The invention relates to a foil-based package with at least one foil substrate having an electrically conductive layer arranged thereon which is patterned to provide a first electrically conducting portion and a second electrically conducting portion, which is coplanar to the first electrically conducting portion, and a third electrically conducting portion, which is coplanar to the first electrically conducting portion, the first electrically conducting portion being arranged between the second and third electrically conducting portions. In accordance with the invention, the first electrically conducting portion is implemented to be a signal-guiding waveguide for high-frequency signals and the second electrically conducting portion, which is coplanar to the first electrically conducting portion, and the third electrically conducting portion, which is coplanar to the first electrically conducting portion, form an equipotential surface.
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3. The foil-based package in accordance with claim 1, wherein the first electrically conducting portion is at a first electrical potential, and wherein the second electrically conducting portion and the third electrically conducting portion are at a common second electrical potential which differs from the first electrical potential.
This invention relates to foil-based packaging with integrated electrical functionality, specifically addressing the need for controlled electrical potential distribution within a package structure. The package includes a first electrically conducting portion, a second electrically conducting portion, and a third electrically conducting portion. The first portion operates at a distinct first electrical potential, while the second and third portions share a common second electrical potential, which differs from the first. This configuration enables differential electrical signaling or power distribution within the package, facilitating applications such as shielding, signal routing, or power management in electronic devices. The foil-based construction ensures flexibility, lightweight design, and compatibility with various packaging formats, including flexible or rigid structures. The invention may be used in applications requiring isolated or differential electrical pathways, such as in consumer electronics, medical devices, or industrial packaging, where precise electrical control is essential. The design avoids short circuits or unintended electrical interactions by maintaining distinct potential levels between the first portion and the shared potential of the second and third portions.
5. The foil-based package in accordance with claim 1, wherein the first electrically conducting portion is electrically insulated from each of the second electrically conducting portion and the third electrically conducting portion.
A foil-based package is designed for use in electronic devices, particularly for shielding and grounding purposes. The package includes multiple electrically conducting portions that are arranged to provide specific electrical connections while maintaining insulation between certain components. The first electrically conducting portion is electrically insulated from both the second and third electrically conducting portions, ensuring that electrical signals or currents do not pass between them. This insulation prevents interference and ensures proper functioning of the electronic components housed within the package. The package may also include additional features such as grounding connections or conductive pathways to facilitate electrical grounding or signal routing. The design is particularly useful in applications where precise control of electrical connections is required, such as in high-frequency or sensitive electronic circuits. The insulation between the conducting portions helps maintain signal integrity and reduces the risk of short circuits or unintended electrical interactions. The package may be constructed using flexible or rigid materials, depending on the specific application requirements.
6. The foil-based package in accordance with claim 1, wherein the signal carrying first electrically conducting portion is dimensioned such that the result is wave impedance matching for high-frequency signals in the range of 500 MHz or more.
A foil-based package is designed to address the challenge of signal integrity in high-frequency electronic applications, particularly for signals in the range of 500 MHz or higher. The package includes a first electrically conducting portion that carries signals, and this portion is specifically dimensioned to achieve wave impedance matching for high-frequency signals. Impedance matching is critical in high-frequency circuits to minimize signal reflections, reduce power loss, and ensure efficient signal transmission. The conducting portion is structured to maintain consistent impedance characteristics, preventing signal degradation and ensuring reliable performance in high-speed data transmission or communication systems. The package may also include additional components, such as a second electrically conducting portion and an insulating layer, to further enhance signal integrity and structural stability. The overall design ensures compatibility with high-frequency applications while maintaining mechanical robustness and electrical performance. This solution is particularly relevant in industries requiring precise signal handling, such as telecommunications, computing, and high-speed data processing.
7. The foil-based package in accordance with claim 1, wherein a barrier coating for protection against humidity or electromagnetic radiation is arranged on a side of the foil substrate facing away from the electronic device.
