B, being perpendicular to said first axis, A, and further extends along a third axis C, being perpendicular to both said first and second axes, wherein at least one of the surfaces, S1-S6, of the substrate comprises at least one of a multi-faceted surface structure, a lens structure, and/or grating structure.
9. The LED filament arrangement according to claim 7, wherein the substrate comprises a respective edge between any pair of adjacently arranged surfaces, S1-S6, wherein at least one of the respective edges comprises at least one multi-faceted surface structure, lens structure, and/or grating structure.
12. The method of manufacturing a LED filament arrangement according to claim 11, wherein the substrate is at least partially translucent or transparent.
13. The method of manufacturing a LED filament arrangement according to claim 11, wherein the substrate is at least partially opaque.
Cooperative Patent Classification codes for this invention. Click any code to explore related patents in that topic.
March 12, 2020
December 6, 2022
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