Disclosed herein are integrated circuit (IC) package supports and related apparatuses and methods. For example, in some embodiments, an IC package support may include a layer of dielectric material; a conductive pad at least partially on a top surface of the layer of dielectric material; and a layer of material on side surfaces of the conductive pad, wherein the layer of material does not extend onto the top surface of the layer of dielectric material. Other embodiments are also disclosed.
Legal claims defining the scope of protection. Each claim is shown in both the original legal language and a plain English translation.
2. The IC package support of claim 1, wherein the material includes nitrogen or a polymer.
The invention relates to an integrated circuit (IC) package support designed to enhance thermal management and structural integrity in electronic devices. The support structure is engineered to address challenges such as heat dissipation and mechanical stability, which are critical for high-performance IC packages. The material composition of the support includes nitrogen or a polymer, which provides improved thermal conductivity and mechanical strength. Nitrogen, when incorporated, enhances thermal dissipation by increasing the material's ability to conduct heat away from the IC package. Alternatively, a polymer-based material offers flexibility and durability, ensuring the support can withstand mechanical stresses while maintaining structural integrity. The support is positioned to interface with the IC package, providing a stable foundation that mitigates thermal expansion and mechanical deformation. This design is particularly useful in applications where thermal management and reliability are paramount, such as in high-power computing and telecommunications. The inclusion of nitrogen or polymer materials optimizes the support's performance, ensuring efficient heat transfer and long-term durability.
3. The IC package support of claim 1, wherein the conductive pad includes copper.
The invention relates to integrated circuit (IC) package supports, specifically addressing the need for improved electrical and thermal conductivity in IC packaging. Traditional IC package supports often suffer from inadequate conductivity, leading to inefficiencies in signal transmission and heat dissipation. The invention introduces an IC package support featuring a conductive pad that enhances these properties. The conductive pad is designed to interface with an IC package, providing a reliable connection for electrical signals and heat transfer. A key aspect of the invention is the use of copper in the conductive pad, which offers superior electrical and thermal conductivity compared to conventional materials. Copper's high conductivity ensures efficient signal transmission while effectively dissipating heat generated by the IC, thereby improving overall performance and reliability. The conductive pad may also include additional layers or coatings to enhance durability and corrosion resistance. The IC package support is structured to securely hold the IC package while maintaining optimal contact with the conductive pad, ensuring consistent performance. This design is particularly useful in high-performance computing and power electronics, where thermal management and signal integrity are critical. The invention provides a robust solution for improving the efficiency and longevity of IC packages in demanding applications.
4. The IC package support of claim 1, wherein the layer of material does not extend onto a top surface of the conductive pad.
The invention relates to integrated circuit (IC) package supports designed to improve electrical and thermal performance. The problem addressed is the need for reliable electrical connections and efficient heat dissipation in IC packages, particularly where conductive pads are involved. The invention provides an IC package support structure with a layer of material that enhances these properties. This layer is strategically placed to avoid interfering with the top surface of the conductive pad, ensuring proper electrical contact while managing heat. The support structure may include a base layer that provides mechanical stability and a conductive layer that facilitates electrical connectivity. The material layer is positioned to cover portions of the support structure without extending onto the conductive pad's top surface, preventing short circuits or signal interference. This design allows for precise alignment of electrical connections while maintaining thermal conductivity. The invention is particularly useful in high-performance IC packages where both electrical and thermal management are critical. The support structure may also include additional features, such as alignment markers or thermal vias, to further enhance functionality. The overall design ensures robust performance in demanding electronic applications.
5. The IC package support of claim 1, wherein the layer of material is a first layer of nitride material, the IC package support further includes a second layer of nitride material on the first layer of nitride material on the side surfaces of the conductive pad, and the second layer of nitride material extends onto side surfaces of the conductive via.