A foil-based package is designed to protect electronic devices from environmental factors such as humidity and electromagnetic radiation. The package includes a foil substrate that encases the electronic device, providing structural support and insulation. A barrier coating is applied to the outer surface of the foil substrate, opposite the side facing the electronic device. This coating enhances protection by preventing moisture ingress and shielding against electromagnetic interference. The barrier coating may consist of materials such as metal layers, polymer films, or specialized coatings that block specific wavelengths of radiation. The foil substrate itself may be flexible or rigid, depending on the application, and can be tailored to the size and shape of the electronic device. The package ensures reliable performance of the electronic device by maintaining a controlled environment and minimizing external disruptions. This design is particularly useful in applications where electronic devices are exposed to harsh conditions, such as in outdoor electronics, medical devices, or industrial equipment. The barrier coating can be customized based on the specific protection requirements, ensuring optimal performance and longevity of the enclosed electronic device.
8. The foil-based package in accordance with claim 1, wherein an electrically conductive coating is arranged on a side of the foil substrate facing away from the electronic device, said electrically conductive coating providing a ground equipotential surface.
This invention relates to foil-based packaging for electronic devices, addressing the need for effective electromagnetic shielding and grounding. The package includes a foil substrate that encapsulates an electronic device, providing structural support and protection. A key feature is an electrically conductive coating applied to the outer surface of the foil substrate, opposite the electronic device. This coating forms a ground equipotential surface, ensuring uniform electrical potential across the package. The conductive coating enhances electromagnetic interference (EMI) shielding by redirecting stray electrical currents to ground, preventing interference with the electronic device or external systems. The foil substrate itself may be flexible or rigid, depending on the application, and can be made from materials like aluminum, copper, or other conductive foils. The conductive coating can be applied using techniques such as sputtering, electroplating, or lamination, ensuring strong adhesion and durability. This design is particularly useful in sensitive electronic environments where grounding and shielding are critical, such as in aerospace, medical devices, or high-frequency communication systems. The invention improves upon traditional packaging by integrating the ground plane directly into the foil structure, reducing the need for additional grounding components and simplifying assembly.
9. The foil-based package in accordance with claim 8, wherein the electrically conductive coating is connected to at least one grounded portion of the electrically conductive layer either capacitively or electrically through the foil substrate by means of a through contacting.
A foil-based package is designed to provide electromagnetic shielding for electronic components. The package includes a foil substrate with an electrically conductive layer and an electrically conductive coating. The conductive coating is connected to at least one grounded portion of the conductive layer either capacitively or through direct electrical contact via a through-hole connection in the foil substrate. This ensures effective shielding by maintaining a continuous conductive path, preventing electromagnetic interference (EMI) from affecting the enclosed components. The through-hole connection may be achieved by drilling or etching holes in the substrate and filling them with conductive material to establish the connection. The capacitive coupling method allows for indirect grounding without direct physical contact, which can be useful in applications where physical connections are impractical. The package is particularly useful in environments where sensitive electronics require protection from external electromagnetic fields or where internal components generate EMI that must be contained. The design ensures reliable shielding performance while maintaining structural integrity and manufacturability.
10. The foil-based package in accordance with claim 1, wherein the first package terminal pad comprises a terminal area facing away from the foil substrate, the first package terminal pad extending from the electrically conductive layer, in a direction perpendicular to the foil plane, across a structural height of the electronic device, the result being a difference in height ΔH between the electronic device and the terminal area of the first package terminal pad, and wherein the casting compound is arranged between the electronic device and the terminal area of the first package terminal pad.
A foil-based package is designed to address challenges in integrating electronic devices with flexible or rigid substrates while ensuring reliable electrical connections and structural stability. The package includes a foil substrate with an electrically conductive layer, an electronic device mounted on the foil, and a casting compound encapsulating the device. A key feature is the first package terminal pad, which extends from the conductive layer perpendicular to the foil plane, spanning the entire structural height of the electronic device. This creates a height difference ΔH between the device and the terminal pad's exposed terminal area, which faces away from the foil. The casting compound fills the gap between the electronic device and the terminal area, providing mechanical support and electrical insulation. This design ensures robust connections while accommodating variations in device thickness and substrate flexibility. The terminal pad's extended structure allows for direct bonding to external components, improving signal integrity and reducing parasitic effects. The casting compound also protects the device from environmental factors, enhancing reliability in diverse applications.
11. The foil-based package in accordance with claim 1, wherein the electronic device comprises a sensor portion configured to provide a sensor functionality based on contacting to a medium present in the environment, wherein the opening exposes at least the sensor portion so that the sensor portion can be brought into contact with the medium present in the environment through this opening.
