Disclosed herein are integrated circuit (IC) package supports and related apparatuses and methods. For example, in some embodiments, an IC package support may include a layer of dielectric material; a conductive pad at least partially on a top surface of the layer of dielectric material; and a layer of material on side surfaces of the conductive pad, wherein the layer of material does not extend onto the top surface of the layer of dielectric material. Other embodiments are also disclosed.
Legal claims defining the scope of protection, as filed with the USPTO.
2. The IC package support of claim 1, wherein the material includes nitrogen or a polymer.
3. The IC package support of claim 1, wherein the conductive pad includes copper.
4. The IC package support of claim 1, wherein the layer of material does not extend onto a top surface of the conductive pad.
5. The IC package support of claim 1, wherein the layer of material is a first layer of nitride material, the IC package support further includes a second layer of nitride material on the first layer of nitride material on the side surfaces of the conductive pad, and the second layer of nitride material extends onto side surfaces of the conductive via.
6. The IC package support of claim 1, wherein the IC package support is a package substrate or an interposer.
7. The IC package support of claim 5, wherein the second layer of nitride material extends onto the top surface of the layer of dielectric material.
9. The computing device of claim 8, wherein the IC package includes one or more dies coupled to the IC package support.
11. The computing device of claim 8, wherein the computing device is a server device or a handheld computing device.
13. The IC package support of claim 12, wherein the conductive via has tapered side surfaces with an angle that is less than 80 degrees.
14. The IC package support of claim 12, wherein the conductive via has tapered side surfaces with an angle that is greater than 80 degrees.
15. The IC package support of claim 12, wherein the IC package support is a package substrate.
16. The IC package support of claim 12, wherein the IC package support is an interposer.
Cooperative Patent Classification codes for this invention. Click any code to explore related patents in that topic.
May 24, 2018
December 6, 2022
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