The invention relates to a foil-based package with at least one foil substrate having an electrically conductive layer arranged thereon which is patterned to provide a first electrically conducting portion and a second electrically conducting portion, which is coplanar to the first electrically conducting portion, and a third electrically conducting portion, which is coplanar to the first electrically conducting portion, the first electrically conducting portion being arranged between the second and third electrically conducting portions. In accordance with the invention, the first electrically conducting portion is implemented to be a signal-guiding waveguide for high-frequency signals and the second electrically conducting portion, which is coplanar to the first electrically conducting portion, and the third electrically conducting portion, which is coplanar to the first electrically conducting portion, form an equipotential surface.
Legal claims defining the scope of protection, as filed with the USPTO.
3. The foil-based package in accordance with claim 1, wherein the first electrically conducting portion is at a first electrical potential, and wherein the second electrically conducting portion and the third electrically conducting portion are at a common second electrical potential which differs from the first electrical potential.
5. The foil-based package in accordance with claim 1, wherein the first electrically conducting portion is electrically insulated from each of the second electrically conducting portion and the third electrically conducting portion.
6. The foil-based package in accordance with claim 1, wherein the signal carrying first electrically conducting portion is dimensioned such that the result is wave impedance matching for high-frequency signals in the range of 500 MHz or more.
7. The foil-based package in accordance with claim 1, wherein a barrier coating for protection against humidity or electromagnetic radiation is arranged on a side of the foil substrate facing away from the electronic device.
8. The foil-based package in accordance with claim 1, wherein an electrically conductive coating is arranged on a side of the foil substrate facing away from the electronic device, said electrically conductive coating providing a ground equipotential surface.
9. The foil-based package in accordance with claim 8, wherein the electrically conductive coating is connected to at least one grounded portion of the electrically conductive layer either capacitively or electrically through the foil substrate by means of a through contacting.
10. The foil-based package in accordance with claim 1, wherein the first package terminal pad comprises a terminal area facing away from the foil substrate, the first package terminal pad extending from the electrically conductive layer, in a direction perpendicular to the foil plane, across a structural height of the electronic device, the result being a difference in height ΔH between the electronic device and the terminal area of the first package terminal pad, and wherein the casting compound is arranged between the electronic device and the terminal area of the first package terminal pad.
11. The foil-based package in accordance with claim 1, wherein the electronic device comprises a sensor portion configured to provide a sensor functionality based on contacting to a medium present in the environment, wherein the opening exposes at least the sensor portion so that the sensor portion can be brought into contact with the medium present in the environment through this opening.
12. The foil-based package in accordance with claim 1, wherein the opening is arranged on a side of the foil-based package opposite the package terminal side.
13. The foil-based package in accordance with claim 1, the foil-based package being flexible so that the foil-based package is bendable with no destruction caused and, in particular, with no damage to the electronic device, wherein a bending radius RB is greater than a thickness of the foil-based package by at least 100 times.
14. The foil-based package in accordance with claim 1, wherein the foil-based package is implemented as a Quad Flat No Leads (QFN) package or as a Surface Mount Device (SMD) package.
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February 27, 2020
December 6, 2022
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