This invention relates to integrated circuit (IC) package supports, specifically addressing the challenge of protecting conductive structures during semiconductor packaging processes. The invention provides an IC package support with a multi-layer nitride material configuration to enhance structural integrity and reliability. The IC package support includes a conductive pad and a conductive via, both of which are critical for electrical connectivity in IC packages. To prevent damage and ensure proper functionality, the invention incorporates a first layer of nitride material applied to the side surfaces of the conductive pad. This layer provides a protective barrier against environmental and mechanical stresses. Additionally, a second layer of nitride material is deposited on top of the first layer, extending not only over the side surfaces of the conductive pad but also onto the side surfaces of the conductive via. This dual-layer nitride structure enhances protection by reinforcing the interface between the conductive pad and the conductive via, reducing the risk of delamination or electrical failure during manufacturing and operation. The nitride layers are strategically placed to shield the conductive structures from potential contaminants, thermal stress, and mechanical wear, thereby improving the overall robustness and longevity of the IC package. This design is particularly useful in advanced semiconductor packaging where reliability under harsh conditions is critical.
6. The IC package support of claim 1, wherein the IC package support is a package substrate or an interposer.
The invention relates to integrated circuit (IC) package supports, specifically package substrates or interposers, designed to enhance thermal management and structural integrity in electronic devices. Traditional IC packages often suffer from inadequate heat dissipation and mechanical stress, leading to reduced performance and reliability. This invention addresses these issues by incorporating a support structure that improves thermal conductivity and mechanical stability. The IC package support, which can be either a package substrate or an interposer, is engineered to provide a robust foundation for IC components. The support structure is optimized to distribute heat efficiently, preventing localized overheating and ensuring consistent thermal performance. Additionally, it enhances mechanical strength, reducing the risk of warping or failure under stress. The design may include features such as thermal vias, heat spreaders, or reinforced materials to achieve these improvements. By integrating these enhancements, the IC package support ensures better thermal management and mechanical durability, extending the lifespan and reliability of electronic devices. This solution is particularly beneficial in high-performance applications where thermal and mechanical stability are critical. The invention provides a scalable and adaptable approach to improving IC package performance, making it suitable for various electronic systems.
7. The IC package support of claim 5, wherein the second layer of nitride material extends onto the top surface of the layer of dielectric material.
The invention relates to integrated circuit (IC) packaging, specifically addressing challenges in thermal management and structural integrity during semiconductor packaging processes. Traditional IC packages often suffer from thermal stress and delamination issues due to mismatched coefficients of thermal expansion (CTE) between different materials. This invention improves upon prior IC package supports by incorporating a second layer of nitride material that extends onto the top surface of a dielectric layer, enhancing adhesion and thermal conductivity. The IC package support includes a substrate with a first layer of nitride material deposited on its surface. A dielectric layer is formed over the first nitride layer, providing electrical insulation. A second nitride layer is then deposited, extending onto the top surface of the dielectric layer. This extension improves mechanical stability by bridging the interface between the nitride and dielectric layers, reducing the risk of delamination. The second nitride layer also aids in heat dissipation, preventing thermal stress buildup during high-temperature processes. The invention ensures reliable performance in advanced semiconductor packaging, particularly for high-power or high-frequency applications where thermal management is critical.
9. The computing device of claim 8, wherein the IC package includes one or more dies coupled to the IC package support.
The invention relates to computing devices with integrated circuit (IC) packages, addressing challenges in packaging and interconnecting multiple dies within a computing system. The IC package includes one or more dies that are physically and electrically coupled to an IC package support structure. This support structure provides mechanical stability and facilitates electrical connections between the dies and the computing device. The dies may include processors, memory chips, or other semiconductor components, and their integration into the IC package enhances performance, reduces footprint, and improves thermal management. The support structure may incorporate conductive pathways, such as traces or vias, to enable communication between the dies and external components. The design ensures efficient signal transmission and power distribution while maintaining structural integrity. This approach is particularly useful in high-performance computing applications where multiple dies must be tightly integrated to achieve desired functionality and reliability. The invention focuses on optimizing the physical and electrical integration of dies within an IC package to support advanced computing systems.
11. The computing device of claim 8, wherein the computing device is a server device or a handheld computing device.
A computing device is configured to process and analyze data from multiple sources, including sensors, user inputs, and networked devices. The device includes a processing unit that executes instructions to collect, filter, and correlate data in real time. It also includes a memory unit that stores the processed data and a communication interface that transmits the data to other devices or systems. The device is designed to operate in environments where data accuracy and processing speed are critical, such as industrial automation, healthcare monitoring, or smart home systems. The device may be implemented as a server device for centralized data processing or as a handheld computing device for portable, on-site data analysis. The system ensures efficient data handling by dynamically adjusting processing parameters based on input data characteristics, reducing latency and improving reliability. The device may also include security features to protect data integrity and privacy during transmission and storage.