This invention relates to a foil-based package for an electronic device, specifically addressing the need to protect the device while allowing interaction with external media. The package is designed to house an electronic device that includes a sensor portion capable of detecting or measuring properties of a surrounding medium, such as liquids, gases, or other environmental conditions. The package features an opening that exposes at least the sensor portion, enabling direct contact between the sensor and the external medium without compromising the protection of the remaining device components. The package structure ensures that the sensor remains functional while the rest of the device is shielded from environmental factors like moisture, contaminants, or physical damage. This design is particularly useful in applications where the electronic device must interact with external substances while maintaining durability and reliability. The foil-based construction provides flexibility and lightweight properties, making it suitable for various portable or disposable electronic applications. The opening is strategically placed to ensure optimal sensor performance while minimizing exposure of other sensitive components.
12. The foil-based package in accordance with claim 1, wherein the opening is arranged on a side of the foil-based package opposite the package terminal side.
A foil-based package is designed for storing and dispensing flexible, sheet-like materials such as adhesive tapes, labels, or other thin, flexible products. The package includes a housing formed from a flexible foil material, which is sealed to contain the product inside. The package has a package terminal side, which is typically the side where the product is accessed or dispensed. The invention improves upon existing foil-based packages by positioning the opening on the side opposite the package terminal side. This arrangement allows for easier handling and dispensing of the product, as the opening is located away from the area where the product is extracted. The foil-based package may also include additional features such as a reclosable seal, a tear notch, or a dispensing mechanism to enhance usability. The flexible foil material provides durability and protection for the enclosed product while maintaining a lightweight and compact design. This configuration is particularly useful in applications where the product must be accessed from a specific orientation or where space constraints require a compact design. The invention addresses the need for improved ergonomics and functionality in foil-based packaging for flexible materials.
13. The foil-based package in accordance with claim 1, the foil-based package being flexible so that the foil-based package is bendable with no destruction caused and, in particular, with no damage to the electronic device, wherein a bending radius RB is greater than a thickness of the foil-based package by at least 100 times.
A flexible foil-based package is designed to protect an electronic device during bending without causing damage. The package is constructed to allow bending with a radius (RB) that is at least 100 times greater than its own thickness, ensuring structural integrity and preventing harm to the enclosed electronic device. The flexibility of the package enables it to conform to various shapes while maintaining protection, making it suitable for applications where the electronic device may experience repeated or dynamic bending. The package's design ensures that the bending radius is sufficiently large to avoid stress concentrations that could lead to failure or damage to the electronic device inside. This flexibility is achieved through material selection and structural design, allowing the package to withstand bending forces without compromising its protective function. The package may include additional features, such as sealing mechanisms or conductive layers, to enhance its functionality while maintaining flexibility. The overall design ensures that the electronic device remains protected even when the package is subjected to bending motions.
14. The foil-based package in accordance with claim 1, wherein the foil-based package is implemented as a Quad Flat No Leads (QFN) package or as a Surface Mount Device (SMD) package.
This invention relates to foil-based semiconductor packages, specifically addressing the need for improved packaging solutions that enhance thermal performance and electrical connectivity in integrated circuits. The foil-based package serves as a substrate for mounting semiconductor dies, providing mechanical support, electrical connections, and heat dissipation. The package includes a foil layer with conductive traces and a dielectric layer for insulation, ensuring reliable electrical isolation while maintaining thermal conductivity. The foil-based design allows for efficient heat transfer from the semiconductor die to the surrounding environment, reducing thermal resistance and improving overall device performance. The package is configured to accommodate various semiconductor die types, including power management integrated circuits (PMICs) and other high-power devices, by providing a robust and thermally conductive interface. The foil layer may be made from materials such as copper or aluminum, chosen for their high thermal conductivity and mechanical strength. The dielectric layer, typically composed of a polymer or ceramic material, ensures electrical isolation between conductive traces while maintaining structural integrity. The package is designed to be compatible with standard surface-mount assembly processes, allowing for easy integration into electronic devices. The foil-based structure enables efficient heat spreading, reducing hot spots and improving reliability in high-power applications. Additionally, the package may include features such as solderable pads or leads for electrical connections, ensuring compatibility with automated assembly lines. The invention provides a cost-effective and scalable solution for high-performance semiconductor packaging,
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February 27, 2020
December 6, 2022
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