13. The IC package support of claim 12, wherein the conductive via has tapered side surfaces with an angle that is less than 80 degrees.
The invention relates to integrated circuit (IC) package supports designed to improve electrical and thermal performance. The support structure includes a conductive via that provides electrical connectivity between different layers or components within the package. A key feature of this design is the tapered side surfaces of the conductive via, which are angled at less than 80 degrees. This tapering enhances manufacturing reliability by reducing stress concentrations and improving adhesion between the via and surrounding materials. The tapered geometry also facilitates better heat dissipation and electrical signal transmission, addressing challenges in high-performance IC packaging where thermal management and signal integrity are critical. The support structure may be integrated into various IC package configurations, including those with multiple layers or complex interconnects, to ensure robust electrical and mechanical performance. The invention aims to optimize the structural and functional properties of conductive vias in IC packaging, particularly in applications requiring high reliability and efficiency.
14. The IC package support of claim 12, wherein the conductive via has tapered side surfaces with an angle that is greater than 80 degrees.
The invention relates to integrated circuit (IC) package supports, specifically addressing the challenge of improving electrical and thermal conductivity in IC packages. The support structure includes a conductive via with tapered side surfaces, where the taper angle is greater than 80 degrees. This design enhances the via's ability to conduct electricity and dissipate heat, addressing issues of signal integrity and thermal management in high-performance IC packages. The tapered via geometry optimizes contact area and reduces resistance, improving overall performance. The support structure may also include a substrate with a cavity for housing the IC, and the conductive via extends through the substrate to connect the IC to external circuitry. The tapered via design ensures reliable electrical connections while minimizing thermal resistance, making it suitable for advanced packaging applications. The invention focuses on improving the efficiency and reliability of IC packages by optimizing the conductive via's geometry.
15. The IC package support of claim 12, wherein the IC package support is a package substrate.
The invention relates to integrated circuit (IC) package supports, specifically a package substrate designed to enhance thermal management and structural integrity in electronic devices. Traditional IC packages often suffer from inadequate heat dissipation and mechanical stress, leading to reduced performance and reliability. This invention addresses these issues by incorporating a package substrate with optimized thermal and mechanical properties. The package substrate is engineered to provide a stable platform for mounting ICs while efficiently dissipating heat generated during operation. It includes features such as embedded thermal vias or conductive layers to improve heat transfer from the IC to the substrate and, subsequently, to external heat sinks or cooling systems. Additionally, the substrate may incorporate reinforced materials or structural elements to enhance mechanical stability, reducing the risk of warpage or failure under thermal cycling or mechanical stress. The substrate may also include electrical interconnects, such as conductive traces or pads, to facilitate signal and power distribution within the IC package. These interconnects are designed to minimize signal loss and interference while maintaining high electrical performance. The overall design ensures compatibility with various IC packaging technologies, including flip-chip, wire-bond, or fan-out wafer-level packaging. By integrating thermal management and structural reinforcement into the package substrate, this invention improves the reliability and longevity of IC packages, making it suitable for high-performance computing, telecommunications, and other demanding applications.
16. The IC package support of claim 12, wherein the IC package support is an interposer.
The invention relates to integrated circuit (IC) package supports, specifically an interposer structure designed to address challenges in high-density interconnects and thermal management in advanced semiconductor packaging. The interposer serves as an intermediate layer between an IC die and a substrate, facilitating electrical connections while improving signal integrity and thermal dissipation. The interposer includes a substrate with embedded conductive pathways, such as through-silicon vias (TSVs) or redistribution layers (RDLs), to route signals between the die and the substrate. It may also incorporate passive components like capacitors or resistors to enhance performance. The interposer is engineered to support high-bandwidth communication, reduce signal loss, and manage heat generated by the IC die. Additionally, the interposer may feature mechanical reinforcement to prevent warping or cracking during manufacturing or operation. The design optimizes space utilization, enabling smaller form factors in electronic devices while maintaining reliability. This solution is particularly useful in applications requiring high-performance computing, such as data centers, AI accelerators, and high-speed communication systems.
Cooperative Patent Classification codes for this invention. Click any code to explore related patents in that topic.
May 24, 2018
December 6, 2022
Browse 5M+ US patents with plain-English claim translations and AI-generated analysis.